An Overview of Failure Mechanisms in Embedded Flash Memories

Author(s):  
O. Ginez ◽  
J.-M. Daga ◽  
M. Combe ◽  
P. Girard ◽  
C. Landrault ◽  
...  





Author(s):  
Benoit Godard ◽  
Jean-Michel Daga ◽  
Lionel Torres ◽  
Gilles Sassatelli


2020 ◽  
Vol 67 (12) ◽  
pp. 5472-5478
Author(s):  
Shinkeun Kim ◽  
Kyunghwan Lee ◽  
Changbeom Woo ◽  
Yuchul Hwang ◽  
Hyungcheol Shin




2010 ◽  
Vol 1252 ◽  
Author(s):  
Alexandre Guiraud ◽  
Nicolas Breil ◽  
Mickaël Gros-Jean ◽  
Damien Deleruyelle ◽  
Gilles Micolau ◽  
...  

AbstractWe have investigated the integration of Hf-based material as Inter Poly Dielectric in flash memories devices. Electrical measurements showed the good properties of SiO2/HfO2/SiO2 stacks. We then interested to the impact of the thermal budget on this specific stack which induces changes in the electrical properties. XPS measurements suggests those changes are due to the presence of an Hf-silicate layer at the SiO2/HfO2 interface.





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