Relationship between Controllable Process Parameters on Bump Height in ENIG

2013 ◽  
Vol 404 ◽  
pp. 62-66
Author(s):  
Zaliman Sauli ◽  
Vithyacharan Retnasamy ◽  
Fairul Afzal Ahmad Fuad ◽  
Phaklen Ehkan ◽  
Muhamad Hafiz Ab Aziz
Keyword(s):  
Process Parameters ◽  
Design Of Experiment ◽  
Electroless Nickel ◽  
Critical Issue ◽  
Process Variables ◽  
Soldering Process ◽  
Bump Height ◽  
Electroless Nickel Immersion Gold ◽  
Controllable Process

This paper reports the factors that affect the bump height in electroless nickel immersion gold (ENIG) and their interrelation between each other. Bump height is a critical issue that needs to be investigated because a certain quality and requirements of bump height needs to be achieved prior to reflow oven soldering process. A total of four controllable process variables, with 16 sets of experiments were studied using a systematically designed design of experiment (DOE). The result suggests that the electroless nickel bath time has the most significant effect on the formation on bump height and consequently provide larger area for conductivity.

Quantitative Bump Height Analysis in ENIG Using Design of Experiment

2014 ◽  
Vol 896 ◽  
pp. 660-663
Author(s):  
Zaliman Sauli ◽  
Vithyacharan Retnasamy ◽  
Phaklen Ehkan ◽  
Fairul Afzal Ahmad Fuad ◽  
Aaron Koay Terr Yeow
Keyword(s):  
Design Of Experiment ◽  
Flip Chip ◽  
Electroless Nickel ◽  
Bump Height ◽  
Process Robustness ◽  
Electroless Nickel Immersion Gold ◽  
Optimization Of Process Parameters ◽  
Chip Technology ◽  
Higher Temperature

Flip chip technology has grown by leaps and bounds and is getting even smaller in size. Optimization of process parameters in manufacturing is eminent due to reliability issues. This paper reports the parameters that affect the quality of the bump height in electroless nickel immersion gold (ENIG) and their relationships between each other. A total of four different combinations of parameters have been carried out for this investigation using the design of experiment (DOE) approach. It can be concluded that higher temperature of electroless nickel permits an increase of bump height where as the increment in immersion gold temperature does not nessasarily affect the value of bump height. All four samples recorded a higher value of bump height than the controlled bump height value. This implies reliability of the solder joint and assembly process robustness can be improved with an increase of bump height by increasing the time.

Surface Roughness Analysis on Reactive Ion Etched Aluminium Deposited Wafer

2014 ◽  
Vol 487 ◽  
pp. 141-144
Author(s):  
Zaliman Sauli ◽  
Vithyacharan Retnasamy ◽  
Aaron Koay Terr Yeow
Keyword(s):  
Surface Roughness ◽  
Design Of Experiment ◽  
The Other ◽  
Influential Factor ◽  
Rf Power ◽  
Process Variables ◽  
Negative Effects ◽  
Ion Etching ◽  
Roughness Analysis ◽  
Controllable Process

This paper investigates the factors that affect the surface roughness on an Aluminium deposited wafer after reactive ion etching (RIE) using a combination of Tetrafluoromethane (CF4) and Oxygen (O2) gaseous. A total of four controllable process variables, with 16 sets of experiments were scrutinized using an orderly designed design of experiment (DOE). The four variables in the investigation are the composition of CF4 gas, the composition of O2 gas, RF power, and time. The estimate of effect calculated for the composition of CF4 gas, the composition of O2 gas, RF power, and time are-0.9813, -0.7488, -0.0438, and 4.7138 respectively. All factors gave negative effects except for time. This implies that the surface roughness decreases when the content of CF4, O2, and RF power is high. The results indicate that time is the most influential factor compared to the other three factors and is directly proportional to the surface roughness of the etched Aluminium deposited wafer.

Main Effects Study on Plasma Etched Aluminium Metallization

2014 ◽  
Vol 487 ◽  
pp. 195-198
Author(s):  
Zaliman Sauli ◽  
Vithyacharan Retnasamy ◽  
Aaron Koay Terr Yeow
Keyword(s):  
Surface Roughness ◽  
Design Of Experiment ◽  
Influential Factor ◽  
Gas Composition ◽  
Rf Power ◽  
Process Variables ◽  
Negative Effects ◽  
Controllable Process ◽  
Main Effects

Main effects contributing to the quality of surface roughness on an etched aluminium metallization wafer using Reactive Ion Etching (RIE) was studied. A total of three controllable process variables, with eight sets of experiments were scrutinized using an orderly designed design of experiment (DOE). The three variables in the investigation are composed of CF4 gas, composed of O2 gas and RF power while time is constant. The estimate of effect calculated for composition of CF4 gas, composition of O2 gas and RF power are-2.205, -0.975, and-0.525 respectively. All factors gave negative effects. This implies that the surface roughness increases when the content of CF4, O2, and RF power is lower. The results suggest that the composition of CF4 gaseous as the most influential factor as its main effects plot has the steepest slope followed by oxygen and RF power.

