A novel design of capacitive MEMS pressure sensor for lubricating system

Author(s):  
L. Chitra ◽  
V. Ramakrishnan
Author(s):  
Nadia Ebrahimpour Tolouei ◽  
Mohammad Shavezipur

Abstract The present work introduces a novel design that linearizes the characteristic capacitance-pressure (C-P) response of the pressure sensor in contact mode. The design relies on patterning the insulating (dielectric) layer that separates the two electrodes of the device when the device is in contact mode. Since the capacitance is inversely proportional to the gap between the electrodes and the dielectric constant of the insulating layer is several times more than that of air (or vacuum), the contact region of the two electrodes makes more significant contribution to the overall capacitance of the system. Therefore, if the dielectric layer is properly patterned, the shape of C-P response can be controlled. In this work, we focus on linearity of the sensor response, and design and optimize dielectric pattern to achieve the highest linearity. Finite element simulations are used to demonstrate the applicability of the design concept. Different sensor designs are modeled and simulated using ANSYS® Multiphysics solver and their responses are compared to that of a conventional capacitive pressure sensor. Coefficient of linear correlation between pressure and capacitance is used as a quantitative measure for improvement of linearity. The simulation results show that the linearity of the C-P response improves from 0.930 in a 600 μm-diameter conventional design to 0.978 for a sensor with patterned dielectric layer. Moreover, a smaller sensor with 300 μm diameter display linearity of 0.999 over a 1.25 MPa – 5.0 MPa pressure range.


2020 ◽  
Vol 26 (8) ◽  
pp. 2371-2379 ◽  
Author(s):  
K. Srinivasa Rao ◽  
W. Samyuktha ◽  
D. Vazad Vardhan ◽  
B. Girish Naidu ◽  
P. Ashok Kumar ◽  
...  

Author(s):  
Chih-Tang Peng ◽  
Chang-Chun Lee ◽  
Kuo-Ning Chiang

In this study, a silicon base piezoresistive pressure sensor using flip chip and flex circuit packaging technologies is studied, designed and analyzed. A novel designed pressure sensor using flip chip packaging with spacer is employed to substitute the conventional chip on board or SOP packaging technology. Subsequently, a finite element method (FEM) is adopted for the designing of the sensor performance. Thermal and pressure loading is applied on the sensor to study the system sensitivity as well as the thermal and packaging effect. The performance of novel packaging pressure sensor is compared with that of the conventional one to demonstrate the feasibility of this novel design. The findings depict that this novel packaging design can not only maintain well sensor sensitivity but also reduce the thermal and packaging effect of the pressure sensor.


2018 ◽  
Vol 27 (4) ◽  
pp. 656-666 ◽  
Author(s):  
Mithlesh Kumar ◽  
Banibrata Mukherjee ◽  
Kenkere Balashantha Murthy Mruthyunjaya Swamy ◽  
Siddhartha Sen

2021 ◽  
Vol 0 (0) ◽  
Author(s):  
Hamid Reza Ansari ◽  
Zoheir Kordrostami

Abstract In this paper, the improvement of the sensitivity of a capacitive MEMS pressure sensor is investigated. The proposed spring for the sensor can increase the sensitivity. Silicon is used as the substrate and gold and aluminium nitrate are used as the diaphragm and the dielectric layer, respectively. The dimensions of the diaphragm are 150 µm × 150 µm, which is suspended by four springs. The air gap between the diaphragm and the top electrode is 1.5 µm. The proposed structure is an efficient sensor for the pressures in the range of 1–20 kPa. By using the proposed design, the sensitivity of the MEMS sensor in 18 kPa has improved to 663 (× 10−3 pF/kPa).


2009 ◽  
Vol 74 ◽  
pp. 239-242 ◽  
Author(s):  
Mitra Damghanian ◽  
Burhanuddin Yeop Majlis

A novel MEMS capacitive pressure sensor array is designed and fabricated for fingerprint acquisition application. Based on analytical investigations and FEM analysis, the designed structure of pressure sensor cells assist from an aluminum clamped-clamped wide beam as the movable electrode of variant capacitor, instead of usual membrane structure. A rectangular base T-shape protrusion is also used on top of the deflecting electrode to concentrate pressure and increase the sensitivity. Proven by the real test of the fabricated sensor structure, this design has enhanced sensitivity and linearity of the device compared to all membrane based reported prototypes without crossing the dpi limits. Structural modifications have resulted in a simpler fabrication process as well.


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