Influence of Reflow Soldering Process Parameters on the Lead-Free Reflow Profile

2013 ◽  
Vol 690-693 ◽  
pp. 2578-2582
Author(s):  
Wan Lei Liang ◽  
Xiao Dan Guan ◽  
Peng Zhao
Keyword(s):  
Process Parameters ◽  
Influential Factors ◽  
Lead Free ◽  
Heating Zone ◽  
Reflow Time ◽  
Reflow Soldering ◽  
Soldering Process ◽  
Key Indicators ◽  
The Relationship ◽  
Set Value

Reflow soldering process parameters have distinct effect on the lead-free reflow profile and its key indicators. To determine the relationship between reflow soldering process parameters and lead-free reflow profile is significant for obtaining the correct reflow profile. The result of orthogonal experimental shows that the most influential factors of the change rate of heat-up RS are conveyor speed S, temperature set value of the heating zone 1 T1 and the temperature set value of heating zone 2 T2 in sequence; the most influential factors of the soaking time TS are conveyor speed S, the temperature set value of heating zone 4 T4 and the temperature set value of heating zone 2 T2 in sequence; the most influential factors of the reflow peak temperature PT are conveyor speed S, the temperature set value of heating zone 7 T7 and the temperature set value of heating zone 6 T6 in sequence; the most influential factors of the reflow time TAL are conveyor speed S and the temperature set value of heating zone 6 T6 in sequence.

Analysis and Optimization for Lead-Free Reflow Soldering Process Parameters of SMA Based on 6 σ Method

2014 ◽  
Vol 602-605 ◽  
pp. 180-184
Author(s):  
Xuan Jun Dai ◽  
Hong Yan Huang
Keyword(s):  
Process Parameters ◽  
Lead Free ◽  
Analysis Method ◽  
Reflow Soldering ◽  
Soldering Process ◽  
Hot Air

The reflow soldering process under infrared hot air environment was simulated based on a typical BGA SMA and a twelve-zone reflow oven. Then the optimal soldering process parameters were obtained based on 6σ analysis method and related software. The results could be used to direct the lead-free soldering process parameters setting, and the soldering quality was ensured effectively.

An Investigation of Copper Dissolution and Microstructural Development in Lead-Free Solders

2003 ◽  
Author(s):  
M. Faizan ◽  
R. A. McCoy ◽  
D. C. Lin ◽  
G.-X. Wang
Keyword(s):  
Lead Free ◽  
Microstructural Development ◽  
Reflow Time ◽  
Kinetics Parameters ◽  
Soldering Process ◽  
Copper Dissolution ◽  
Joint Reliability ◽  
Critical Issues ◽  
Lead Free Solders ◽  
Cu Dissolution

Copper dissolution and intermetallic compound (IMC) formation during reflow of soldered joints are critical issues for joint reliability. Most of studies in the literature aimed at the coarsening and growth of the IMC layer of the soldered joints during service and only limited data is available during soldering process. This is particularly true for lead-free solders, which have attracted the attention of researchers just recently. This paper presents an experimental study of copper dissolution and IMC growth of lead-free solders during the reflow process. Solder buttons of either Sn or Sn-3.5wt%Ag were reflowed over a copper (99.9% pure) substrate for various reflow time periods ranging from 10 seconds to 10 minutes. Four reflow temperatures were selected, 232°C, 250°C, 275°C and 300°C for pure tin and 221°C, 250°C, 275°C and 300°C for Sn-3.5%Ag respectively. The average thickness of the grown IMC layer and the amount of copper dissolved during reflow were determined using the images obtained from the metallurgical microscope. The kinetics of IMC growth and Cu dissolution were then quantified and the estimated kinetics parameters can be used to determine the copper dissolution and IMC layer thickness during reflow soldering.

Thermo-mechanical challenges of reflowed lead-free solder joints in surface mount components: a review

2016 ◽  
Vol 28 (2) ◽  
pp. 41-62 ◽  
Author(s):  
Chun Sean Lau ◽  
C.Y. Khor ◽  
D. Soares ◽  
J.C. Teixeira ◽  
M.Z. Abdullah
Keyword(s):  
Solder Joints ◽  
Simulation Modelling ◽  
Lead Free ◽  
Lead Free Solder ◽  
Reflow Process ◽  
Reflow Soldering ◽  
Content Type ◽  
Surface Mount ◽  
Soldering Process ◽  
Free Solder

