High-Frequency Electrical Model of Through-Silicon Vias for 3-D Integrated Circuits Considering Eddy Current and Proximity Effects
2017 ◽
Vol 7
(12)
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pp. 2036-2044
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Keyword(s):
2019 ◽
Vol 106
(5)
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pp. 785-798
Keyword(s):
2015 ◽
Vol 5
(1)
◽
pp. 21-27
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Keyword(s):
2021 ◽
Vol 7
(02)
◽
2012 ◽
Vol 2012
(1)
◽
pp. 000239-000243
Keyword(s):