A Damage Evolution Model for Thermal Fatigue Analysis of Solder Joints

1999 ◽  
Vol 122 (3) ◽  
pp. 200-206 ◽  
Author(s):  
Xiaowu Zhang ◽  
S-W. Ricky Lee ◽  
Yi-Hsin Pao
Keyword(s):  
Fatigue Life ◽  
Solder Joint ◽  
Thermal Fatigue ◽  
Material Properties ◽  
Damage Evolution ◽  
Solder Joints ◽  
Evolution Model ◽  
Model Verification ◽  
Thermal Fatigue Life ◽  
Double Beam

Thermal fatigue of solder joints is critical to the performance and reliability of electronic components. It is well known that the fatigue life of solder joints is rather difficult to be estimated because of the complicated material behaviors and solder joint geometry. Conventional life prediction methods such as Coffin-Manson equation or its modifications usually over-estimate the thermal fatigue life. The main reason for this phenomenon is that the material properties are assumed constant during thermal cycling. In this paper, a damage evolution model is introduced for predicting the thermal fatigue life of solder joints. This method not only considers the degradation of material properties in the solder, but also saves substantial computational effort. In the present study, a damage function is determined by the hysteresis loops of creep shear stress-strain of solder joints in a double-beam specimen. The proposed model is then applied to investigate the solder joint reliability of a 272 PBGA package and a bottom-leaded plastic (BLP) package for model verification. The results from the present analysis seem to be encouraging. [S1043-7398(00)01003-3]

Thermal Fatigue Life Prediction Model of CCGA Tin-Lead and Lead-Free Interconnects

2006 ◽  
Author(s):  
T. E. Wong ◽  
C. Chu
Keyword(s):  
Fatigue Life ◽  
Solder Joint ◽  
Prediction Model ◽  
Thermal Fatigue ◽  
Strain Energy ◽  
Life Prediction ◽  
Solder Joints ◽  
Fatigue Life Prediction ◽  
Thermal Fatigue Life ◽  
Life Prediction Model

A thermal fatigue life prediction model of a ceramic column grid array (CCGA) solder joint assembly has been developed when the 90Pb/10Sn solder columns of the CCGA package are soldered onto the printed circuit board with either tin-lead or lead-free solder paste. This model was evolved from an empirically derived formula by correlating the solder nonelastic strain energy density increment to the fatigue life test data. To develop the solder joint fatigue life prediction model, a nonlinear finite element analysis (FEA) was conducted using the ABAQUS computer code. A thermal fatigue life prediction model was then established. The test results, obtained from various sources in which tin-lead and lead-free solder pastes on PCB were used, combined with the FEA derived nonelastic strain energy density per temperature cycle, ΔW, were used to calibrate the proposed life prediction model. In the analysis, 3-D finite element global- and sub-modeling techniques were used to determine the ΔW of the CCGA solder joints when subjected to temperature cycling. The analysis results show that: 1) solder joint would typically fail across solder column instead of along solder pad interfaces; and 2) higher nonelastic strain energy densities of solder occur at the solder columns at the package corners and these solder joints would fail first. These analysis predictions are consistent with the test observations. In the model calibration process, the 625- and 1657-pin CCGA test results, which were cycled between 20°C/90°C, 0°C/100°C, -55°C/110°C, or -55°C/125°C, were reasonably well correlated to the predicted values of ΔW. Therefore, the developed life prediction model could be used and is recommended to serve as an effective tool to determine the integrity of the CCGA solder joints during temperature cycling. In addition, the following future work is recommended: 1) selecting more study cases with various solder joint configurations, package sizes, environmental profiles, etc. to further calibrate this life prediction model; 2) using this model to conduct parametric studies to identify critical factors impacting solder joint fatigue life and then seek an optimum design; and 3) developing a simplified method instead of the FEA approach to make preliminary thermal fatigue life estimates of the CCGA solder joints.

scholarly journals Research on Thermal Fatigue Life Prediction Technology of PoP Laminated BGA Products

2021 ◽  
Vol 2065 (1) ◽  
pp. 012017
Author(s):  
Hong-lei Ran ◽  
Xiao-jie Sheng ◽  
Qiang Duan ◽  
Kui Zhang ◽  
Jie Huang
Keyword(s):  
Fatigue Life ◽  
Solder Joint ◽  
Fatigue Test ◽  
Thermal Fatigue ◽  
Solder Joints ◽  
Dynamic Monitoring ◽  
Stress And Strain ◽  
Resistance Change ◽  
Thermal Fatigue Test ◽  
Thermal Fatigue Life

Abstract In this paper, a fast prediction method for thermal fatigue life of PoP laminated BGA Product was proposed. Firstly, the stress and strain of the solder joints of each layer of the laminated device in thermal fatigue test was determined by finite element simulation method. According to the research idea of relative stress and strain, the solder joints were divided into sensitive solder joints and reliable solder joints. Secondly, sensitive solder joint were connected with PCB traces through the internal pads, bonding wires, TSVs and reliable solder joints to form a daisy chain. Through real-time dynamic monitoring of the resistance change of the daisy chain in thermal fatigue test to judge whether the solder joints fail, and record the occurrence time of the first failure solder joint. Finally, the thermal fatigue life of the product was estimated by the Norris-Landzberg formula.

scholarly journals Prediction of Thermal Fatigue Life of Lead-Free BGA Solder Joints by Finite Element Analysis

2001 ◽  
Vol 42 (5) ◽  
pp. 809-813 ◽  
Author(s):  
Young-Eui Shin ◽  
Kyung-Woo Lee ◽  
Kyong-Ho Chang ◽  
Seung-Boo Jung ◽  
Jae Pil Jung
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Fatigue Life ◽  
Thermal Fatigue ◽  
Solder Joints ◽  
Lead Free ◽  
Element Analysis ◽  
Thermal Fatigue Life

Precision Evaluation for Thermal Fatigue Life of Power Module Using Coupled Electrical-Thermal-Structural Analysis

2011 ◽  
Author(s):  
Tomohiro Takahashi ◽  
Qiang Yu ◽  
Masahiro Kobayashi
Keyword(s):  
Fatigue Life ◽  
Temperature Distribution ◽  
Solder Joint ◽  
Thermal Fatigue ◽  
Thermal Structure ◽  
Inelastic Strain ◽  
Power Module ◽  
Thermal Fatigue Life ◽  
Power Cycling ◽  
Precision Evaluation

For power module, the reliability evaluation of thermal fatigue life by power cycling has been prioritized as an important concern. Since in power cycling produces there exists non-uniform temperature distribution in the power module, coupled thermal-structure analysis is required to evaluate thermal fatigue mechanism. The thermal expansion difference between a Si chip and a substrate causes thermal fatigue. In this study, thermal fatigue life of solder joints on power module was evaluated. The finite element method (FEM) was used to evaluate temperature distribution induced by joule heating. Higher temperature appears below the Al wire because the electric current flows through the bonding Al wire. Coupled thermal-structure analysis is also required to evaluate the inelastic strain distribution. The damage of each part of solder joint can be calculated from equivalent inelastic strain range and crack propagation was simulated by deleting damaged elements step by step. The initial cracks were caused below the bonding Al wire and propagated concentrically under power cycling. There is the difference from environmental thermal cycling where the crack initiated at the edge of solder layer. In addition, in order to accurately evaluate the thermal fatigue life, the factors affecting the thermal fatigue life of solder joint where verified using coupled electrical-thermal-structural analysis. Then, the relation between the thermal fatigue life of solder joint and each factor is clarified. The precision evaluation for the thermal fatigue life of power module is improved.

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