Novel Aluminum Segregation at NiSi/ ${p}^{+}$-Si Source/Drain Contact for Drive Current Enhancement in $P$-Channel FinFETs

2009 ◽  
Vol 30 (1) ◽  
pp. 85-87 ◽  
Author(s):  
M. Sinha ◽  
M. Sinha ◽  
R.T.P. Lee ◽  
Kian-Ming Tan ◽  
Guo-Qiang Lo ◽  
...  
Keyword(s):  
2020 ◽  
Vol 140 (4) ◽  
pp. 92-96
Author(s):  
Yuto Goda ◽  
Hiroto Shobu ◽  
Kenji Sakai ◽  
Toshihiko Kiwa ◽  
Kenji Kondo ◽  
...  

Mechatronics ◽  
2020 ◽  
Vol 71 ◽  
pp. 102420
Author(s):  
David Brunner ◽  
Han Woong Yoo ◽  
Georg Schitter

Author(s):  
B. Yang ◽  
K. Nummy ◽  
A. Waite ◽  
L. Black ◽  
H. Gossmann ◽  
...  

2013 ◽  
Vol 49 (6) ◽  
pp. 2483-2488 ◽  
Author(s):  
Chao Bi ◽  
Nay Lin Htun Aung ◽  
Cheng Su Soh ◽  
Quan Jiang ◽  
Hla Nu Phyu ◽  
...  
Keyword(s):  

Nano Letters ◽  
2021 ◽  
Vol 21 (4) ◽  
pp. 1758-1764
Author(s):  
Zhaowu Tang ◽  
Chunsen Liu ◽  
Xiaohe Huang ◽  
Senfeng Zeng ◽  
Liwei Liu ◽  
...  

2011 ◽  
Vol 399-401 ◽  
pp. 1034-1038
Author(s):  
Rong Rong Zhuang ◽  
Ping Cai ◽  
Jiang Li Huang

The junction temperature of GaN-based high-power green light emitting diodes is measured using the temperature coefficients of the diode forward voltage, from changes in temperature and changes in drive current to measure the LED junction temperature and the corresponding spectral, Respectively. Experiments show that, junction temperature due to environmental temperature increased, and the red shift of the spectral peak wavelength. When low temperature or less then the rated current range, the drive current increased in junction temperature rise due to the spectral peak wavelength blue shift . When the current is increased in the range of close to or greater than the rated current, leading to the junction temperature rise will cause spectral red shift . The peak wavelengths’ shift degree of 0.0579nm / k, 0.0751 nm / k and-0.1974nm / k, -0.0915 nm / k are calculated in both cases. The phenomenon is due to the LED junction temperature increases lead to band gap shrinkage, and the result of the role of spontaneous polarization and piezoelectric polarization in Ⅲ-nitride semiconductor materials.


Author(s):  
Ameer F. Roslan ◽  
F. Salehuddin ◽  
A.S. M.Zain ◽  
K.E. Kaharudin ◽  
H. Hazura ◽  
...  

<p>This paper presents an investigation on properties of Double Gate FinFET (DGFinFET) and impact of physical properties of FinFET towards short channel effects (SCEs) for 30 nm device, where depletion-layer widths of the source-drain corresponds to the channel length aside from constant fin height (HFIN) and the fin thickness (TFIN). Virtual fabrication process of 3-dimensional (3D) design is applied throughout the study and its electrical characterization is employed and substantial is shown towards the FinFET design whereby in terms of the ratio of drive current against the leakage current (ION/IOFF ratio) at 563138.35 compared to prediction made by the International Technology Roadmap Semiconductor (ITRS) 2013. Conclusively, the incremental in ratio has fulfilled the desired in incremental on the drive current as well as reductions of the leakage current. Threshold voltage (VTH) meanwhile has also achieved the nominal requirement predicted by the International Technology Roadmap Semiconductor (ITRS) 2013 for which is at 0.676±12.7% V. The ION , IOFF and VTH obtained from the device has proved to meet the minimum requirement by ITRS 2013 for low performance Multi-Gate technology.</p>


Author(s):  
Heng-Sheng Huang ◽  
Ping-Ray Huang ◽  
Mu-Chun Wang ◽  
Shuang-Yuan Chen ◽  
Shea-Jue Wang ◽  
...  

A novel drive current model covering the effects of source/drain voltage (VDS) and gate voltage (VGS) and incorporating drift and diffusion current on the surface channel at the nano-node level, especially beyond 28nm node is presented. The effect of the diffusion current added is more satisfactory to describe the behavior of the drive current in nano-node MOSFETs, fabricated with the atomic-layer-deposition (ALD) technology. This breakthrough in model establishment can expose the long and short channel devices together. Introducing the variables of VDS and VGS, the mixed current model more effectively and meaningfully demonstrates the drive current of MOSFETs under the operation of horizontal, vertical, or mixed electrical field. In comparison between the simulation and experimental consequences, the electrical performance is impressive. The error between both is less than 1%, better than the empirical adjustment to issue a set of drive current models.


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