Subsurface Imaging of Integrated Circuits with Widefield and Confocal Microscopy Using Numerical Aperture Increasing Lens

2007 ◽  
Author(s):  
F. Hakan Koklu ◽  
A. N. Vamivakas ◽  
J. I. Quesnel ◽  
S. B. Ippolito ◽  
B. B. Goldberg ◽  
...  
Keyword(s):  
Confocal Microscopy ◽  
Integrated Circuits ◽  
Numerical Aperture ◽  
Subsurface Imaging

Imaging Performance of aSIL Microscopy on Subsurface Imaging of SOI Chips

2014 ◽  
Author(s):  
Aydan Uyar ◽  
Abdulkadir Yurt ◽  
T. Berkin Cilingiroglu ◽  
Bennett B. Goldberg ◽  
M. Selim Ünlü
Keyword(s):  
Integrated Circuits ◽  
Collection Efficiency ◽  
Numerical Aperture ◽  
Spot Size ◽  
Silicon On Insulator ◽  
Subsurface Imaging ◽  
Bulk Silicon ◽  
Fully Depleted ◽  
Optical Inspection ◽  
Imaging Performance

Abstract The demand for high resolution has raised interest for the use of aplanatic solid immersion lenses (aSIL) for backside optical inspection and failure analysis of integrated circuits due to its high numerical aperture capability. This work investigates the performance of aSIL microscopy in imaging of fully depleted silicon on insulator (SOI) chips and explores the effect of the buried oxide (BOx) thickness on the spatial resolution and photon collection efficiency. Three different cases, namely, bulk silicon, SOI with an ultrathin BOx of 10 nm, and SOI with a standard BOx thickness of 145 nm, are studied. It is observed that there is a 15% drop in the collection efficiency for ultra-thin BOx compared to bulk silicon and up to 80% decrease in the collection efficiency and 30% increase in the spot-size for standard Box.

scholarly journals Luminescence confocal microscopy of 3D components of photonic integrated circuits fabricated by two-photon photopolymerization

2021 ◽  
pp. 100413
Author(s):  
Rilond Pattia Matital ◽  
Danila Anatolievich Kolymagin ◽  
Dmitriy Anatolievich Chubich ◽  
Denis Dmitrievich Merkushev ◽  
Alexei Grigorievich Vitukhnovsky
Keyword(s):  
Confocal Microscopy ◽  
Integrated Circuits ◽  
Photonic Integrated Circuits ◽  
Two Photon

Laser-feedback microscopy: Fundamental principles and application to high-resolution biological imaging

1993 ◽  
Vol 51 ◽  
pp. 84-85
Author(s):  
Alan Bearden ◽  
Terrence L. Wong ◽  
Morgan W. Mitchell ◽  
Leslie C. Osborne ◽  
Michael P. O’Neill
Keyword(s):  
Confocal Microscopy ◽  
Near Field ◽  
Numerical Aperture ◽  
Optical Microscope ◽  
Lateral Resolution ◽  
Objective Lens ◽  
Scanning Confocal Microscopy ◽  
Gaussian Profile ◽  
Phase Interference

As discovered by Abbé, a fundamental limit to the lateral resolution of a conventional optical microscope is produced by “far-field” aperture diffraction at the objective lens. This limitation can be expressed in terms of the Airy disc which relates the obtainable resolution to the wavelength of light used and the objective’s numerical aperture (NA). In scanning confocal microscopy with a laser-produced Gaussian profile illumination beam, the lateral resolution in given by 1.22λ/NA. The axial resolution in this design is improved by the use of a pinhole aperture to pass light only from the objective’s focal plane. Typical best values for lateral (x,y) and axial (z) resolution for visible wavelength scanning confocal microscopy are ~200nm and ~300nm with a NA=1.4 oil immersion objective.Although optical microscopy displays limited resolution when compared to some forms of electron and scanning-probe microscopies (STM, AFM), the convenience of sample preparation and its ease in performing in vivo studies has given rise to new methods of increased resolution (e.g., “near field” techniques, photon-tunneling, phase interference contrast).

Image Reconstruction Techniques for High Numerical Aperture Integrated Circuit Imaging

2012 ◽  
Author(s):  
T. Berkin Cilingiroglu ◽  
F. Hakan Koklu ◽  
Euan Ramsay ◽  
Yang Lu ◽  
Abdulkadir Yurt ◽  
...  
Keyword(s):  
Image Reconstruction ◽  
Integrated Circuits ◽  
Integrated Circuit ◽  
Numerical Aperture ◽  
Polarized Light ◽  
Unified Framework ◽  
Image Reconstruction Techniques ◽  
High Numerical Aperture ◽  
Reconstruction Performance ◽  
Combining Data

Abstract As feature sizes in integrated circuits (ICs) become smaller, higher-resolution defect detection and failure analysis techniques are required. The introduction of solid immersion lenses (SIL) has been an enabling technology for highresolution backside IC imaging. High Numerical Aperture (NA) SIL imaging introduces properties of focused light which cannot be predicted by scalar beam optics. For example, spatial resolution can be manipulated in selected directions by modification of the polarization direction in linearly polarized light. In this work, we propose a unified framework combining multiple SIL microscopy images collected using polarizations at different directions in order to improve image reconstruction performance and ultimately resolution and defect localization. We show improvement in reconstruction quality by combining data taken using light with multiple polarizations. We demonstrate the effectiveness of our framework on experimental data.

Subsurface Imaging of Multi-Level Integrated Circuits Using Scanning Electron Acoustic Microscopy

2009 ◽  
Author(s):  
L. Meng ◽  
J.C.H. Phang ◽  
A.G. Street
Keyword(s):  
Integrated Circuits ◽  
Integrated Circuit ◽  
Modulation Frequency ◽  
Acoustic Microscopy ◽  
Subsurface Imaging ◽  
Phase Images ◽  
Different Depths ◽  
Multi Level ◽  
Electron Acoustic ◽  
Scanning Electron

Abstract The capability of the Scanning Electron Acoustic Microscopy (SEAM) technique for high resolution non-destructive subsurface imaging at different depths for a multi-level integrated circuit is assessed. Experimental results using a beveled DRAM IC sample are used to quantify the effect of the electron beam energy and modulation frequency on contrast, spatial resolution and depth of focus of SEAM amplitude and phase images.

High-Resolution Subsurface Imaging of Silicon-Integrated Circuits

2001 ◽  
Vol 12 (12) ◽  
pp. 34
Author(s):  
M. Selim Ünlü ◽  
Stephen B. Ippolito ◽  
Bennett B. Goldberg
Keyword(s):  
High Resolution ◽  
Integrated Circuits ◽  
Subsurface Imaging ◽  
Silicon Integrated Circuits
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