Novel Integration of Metal–Insulator–Metal (MIM) Capacitors Comprising Perovskite-type Dielectric and Cu Bottom Electrode on Low-Temperature Packaging Substrates
2008 ◽
Vol 29
(1)
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pp. 31-33
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Keyword(s):
2018 ◽
2014 ◽
Vol 27
(4)
◽
pp. 621-630
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Keyword(s):