Effect of chirp characteristics of directly modulated laser on the signal transmission performance

Author(s):  
Abida Yousuf ◽  
Hakim Najeeb-ud-din ◽  
Gausia Qazi
2021 ◽  
Vol 16 (5) ◽  
pp. 773-780
Author(s):  
Bing-Jie Li ◽  
Zhen-Song Li ◽  
Yan-Ping Zhao ◽  
Zheng-Wang Li ◽  
Min Miao

The signal integrity (SI) analysis of a high-speed signal interconnect channel composed of through silicon vias (TSVs) and horizontal re-distribution layers (RDL) is carried out, and the problems of SI, such as transmission loss, crosstalk and coupling effect in the transmission channel, are analyzed and studied. These signal integrity issues are considered in this paper, a signal interconnect channel model is proposed and the equivalent circuit model is deduced as well. Compared with the traditional one, this interconnect channel model has better performance in SI. Further sweep frequency analysis is carried out for different material parameters to achieve signal transmission performance optimization aimed at this model. Test samples of the proposed signal interconnect channel model are designed and fabricated according to the process index, and measured to verify the actual transmission performance. The design and optimization rule of high-speed signal interconnect channel are summarized which proved that the proposed structure has more advantages in signal transmission performance, and has important guiding significance for practical design.


2013 ◽  
Vol 437 ◽  
pp. 829-833
Author(s):  
Shao Lin Weng

Nowadays, in order to improve the quality of signal transmission and reduce the signal attenuation and noise interference, the transmission digital baseband signal modulation become mainstream in today's signal transmission. For the digital baseband signal transmission performance of research helps us to understand the process of digital signal transmission. Firstly, using shift registers to produce m sequence, used to simulate the data signal and the pseudo random noise signal. Then, to design a low pass filter, used to simulate the channel. Data signal transmission in the channel was carried with additive random noise interference, we can measure signal interference by observing eye pattern at the receiving terminal. If to Manchester encoding of data signal, the receiver decoding output data signal can be extracted using the synchronous clock circuit to get the clock signal to synchronize, and display the eye pattern, which is used to evaluate the performance of the transmission system. And we put forward the optimization scheme of the digital baseband signal transmission performance through the research.


2011 ◽  
Vol 58-60 ◽  
pp. 404-409
Author(s):  
Yu Ling Shang ◽  
Chun Quan Li ◽  
Hua Qing Xiong ◽  
En Min Tan

Electrical performance of bonding wire is critical to the reliability of electrical interconnection systems of chip-level packaging for high frequency operation. In this paper, the electrical performance of various bonding wires between chips and packages is presented. The impact of the length, spacing, height and diameter between the bonding wires was carefully examined. In order to investigate the impacts of bonding wire configuration parameters on signal transmission performance, a design of experiment (DOE) was set up. Based on data of DOE, two parameter equations were obtained to express the Radio Frequency characterization of bonding wires. From these equations, the optimized geometric structure parameters were obtained by optimization design. Compared with the previously reported geometric structure, the optimized geometric structure has better electrical performance, making the return loss and coupling decrease 3dB and more than 10 dB, respectively.


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