Precision Temperature Control of High-Throughput Fluid Flows: Theoretical and Experimental Analysis

2001 ◽  
Vol 123 (4) ◽  
pp. 796-802 ◽  
Author(s):  
Kevin M. Lawton ◽  
Steven R. Patterson ◽  
Russell G. Keanini
Keyword(s):  
Thermal Resistance ◽  
Temperature Control ◽  
High Throughput ◽  
Control Device ◽  
Heat Transfer Analysis ◽  
Temperature Variations ◽  
Analysis And Design ◽  
Perfect Mixing ◽  
Precision Temperature ◽  
Precision Temperature Control

A precision method for attenuating temperature variations in a high-throughput control fluid stream is described and analyzed. In contrast to earlier investigations, the present study emphasizes heat transfer analysis of the constituent control device and derives theoretical descriptions of system responses to time-varying fluid temperatures. Experiments demonstrate that the technique provides: (1) frequency-dependent attenuation which is several orders of magnitude greater than that obtained via a perfect mixing volume; (2) attenuation, over two decades of disturbance frequency, that reduces in-flow temperature variations by factors ranging from 10 to ≈104; (3) asymptotic attenuation greater than three orders of magnitude for spectral components having periods less than the device thermal equilibrium time; and (4) attenuation which is fully consistent with theoretical predictions. The model developed provides design criteria for tailoring system performance. In particular, it is shown that for a given control stream flow rate, the magnitude of maximal attenuation can be adjusted by varying the thermal resistance between the flow and attenuating medium, while the range of frequencies maximally attenuated can be adjusted by varying the product of thermal resistance and attenuating medium heat capacity. The analysis and design are general and should prove useful in the design and analysis of other high-throughput precision temperature control systems.

Development of high precision temperature control device for large aperture frequency doubling crystal

2017 ◽  
Vol 46 (4) ◽  
pp. 420001
Author(s):  
刘保麟 Liu Baolin ◽  
张 鹏 Zhang Peng ◽  
孙付仲 Sun Fuzhong ◽  
张庆春 Zhang Qingchun ◽  
卢礼华 Lu Lihua
Keyword(s):  
High Precision ◽  
Temperature Control ◽  
Frequency Doubling ◽  
Control Device ◽  
Large Aperture ◽  
Precision Temperature ◽  
Precision Temperature Control ◽  
Temperature Control Device

Optimized Thermoelectric Module-Heat Sink Assemblies for Precision Temperature Control

2011 ◽  
Author(s):  
Rui Zhang ◽  
David A. Brooks ◽  
Marc Hodes ◽  
Matthew van Lieshout ◽  
Vincent P. Manno
Keyword(s):  
Power Consumption ◽  
Thermal Resistance ◽  
Ambient Temperature ◽  
Thermoelectric Material ◽  
Temperature Control ◽  
Heat Sink ◽  
Heat Sinks ◽  
Temperature Range ◽  
Precision Temperature ◽  
Precision Temperature Control

Robust precision temperature control of photonics components is achieved by mounting them on thermoelectric modules (TEMs) which are in turn mounted on heat sinks. However, the power consumption of TEMs is high because high currents are driven through Bi2Te3-based semiconducting materials with high electrical resistivity and finite thermal conductivity. This problem is exacerbated when the ambient temperature surrounding a TEM varies in the usual configuration where the air-cooled heat sink a TEM is mounted to is of specified thermal resistance. Indeed, heat sinks of negligible and relatively high thermal resistances minimize TEM power consumption for sufficiently high and low ambient temperatures, respectively. Optimized TEM-heat sink assemblies reduce the severity of this problem. In the problem considered, total footprint of thermoelectric material in a TEM, thermoelectric material properties, heat load, component operating temperature, relevant component-side thermal resistances and ambient temperature range are prescribed. Provided is an algorithm to compute the unique combination of the height of the pellets in a TEM and the thermal resistance of the heat sink attached to it which minimizes the maximum power consumption of the TEM over the specified ambient temperature range. This optimization maximizes the fraction of the power budget in an optoelectronics circuit pack available for other uses. Implementation of the algorithm is demonstrated through an example for a typical set of conditions.

Optimized Thermoelectric Module-Heat Sink Assemblies for Precision Temperature Control

2012 ◽  
Vol 134 (2) ◽  
Author(s):  
Rui Zhang ◽  
Marc Hodes ◽  
David A. Brooks ◽  
Vincent P. Manno
Keyword(s):  
Thermal Resistance ◽  
Ambient Temperature ◽  
Thermoelectric Material ◽  
Temperature Control ◽  
Heat Sink ◽  
Heat Sinks ◽  
Ambient Temperatures ◽  
Precision Temperature ◽  
Precision Temperature Control ◽  
Heat Loads

Robust precision temperature control of heat-dissipating photonics components is achieved by mounting them on thermoelectric modules (TEMs), which are in turn mounted on heat sinks. However, the power consumption of such TEMs is high. Indeed, it may exceed that of the component. This problem is exacerbated when the ambient temperature and/or component heat load vary as is normally the case. In the usual packaging configuration, a TEM is mounted on an air-cooled heat sink of specified thermal resistance. However, heat sinks of negligible thermal resistance minimize TEM power for sufficiently high ambient temperatures and/or heat loads. Conversely, a relatively high thermal resistance heat sink minimizes TEM power for sufficiently low ambient temperatures and heat loads. In the problem considered, total footprint of thermoelectric material in a TEM, thermoelectric material properties, component operating temperature, relevant component-side thermal resistances, and ambient temperature range are prescribed. Moreover, the minimum and maximum rates of heat dissipation by the component are zero and a prescribed value, respectively. Provided is an algorithm to compute the combination of the height of the pellets in a TEM and the thermal resistance of the heat sink attached to it, which minimizes the maximum sum of the component and TEM powers for permissible operating conditions. It is further shown that the maximum value of this sum asymptotically decreases as the total footprint of thermoelectric material in a TEM increases. Implementation of the algorithm maximizes the fraction of the power budget in an optoelectronics circuit pack available for other uses. Use of the algorithm is demonstrated through an example for a typical set of conditions.

Boundary Control on Embedded Heaters for Composite Joining

2017 ◽  
Author(s):  
Brandon P. Smith ◽  
Mahdi Ashrafi ◽  
Mark E. Tuttle ◽  
Santosh Devasia
Keyword(s):  
Boundary Control ◽  
Temperature Control ◽  
High Strength ◽  
Lap Joint ◽  
Uniform Heating ◽  
Temperature Variations ◽  
Single Lap Joint ◽  
Precision Temperature ◽  
Precision Temperature Control ◽  
Bond Area

This paper demonstrates the use of boundary control on embedded resistive heaters with the purpose of precision temperature control for curing high strength adhesives when joining composite adherends. This is particularly useful in the presence of heatsinks, where a uniform heating technique will lead to temperature variations in the bondline. The major contribution of this work is to reduce such temperature variations by using boundary control on the embedded heater. This technique is demonstrated experimentally for bonding a single-lap joint, and the temperature variation in the bond area was reduced from 20.3% to 2.7%.

Realization of an ultra-high precision temperature control in a cryogen-free cryostat

2018 ◽  
Vol 89 (10) ◽  
pp. 104901 ◽  
Author(s):  
Bo Gao ◽  
Changzhao Pan ◽  
Yanyan Chen ◽  
Yaonan Song ◽  
Haiyang Zhang ◽  
...  
Keyword(s):  
High Precision ◽  
Temperature Control ◽  
Precision Temperature ◽  
Precision Temperature Control
Sign in / Sign up

Export Citation Format

Share Document