Application of Steinberg Model for Vibration Lifetime Evaluation of Sn-Ag-Cu-Based Solder Joints in Power Semiconductors

2021 ◽  
Vol 11 (3) ◽  
pp. 444-450
Author(s):  
M. Kavitha ◽  
Zaid Hamid Mahmoud ◽  
Kakarla Hari Kishore ◽  
A. M. Petrov ◽  
Aleksandr Lekomtsev ◽  
...  
Keyword(s):  
Solder Joints ◽  
Power Semiconductors

Predictive Failure Analysis of Solder Joints with Simultaneous High Speed EBSD and EDS

2018 ◽  
Author(s):  
J. Lindsay ◽  
P. Trimby ◽  
J. Goulden ◽  
S. McCracken ◽  
R. Andrews
Keyword(s):  
High Speed ◽  
Solder Joints ◽  
Phase Distribution ◽  
Bond Failure ◽  
Microstructural Parameters ◽  
Snpb Solder ◽  
Grain Orientations ◽  
Accelerated Thermal Cycling ◽  
The Relationship ◽  
Opening Up

Abstract The results presented here show how high-speed simultaneous EBSD and EDS can be used to characterize the essential microstructural parameters in SnPb solder joints with high resolution and precision. Analyses of both intact and failed solder joints have been carried out. Regions of strain localization that are not apparent from the Sn and Pb phase distribution are identified in the intact bond, providing key insights into the mechanism of potential bond failure. In addition, EBSD provides a wealth of quantitative detail such as the relationship between parent Sn grain orientations and Pb coarsening, the morphology and distribution of IMCs on a sub-micron scale and accurate grain size information for all phases within the joint. Such analyses enable a better understanding of the microstructural developments leading up to failure, opening up the possibility of improved accelerated thermal cycling (ATC) testing and better quality control.

Effect of Bi and In on Microstructure Formation in Sn-3Ag-3Bi-3In/Cu and /Ni Solder Joints

2016 ◽  
Vol 700 ◽  
pp. 142-151 ◽  
Author(s):  
Sergey A. Belyakov ◽  
Christopher M. Gourlay
Keyword(s):  
Solid Solution ◽  
Phase Equilibria ◽  
Ternary Compound ◽  
Fine Particles ◽  
Solder Joints ◽  
Primary Phase ◽  
Significant Fraction ◽  
Microstructure Formation ◽  
Five Phases

Sn-3Ag-3Bi-3In solder has been investigated to improve the understanding of microstructure formation in this solder during solidification and soldering to Cu and Ni substrates. The as-solidified microstructures of Sn-3Ag-3Bi-3In samples were found to consist of a significant fraction of βSn dendrites with a complex eutectic between the dendrites. In total five phases were observed to form during solidification: βSn, Ag3Sn, Bi, ζAg and a “Sn-In-Bi” ternary compound. Soldering of Sn-3Ag-3Bi-3In to substrates changed the phase equilibria in the system and caused the formation of additional phases: Cu6Sn5 during soldering to Cu and Ni3Sn4 and metastable NiSn4 during soldering to Ni. It is shown that metastable NiSn4 forms as a primary phase in a complex 5-component Sn-3Ag-3Bi-3In-Ni system. In and Bi were detected in solid solution in the βSn matrix in amounts of ~1.5-2at% and ~1.2at% respectively. Bi also existed as fine particles of two distinct types. (i): sub-micron (<500nm) coral-like particles and (ii) facetted particles measuring up to 7-8 μm.

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