High-current characterization of dual-damascene copper interconnects in SiO/sub 2/- and low-k interlevel dielectrics for advanced CMOS semiconductor technologies

AbstractElectromigration experiments have been carried out on simple Cu dual-damascene interconnect tree structures consisting of straight via-to-via (or contact-to-contact) lines with an extra via in the middle of the line. As with Al-based interconnects, the reliability of a segment in this tree strongly depends on the stress conditions of the connected segment. Beyond this, there are important differences in the results obtained under similar test conditions for Al-based and Cu-based interconnect trees. These differences are thought to be associated with variations in the architectural schemes of the two metallizations. The absence of a conducting electromigrationresistant overlayer in Cu technology, and the possibility of liner rupture at stressed vias lead to significant differences in tree reliabilities in Cu compared to Al.

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Failure Modes, Reliability Analysis and Case Studies on the Integration of Copper and Low-K Technology

ISTFA 2004: Conference Proceedings from the 30th International Symposium for Testing and Failure Analysis ◽

10.31399/asm.cp.istfa2004p0649 ◽

2004 ◽

Author(s):

Huixian Wu ◽

James Cargo ◽

Huixian Wu ◽

Marvin White

Keyword(s):

Failure Analysis ◽

Case Studies ◽

Cross Section ◽

Focused Ion Beam ◽

Failure Modes ◽

Ion Beam ◽

Copper Interconnects ◽

Wet Chemical ◽

Low K ◽

Section Analysis

Abstract The integration of copper interconnects and low-K dielectrics will present novel failure modes and reliability issues to failure analysts. This paper discusses failure modes related to Cu/low-K technology. Here, physical failure analysis (FA) techniques including deprocessing and cross-section analysis have been developed. The deprocessing techniques include wet chemical etching, reactive ion etching, chemical mechanical polishing and a combination of these techniques. Case studies on different failure modes related to Cu/low k technology are discussed: copper voiding, copper extrusion; electromigration stress failure; dielectric cracks; delamination-interface adhesion; and FA on circuit-under-pad. For the cross-section analysis of copper/low-K samples, focused ion beam techniques have been developed. Scanning electron microscopy, EDX, and TEM analytical analysis have been used for failure analysis for Cu/low-K technology. Various failure modes and reliability issues have also been addressed.

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Static and dynamic characterization of large-area high-current-density SiC Schottky diodes

56th Annual Device Research Conference Digest (Cat. No.98TH8373) ◽

10.1109/drc.1998.731131 ◽

2002 ◽

Cited By ~ 1

Author(s):

G.M. Dolny ◽

D.T. Morisette ◽

P.M. Shenoy ◽

M. Zafrani ◽

J. Gladish ◽

...

Keyword(s):

Current Density ◽

High Current Density ◽

Schottky Diodes ◽

High Current ◽

Dynamic Characterization ◽

Large Area

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Isolation and characterization of a new cold-active protease from psychrotrophic bacteria of Western Himalayan glacial soil

Scientific Reports ◽

10.1038/s41598-021-92197-w ◽

2021 ◽

Vol 11 (1) ◽

Author(s):

Saleem Farooq ◽

Ruqeya Nazir ◽

Shabir Ahmad Ganai ◽

Bashir Ahmad Ganai

Keyword(s):

Specific Activity ◽

Temperature Range ◽

Psychrotrophic Bacteria ◽

Isolation And Characterization ◽

Cold Active ◽

Active Protease ◽

Quantitative Screening ◽

First Time ◽

Low K

AbstractAs an approach to the exploration of cold-active enzymes, in this study, we isolated a cold-active protease produced by psychrotrophic bacteria from glacial soils of Thajwas Glacier, Himalayas. The isolated strain BO1, identified as Bacillus pumilus, grew well within a temperature range of 4–30 °C. After its qualitative and quantitative screening, the cold-active protease (Apr-BO1) was purified. The Apr-BO1 had a molecular mass of 38 kDa and showed maximum (37.02 U/mg) specific activity at 20 °C, with casein as substrate. It was stable and active between the temperature range of 5–35 °C and pH 6.0–12.0, with an optimum temperature of 20 °C at pH 9.0. The Apr-BO1 had low Km value of 1.0 mg/ml and Vmax 10.0 µmol/ml/min. Moreover, it displayed better tolerance to organic solvents, surfactants, metal ions and reducing agents than most alkaline proteases. The results exhibited that it effectively removed the stains even in a cold wash and could be considered a decent detergent additive. Furthermore, through protein modelling, the structure of this protease was generated from template, subtilisin E of Bacillus subtilis (PDB ID: 3WHI), and different methods checked its quality. For the first time, this study reported the protein sequence for psychrotrophic Apr-BO1 and brought forth its novelty among other cold-active proteases.

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