Purpose The purpose of the present study was to review the thermo-mechanical challenges of reflowed lead-free solder joints in surface mount components (SMCs). The topics of the review include challenges in modelling of the reflow soldering process, optimization and the future challenges in the reflow soldering process. Besides, the numerical approach of lead-free solder reliability is also discussed. Design/methodology/approach Lead-free reflow soldering is one of the most significant processes in the development of surface mount technology, especially toward the miniaturization of the advanced SMCs package. The challenges lead to more complex thermal responses when the PCB assembly passes through the reflow oven. The virtual modelling tools facilitate the modelling and simulation of the lead-free reflow process, which provide more data and clear visualization on the particular process. Findings With the growing trend of computer power and software capability, the multidisciplinary simulation, such as the temperature and thermal stress of lead-free SMCs, under the influenced of a specific process atmosphere can be provided. A simulation modelling technique for the thermal response and flow field prediction of a reflow process is cost-effective and has greatly helped the engineer to eliminate guesswork. Besides, simulated-based optimization methods of the reflow process have gained popularity because of them being economical and have reduced time-consumption, and these provide more information compared to the experimental hardware. The advantages and disadvantages of the simulation modelling in the reflow soldering process are also briefly discussed. Practical implications This literature review provides the engineers and researchers with a profound understanding of the thermo-mechanical challenges of reflowed lead-free solder joints in SMCs and the challenges of simulation modelling in the reflow process. Originality/value The unique challenges in solder joint reliability, and direction of future research in reflow process were identified to clarify the solutions to solve lead-free reliability issues in the electronics manufacturing industry.

scholarly journals Analysis of Defects Generated by the Reflow Soldering in SMT (Surface Mount Technology) Assembly Applying the Six Sigma Method

2004 ◽  
Vol 1 (2) ◽  
pp. 17-25
Author(s):  
Ana C. Bueno ◽  
Maíra P. Shiki ◽  
Valdemir R. De Lima ◽  
Luis G. Brandão ◽  
Maurício M. Oka
Keyword(s):  
Six Sigma ◽  
Failure Modes ◽  
Solder Paste ◽  
Reflow Process ◽  
Reflow Time ◽  
Reflow Soldering ◽  
Effect Analysis ◽  
Soldering Process ◽  
Memory Modules ◽  
Edge Connector

The Six Sigma method using the DMAIC methodology is being applied for analyzing the reflow soldering process in an SMT assembly line. The Define phase (D) and Measure phase (M) were concluded, the Analysis (A) phase is being implemented, and the Improve (I) and Control (C) phases will be the next ones. Defects generated during the reflow process were classified and measured both on assembled memory modules and on virgin laminates that were passed through the oven during the reflow of these modules. Spots of solder and flux were found on the edge connector of the modules and also on the surface of the virgin laminates. It was found that these defects are generated inside the reflow oven, indicating that the oven is contaminated. Two solder pastes were analyzed and consequently, two temperature profiles were used. The amount of defects generated by the oven was found to be independent on the temperature profile. On the other hand the amount of defects depends on the solder paste that is used. The FMEA (Failure Mode and Effect Analysis) was also accomplished. As a result, the main failure modes of the reflow process were determined, namely, the heating rate, the soak temperature, the conveyor velocity, the reflow temperature, the reflow time, and the cooling rate.

scholarly journals Comparison between SAC405 Lead-Free Solders and EN(P)EPIG and EN(B)EPIG Surface Finishes

2015 ◽  
Vol 773-774 ◽  
pp. 232-236 ◽  
Author(s):  
Osman Saliza Azlina ◽  
Ali Ourdjini ◽  
Mohd Halim Irwan Ibrahim
Keyword(s):  
Isothermal Aging ◽  
Optical Microscope ◽  
Hazardous Substances ◽  
Lead Free ◽  
Grain Size Analysis ◽  
Size Analysis ◽  
Reflow Soldering ◽  
Soldering Process ◽  
Surface Finishes ◽  
Lead Free Solders

In electronics industries, most of them had to shifted their solder materials from leaded solders into lead-free solders due to the environmental concerns and follow the legislation of Restriction of use Hazardous Substances (RoHS). Thus, Sn-Ag-Cu solder is one of the choices that can replace the leaded solder and also offer better properties. This study investigates the comparison between Sn-4.0Ag-0.5Cu (SAC405) and EN(P)EPIG and EN(B)EPIG surface finishes. Reliability of solder joint has been assessed by performing solid state isothermal aging at 150oC for 250 up to 2000 hours. After reflow soldering process, (Cu,Ni)6Sn5intermetallic compound (IMC) is dominated at near centre of solder meanwhile (Ni,Cu)3Sn4IMC is dominated at near outside of solder ball.Moreover, aging time resulted in an increase in thickness and changed the morphology into more spherical, dense and large grain size. Analysis by optical microscope revealed that the IMC thickness of EN(B)EPIG produced thicker IMC compared to EN(P)EPIG surface finish during reflow as well as isothermal aging.

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