Optimized Thermoelectric Module-Heat Sink Assemblies for Precision Temperature Control

2011 ◽  
Author(s):  
Rui Zhang ◽  
David A. Brooks ◽  
Marc Hodes ◽  
Matthew van Lieshout ◽  
Vincent P. Manno
Keyword(s):  
Power Consumption ◽  
Thermal Resistance ◽  
Ambient Temperature ◽  
Thermoelectric Material ◽  
Temperature Control ◽  
Heat Sink ◽  
Heat Sinks ◽  
Temperature Range ◽  
Precision Temperature ◽  
Precision Temperature Control

Robust precision temperature control of photonics components is achieved by mounting them on thermoelectric modules (TEMs) which are in turn mounted on heat sinks. However, the power consumption of TEMs is high because high currents are driven through Bi2Te3-based semiconducting materials with high electrical resistivity and finite thermal conductivity. This problem is exacerbated when the ambient temperature surrounding a TEM varies in the usual configuration where the air-cooled heat sink a TEM is mounted to is of specified thermal resistance. Indeed, heat sinks of negligible and relatively high thermal resistances minimize TEM power consumption for sufficiently high and low ambient temperatures, respectively. Optimized TEM-heat sink assemblies reduce the severity of this problem. In the problem considered, total footprint of thermoelectric material in a TEM, thermoelectric material properties, heat load, component operating temperature, relevant component-side thermal resistances and ambient temperature range are prescribed. Provided is an algorithm to compute the unique combination of the height of the pellets in a TEM and the thermal resistance of the heat sink attached to it which minimizes the maximum power consumption of the TEM over the specified ambient temperature range. This optimization maximizes the fraction of the power budget in an optoelectronics circuit pack available for other uses. Implementation of the algorithm is demonstrated through an example for a typical set of conditions.

Optimized Thermoelectric Module-Heat Sink Assemblies for Precision Temperature Control

2012 ◽  
Vol 134 (2) ◽  
Author(s):  
Rui Zhang ◽  
Marc Hodes ◽  
David A. Brooks ◽  
Vincent P. Manno
Keyword(s):  
Thermal Resistance ◽  
Ambient Temperature ◽  
Thermoelectric Material ◽  
Temperature Control ◽  
Heat Sink ◽  
Heat Sinks ◽  
Ambient Temperatures ◽  
Precision Temperature ◽  
Precision Temperature Control ◽  
Heat Loads

Robust precision temperature control of heat-dissipating photonics components is achieved by mounting them on thermoelectric modules (TEMs), which are in turn mounted on heat sinks. However, the power consumption of such TEMs is high. Indeed, it may exceed that of the component. This problem is exacerbated when the ambient temperature and/or component heat load vary as is normally the case. In the usual packaging configuration, a TEM is mounted on an air-cooled heat sink of specified thermal resistance. However, heat sinks of negligible thermal resistance minimize TEM power for sufficiently high ambient temperatures and/or heat loads. Conversely, a relatively high thermal resistance heat sink minimizes TEM power for sufficiently low ambient temperatures and heat loads. In the problem considered, total footprint of thermoelectric material in a TEM, thermoelectric material properties, component operating temperature, relevant component-side thermal resistances, and ambient temperature range are prescribed. Moreover, the minimum and maximum rates of heat dissipation by the component are zero and a prescribed value, respectively. Provided is an algorithm to compute the combination of the height of the pellets in a TEM and the thermal resistance of the heat sink attached to it, which minimizes the maximum sum of the component and TEM powers for permissible operating conditions. It is further shown that the maximum value of this sum asymptotically decreases as the total footprint of thermoelectric material in a TEM increases. Implementation of the algorithm maximizes the fraction of the power budget in an optoelectronics circuit pack available for other uses. Use of the algorithm is demonstrated through an example for a typical set of conditions.