Chemical Bath Temperature Investigation for Electroless Nickel Immersion Gold

2014 ◽  
Vol 925 ◽  
pp. 96-100
Author(s):  
Vithyacharan Retnasamy ◽  
Zaliman Sauli ◽  
Uda Hashim ◽  
Aaron Koay Terr Yeow ◽  
Steven Taniselass ◽  
...  
Keyword(s):  
Electroless Nickel ◽  
Bath Temperature ◽  
Gold Wire ◽  
Process Time ◽  
Reflow Process ◽  
Bump Height ◽  
Electroless Nickel Immersion Gold ◽  
Solder Bumps ◽  
Higher Temperature ◽  
Bond Pads

Conventional gold wire bonding to alunimium bond pads leads to the formation of intermetallic compound. Electroless Nickel Immersion Gold (ENIG) has been proposed as surface finish for aluminium bond pads to improve high temperature reliability. In order to create acceptable solder bumps prior to reflow process, a particular bump height for ENIG bumps need to be obtained. This paper reports the effects of chemical bath temperature in response to the bump height using a shorter process time. Analysis was done by using a design of experiment (DOE). The results suggest that higher temperature increases the bump height. Electroless nickel temperature has more influence to the bump height compared to immersion gold temperature.

Investigation of Surface Roughness on Platinum Deposited Wafer after Reactive Ion Etching Using SF6+Argon Gaseous

2014 ◽  
Vol 487 ◽  
pp. 210-213
Author(s):  
Zaliman Sauli ◽  
Vithyacharan Retnasamy ◽  
Aaron Koay Terr Yeow ◽  
Goh Siew Chui ◽  
K. Anwar ◽  
...  
Keyword(s):  
Surface Roughness ◽  
Design Of Experiment ◽  
Reactive Ion Etching ◽  
Influential Factor ◽  
Process Variables ◽  
Negative Effects ◽  
Working Pressure ◽  
Ion Etching ◽  
Bias Power ◽  
Controllable Process

This paper investigates the factors that affect the surface roughness on a Platinum deposited wafer after reactive ion etching (RIE) using a combination of SF6 and Argon gaseous. A total of three controllable process variables, with 8 sets of experiments were scrutinized using a systematically designed design of experiment (DOE). The three variables in the investigation are ICP power, Bias power, and working pressure. The estimate of the effect calculated for ICP power, Bias power, and working pressure are-4.9288, -6.2383, and-4.7223 respectively. All three factors gave negative effects. This implies that the surface roughness decreases when ICP power, Bias power, and working pressure is high. The Bias Power is the most influential factor followed by ICP Power, and working pressure.

A Design of Experiment Approach to the Synthesis of Alendronate-incorporated Hydroxyapatite

2018 ◽  
Vol 69 (8) ◽  
pp. 1944-1948 ◽  
Author(s):  
Adina Turcu Stiolica ◽  
Maria Viorica Bubulica ◽  
Oana Elena Nicolaescu ◽  
Octavian Croitoru ◽  
Mariana Popescu ◽  
...  
Keyword(s):  
Process Parameters ◽  
Design Of Experiment ◽  
Calcium Nitrate ◽  
Chemical Precipitation ◽  
Synthesis Temperature ◽  
Ripening Time ◽  
Synthesis Design ◽  
N2 Atmosphere ◽  
Addition Rate ◽  
Incorporation Efficiency

A design of experiment (DoE) approach is presented for the optimization of Alendronate-hydroxyapatite nanoparticles� synthesis. The synthesis was performed using the chemical precipitation technique from calcium nitrate, diammonium hydrogen phosphate and alendronate. Synthesis temperature, reactant addition rate and ripening time were chosen as the most relevant experimental factors for our synthesis. Design of Experiments was used in order to measure these conclusive process parameters and their effect on controlling some final nanoparticles parameters, such us: alendronate incorporation efficiency (IncorporationEfficiency, %), hydroxyapatite crystallite size (Size_XRD, nm), hydroxyapatite particle size distribution (Size_DLS, �). Our study found that better HA-AL incorporation efficiency and small nonoparticles can be obtained using the following chemical process parameters: reaction temperature 30oC or smaller, ripening time 108h and addition rate 0.1mol/min. The analysis of more than one nanoparticles characteristics was possible using DoE software, MODDE 9.1. Thus, hydroxyapatite-alendronate incorporation efficiency should be expected to increase with decreasing temperature below 300C, increasing the maturate time at least 108h, at an addition rate of 0.1mol/min, in an N2 atmosphere. The same conditions will ensure nanoparticles small size that would be more desirable for the application of implants.

Deformation and Fracture Behaviors in the Freestanding APS-TBC - Effects of Process Parameters and Thermal Exposure

2007 ◽  
Vol 353-358 ◽  
pp. 1935-1938 ◽  
Author(s):  
Yasuhiro Yamazaki ◽  
T. Kinebuchi ◽  
H. Fukanuma ◽  
N. Ohno ◽  
K. Kaise
Keyword(s):  
Mechanical Properties ◽  
Process Parameters ◽  
Gas Turbines ◽  
Thermal Exposure ◽  
Substrate Material ◽  
Process Variables ◽  
Microstructural Investigation ◽  
Deformation And Fracture ◽  
Industrial Gas Turbines ◽  
Tbc Systems

Thermal barrier coatings (TBCs), that reduce the temperature in the underlying substrate material, are an essential requirement for the hot section components of industrial gas turbines. Recently, in order to take full advantage of the potential of the TBC systems, experimental and analytical investigations in TBC systems have been performed. However there is a little information on the deformation behavior of the top coating. In addition, the effects of the thermal exposure and the process parameters on the mechanical properties of the top coating have never been clarified. From these backgrounds, the effects of the process variables in APS and the thermal exposure on the mechanical properties were investigated in order to optimize the APS process of top coatings. The experimental results indicated that the mechanical properties of the APS-TBC, i.e. the tensile strength and the elastic modulus, were significantly changed by the process variables and the long term thermal exposure. The microstructural investigation was also carried out and the relationship between the mechanical properties and the porosity was discussed.

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