Vision-based soldering process parameters calculation for Robotic soldering

Reflow soldering process parameters have distinct effect on the lead-free reflow profile and its key indicators. To determine the relationship between reflow soldering process parameters and lead-free reflow profile is significant for obtaining the correct reflow profile. The result of orthogonal experimental shows that the most influential factors of the change rate of heat-up RS are conveyor speed S, temperature set value of the heating zone 1 T1 and the temperature set value of heating zone 2 T2 in sequence; the most influential factors of the soaking time TS are conveyor speed S, the temperature set value of heating zone 4 T4 and the temperature set value of heating zone 2 T2 in sequence; the most influential factors of the reflow peak temperature PT are conveyor speed S, the temperature set value of heating zone 7 T7 and the temperature set value of heating zone 6 T6 in sequence; the most influential factors of the reflow time TAL are conveyor speed S and the temperature set value of heating zone 6 T6 in sequence.

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Analysis and Optimization for Lead-Free Reflow Soldering Process Parameters of SMA Based on 6 σ Method

Applied Mechanics and Materials ◽

10.4028/www.scientific.net/amm.602-605.180 ◽

2014 ◽

Vol 602-605 ◽

pp. 180-184

Author(s):

Xuan Jun Dai ◽

Hong Yan Huang

Keyword(s):

Process Parameters ◽

Lead Free ◽

Analysis Method ◽

Reflow Soldering ◽

Soldering Process ◽

Hot Air

The reflow soldering process under infrared hot air environment was simulated based on a typical BGA SMA and a twelve-zone reflow oven. Then the optimal soldering process parameters were obtained based on 6σ analysis method and related software. The results could be used to direct the lead-free soldering process parameters setting, and the soldering quality was ensured effectively.

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The influence of soldering process parameters on the optical and thermal properties of power LEDs

Soldering & Surface Mount Technology ◽

10.1108/ssmt-03-2020-0012 ◽

2020 ◽

Vol 32 (4) ◽

pp. 191-199

Author(s):

Przemysław Ptak ◽

Krzysztof Górecki ◽

Agata Skwarek ◽

Krzysztof Witek ◽

Jacek Tarasiuk

Keyword(s):

Thermal Resistance ◽

Process Parameters ◽

Printed Circuit Board ◽

Luminous Flux ◽

Circuit Board ◽

Optical Parameters ◽

Light Sources ◽

Content Type ◽

Soldering Process ◽

Design Engineers

Purpose This paper aims to present the results of investigations that show the influence of soldering process parameters on the optical and thermal parameters of power LEDs. Design/methodology/approach The power LEDs were soldered onto metal core printed circuit board (MCPCB) substrates in different soldering ovens: batch and tunnel types, characterized by different thermal profiles. Three types of solder pastes based on Sn99Ag0.3Cu0.7 with the addition of TiO2 were used. The thermal and optical parameters of the diodes were measured using classical indirect electrical methods. The results of measurements obtained were compared and discussed. Findings It was shown that the type of oven and soldering thermal profile considerably influence the effectiveness of the removal of heat generated in the LEDs tested. This influence is characterized by thermal resistance changes. The differences between the values of this parameter can exceed 20%. This value also depends on the composition of the soldering paste. The differences between the diodes tested can exceed 15%. It was also shown that the luminous flux emitted by the diode depends on the soldering process used. Practical implications The results obtained could be useful for process design engineers for assembling power LEDs for MCPCBs and for designers of solid-state light sources. Originality/value This paper presents the results of investigations into the influence of the soldering profiles and soldering pastes used on the effectiveness of the removal of heat generated in power LEDs. It shows and discusses how the factors mentioned above influence the thermal resistance of the LEDs and optical parameters that characterize the light emitted.

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Relationship between Controllable Process Parameters on Bump Height in ENIG

Applied Mechanics and Materials ◽

10.4028/www.scientific.net/amm.404.62 ◽

2013 ◽

Vol 404 ◽

pp. 62-66

Author(s):

Zaliman Sauli ◽

Vithyacharan Retnasamy ◽

Fairul Afzal Ahmad Fuad ◽

Phaklen Ehkan ◽

Muhamad Hafiz Ab Aziz

Keyword(s):

Process Parameters ◽

Design Of Experiment ◽

Electroless Nickel ◽

Critical Issue ◽

Process Variables ◽

Soldering Process ◽

Bump Height ◽

Electroless Nickel Immersion Gold ◽

Controllable Process

This paper reports the factors that affect the bump height in electroless nickel immersion gold (ENIG) and their interrelation between each other. Bump height is a critical issue that needs to be investigated because a certain quality and requirements of bump height needs to be achieved prior to reflow oven soldering process. A total of four controllable process variables, with 16 sets of experiments were studied using a systematically designed design of experiment (DOE). The result suggests that the electroless nickel bath time has the most significant effect on the formation on bump height and consequently provide larger area for conductivity.

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