Two-Dimensional Photonic Crystals Fabricated in Monolithic Single-Crystal Silicon

2010 ◽  
Vol 22 (2) ◽  
pp. 67-69 ◽  
Author(s):  
Sanja Hadzialic ◽  
Sora Kim ◽  
Aasmund Sveinung Sudbo ◽  
Olav Solgaard
1991 ◽  
Vol 235 ◽  
Author(s):  
K. M. Klein ◽  
C. Park ◽  
S. Yang ◽  
S. Morris ◽  
V. Do ◽  
...  

ABSTRACTWe have developed a new computationally-efficient two-dimensional model for boron implantation into single-crystal silicon. This new model is based on the dual Pearson semi-empirical implant depth profile model [1] and the UT-MARLOWE Monte Carlo boron ion implantation model [2]. This new model can predict with very high computatational efficiency two-dimensional as-implanted boron profiles as a function of energy, dose, tilt angle, rotation angle, masking edge orientation, and masking edge thickness.


1993 ◽  
Vol 316 ◽  
Author(s):  
Steven J. Morris ◽  
Shyh-Horng Yang ◽  
David H. Lim ◽  
AL. F. Tasch

ABSTRACTIn this paper, the first comprehensive and computationally-efficient two-dimensional model is reported for boron implants into (100) single-crystal silicon with explicit dependence on energy, dose, implant angles, mask height, mask orientation, and rotation of the wafer during the implant. The model and its implementation into SUPREM 4 are described, and where possible, the explicit dependencies are illustrated.


2005 ◽  
Author(s):  
A. D. Remenyuk ◽  
E. V. Astrova ◽  
R. F. Vitman ◽  
T. S. Perova ◽  
V. A. Tolmachev

2006 ◽  
Vol 48 (2) ◽  
pp. 384-391
Author(s):  
A. D. Remenyuk ◽  
E. V. Astrova ◽  
R. F. Vitman ◽  
T. S. Perova ◽  
V. A. Tolmachev ◽  
...  

Author(s):  
N. Lewis ◽  
E. L. Hall ◽  
A. Mogro-Campero ◽  
R. P. Love

The formation of buried oxide structures in single crystal silicon by high-dose oxygen ion implantation has received considerable attention recently for applications in advanced electronic device fabrication. This process is performed in a vacuum, and under the proper implantation conditions results in a silicon-on-insulator (SOI) structure with a top single crystal silicon layer on an amorphous silicon dioxide layer. The top Si layer has the same orientation as the silicon substrate. The quality of the outermost portion of the Si top layer is important in device fabrication since it either can be used directly to build devices, or epitaxial Si may be grown on this layer. Therefore, careful characterization of the results of the ion implantation process is essential.


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