Design of a Variable Conductance Heat Pipe for a Photonic Component

2006 ◽  
Author(s):  
Martin Cleary ◽  
Ronan Grimes ◽  
Marc Hodes ◽  
Mark T. North
Keyword(s):  
Power Consumption ◽  
Ambient Temperature ◽  
Heat Pipe ◽  
Temperature Control ◽  
Heat Load ◽  
Passive Control ◽  
Evaporator Temperature ◽  
Ambient Temperatures ◽  
Precision Temperature ◽  
Precision Temperature Control

Thermoelectric modules (TEMs) are widely used to provide precision temperature control in photonic applications. A problem with TEMs, however, is that when they are subjected to a large range of ambient temperatures the power of consumption of TEMs can be excessive. This study proposes the replacement of the TEM based approach with a variable conductance heat pipe (VCHP). VCHPs offer reduced power consumption compared to TEMs whilst still offering precision temperature control of the device. Using existing theory this paper investigates the use of wicked and non-wicked reservoirs and the effect of reservoir volume on the sensitivity of the evaporator temperature to changes in both ambient temperature and heat load for both heated and unheated reservoirs. The paper also investigates the effectiveness of the use of a steel collar between the reservoir and the condenser in reducing the heat loss to ambient. The paper concludes that passive control of evaporator temperature can be achieved for the case of a variable heat load, but not for the case of a variable ambient temperature, that evaporator temperature is more sensitive to reservoir temperature for a wicked than a non-wicked reservoir, and that with the use of a steel collar between the reservoir and the condenser a VCHP provides a significant power consumption reduction when compared to a TEM.

Precision Temperature Control of High-Throughput Fluid Flows: Theoretical and Experimental Analysis

2001 ◽  
Vol 123 (4) ◽  
pp. 796-802 ◽  
Author(s):  
Kevin M. Lawton ◽  
Steven R. Patterson ◽  
Russell G. Keanini
Keyword(s):  
Thermal Resistance ◽  
Temperature Control ◽  
High Throughput ◽  
Control Device ◽  
Heat Transfer Analysis ◽  
Temperature Variations ◽  
Analysis And Design ◽  
Perfect Mixing ◽  
Precision Temperature ◽  
Precision Temperature Control

A precision method for attenuating temperature variations in a high-throughput control fluid stream is described and analyzed. In contrast to earlier investigations, the present study emphasizes heat transfer analysis of the constituent control device and derives theoretical descriptions of system responses to time-varying fluid temperatures. Experiments demonstrate that the technique provides: (1) frequency-dependent attenuation which is several orders of magnitude greater than that obtained via a perfect mixing volume; (2) attenuation, over two decades of disturbance frequency, that reduces in-flow temperature variations by factors ranging from 10 to ≈104; (3) asymptotic attenuation greater than three orders of magnitude for spectral components having periods less than the device thermal equilibrium time; and (4) attenuation which is fully consistent with theoretical predictions. The model developed provides design criteria for tailoring system performance. In particular, it is shown that for a given control stream flow rate, the magnitude of maximal attenuation can be adjusted by varying the thermal resistance between the flow and attenuating medium, while the range of frequencies maximally attenuated can be adjusted by varying the product of thermal resistance and attenuating medium heat capacity. The analysis and design are general and should prove useful in the design and analysis of other high-throughput precision temperature control systems.

Thermal Behaviors of Passively-Cooled Hybrid Fin Heat Sinks for Lightweight and High Performance Thermal Management

2015 ◽  
Author(s):  
Nico Setiawan Effendi ◽  
Kyoung Joon Kim
Keyword(s):  
Thermal Resistance ◽  
Heat Sink ◽  
High Performance ◽  
Heat Dissipation ◽  
Computational Study ◽  
Heat Sinks ◽  
Channel Diameter ◽  
Internal Channel ◽  
Study Results ◽  
Parametric Effects

A computational study is conducted to explore thermal performances of natural convection hybrid fin heat sinks (HF HSs). The proposed HF HSs are a hollow hybrid fin heat sink (HHF HS) and a solid hybrid fin heat sink (SHF HS). Parametric effects such as a fin spacing, an internal channel diameter, a heat dissipation on the performance of HF HSs are investigated by CFD analysis. Study results show that the thermal resistance of the HS increases while the mass-multiplied thermal resistance of the HS decreases associated with the increase of the channel diameter. The results also shows the thermal resistance of the SHF HS is 13% smaller, and the mass-multiplied thermal resistance of the HHF HS is 32% smaller compared with the pin fin heat sink (PF HS). These interesting results are mainly due to integrated effects of the mass-reduction, the surface area enhancement, and the heat pumping via the internal channel. Such better performances of HF HSs show the feasibility of alternatives to the conventional PF HS especially for passive cooling of LED lighting modules.

Influence of selected factors on parameters of a cooling system with a Peltier module and forced air flow

2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Krzysztof Posobkiewicz ◽  
Krzysztof Górecki
Keyword(s):  
Thermal Resistance ◽  
Heat Sink ◽  
Cooling System ◽  
Heat Sinks ◽  
Cooling Power ◽  
Cooling Systems ◽  
Content Type ◽  
Peltier Module ◽  
Peltier Modules ◽  
Forced Air

Purpose The purpose of this study is to investigate the validation of the usefulness of cooling systems containing Peltier modules for cooling power devices based on measurements of the influence of selected factors on the value of thermal resistance of such a cooling system. Design/methodology/approach A cooling system containing a heat-sink, a Peltier module and a fan was built by the authors and the measurements of temperatures and thermal resistance in various supply conditions of the Peltier module and the fan were carried out and discussed. Findings Conclusions from the research carried out answer the question if the use of Peltier modules in active cooling systems provides any benefits comparing with cooling systems containing just passive heat-sinks or conventional active heat-sinks constructed of a heat-sink and a fan. Research limitations/implications The research carried out is the preliminary stage to asses if a compact thermal model of the investigated cooling system can be formulated. Originality/value In the paper, the original results of measurements and calculations of parameters of a cooling system containing a Peltier module and an active heat-sink are presented and discussed. An influence of power dissipated in the components of the cooling system on its efficiency is investigated.

A Novel Electronics Cooling System Using Water Heat Pipes Under Freezing Conditions

2003 ◽  
Author(s):  
Osamu Suzuki ◽  
Atsuo Nishihara
Keyword(s):  
Prediction Model ◽  
Thermal Resistance ◽  
Ambient Temperature ◽  
Cooling System ◽  
Electronics Cooling ◽  
Heat Pipes ◽  
System Model ◽  
Cooling Performance ◽  
Temperature Range ◽  
Metal Block

A novel electronics cooling system that uses water heat pipes under an ambient temperature range from −30°C to 40°C has been developed. The system consists of several water heat pipes, air-cooled fins, and a metal block. The heat pipes are separated into two groups according to the thermal resistance of their fins. One set of heat pipes, which have fins with higher thermal resistance, operates under an ambient temperature range from −30°C to 40°C. The other set, which have lower resistance, operates from 0°C to 40°C. A prediction model based on the frozen-startup limitation of a single heat pipe was first devised and experimentally verified. Then, a prediction model for the whole-system was formulated according to the former model. The whole-system model was used to design a prototype cooling system, and it was confirmed that the prototype has a suitable cooling performance for an environmentally friendly electronics cooling system.

Understanding the Impact of Flow Bypass on the Thermal Performance of Air Cooled Heat Sinks

2014 ◽  
Author(s):  
Krishna Kota ◽  
Mohamed M. Awad
Keyword(s):  
Energy Conservation ◽  
Thermal Resistance ◽  
Thermal Performance ◽  
Heat Sink ◽  
Heat Sinks ◽  
Laminar Regime ◽  
Flow Energy ◽  
Factor Α ◽  
The Impact ◽  
Fundamental Mass

In this effort, theoretical modeling was employed to understand the impact of flow bypass on the thermal performance of air cooled heat sinks. Fundamental mass and flow energy conservation equations across a longitudinal fin heat sink configuration and the bypass region were applied and a generic parameter, referred as the Flow Bypass Factor (α), was identified from the theoretical solution that mathematically captures the effect of flow bypass as a quantifiable parameter on the junction-to-ambient thermal resistance of the heat sink. From the results obtained, it was found that, at least in the laminar regime, the impact of flow bypass on performance can be neglected for cases when the bypass gap is typically less than 5% of the fin height, and is almost linear at high relative bypass gaps (i.e., usually for bypass gaps that are more than 10–15% of the fin height). It was also found that the heat sink thermal resistance is more sensitive to small bypass gaps and the effect of flow bypass decreases with increasing bypass gap.

Sign in / Sign up

Export Citation Format

Share Document