Validation of Heat-Flux Predictions on the Outer Air Seal of a Transonic Turbine Blade

2003 ◽  
Vol 128 (3) ◽  
pp. 589-595 ◽  
Author(s):  
John P. Clark ◽  
Marc D. Polanka ◽  
Matthew Meininger ◽  
Thomas J. Praisner
Keyword(s):  
Heat Flux ◽  
Experimental Technique ◽  
Three Dimensional ◽  
High Heat ◽  
Navier Stokes ◽  
High Heat Flux ◽  
Pressure Side ◽  
Time Resolved ◽  
Transonic Turbine ◽  
Very High

It is desirable to accurately predict the heat load on turbine hot section components within the design cycle of the engine. Thus, a set of predictions of the heat flux on the blade outer air seal of a transonic turbine is here validated with time-resolved measurements obtained in a single-stage high-pressure turbine rig. Surface pressure measurements were also obtained along the blade outer air seal, and these are also compared to three-dimensional, Reynolds-averaged Navier-Stokes predictions. A region of very high heat flux was predicted as the pressure side of the blade passed a fixed location on the blade outer air seal, but this was not measured in the experiment. The region of high heat flux was associated both with very high harmonics of the blade-passing event and a discrepancy between predicted and measured time-mean heat-flux levels. Further analysis of the predicted heat flux in light of the experimental technique employed in the test revealed that the elevated heat flux associated with passage of the pressure side might be physical. Improvements in the experimental technique are suggested for future efforts.

Development of Advanced High Heat Flux Cooling System for Power Electronics

2009 ◽  
Author(s):  
Yasuhisa Shinmoto ◽  
Shinichi Miura ◽  
Koichi Suzuki ◽  
Yoshiyuki Abe ◽  
Haruhiko Ohta
Keyword(s):  
Heat Flux ◽  
Power Electronics ◽  
Critical Heat Flux ◽  
Heating Surface ◽  
Narrow Channel ◽  
High Heat ◽  
High Heat Flux ◽  
Gap Size ◽  
Narrow Channels ◽  
Very High

Recent development in electronic devices with increased heat dissipation requires severe cooling conditions and an efficient method for heat removal is needed for the cooling under high heat flux conditions. Most researches are concentrated on small semiconductors with high heat flux density, while almost no existing researches concerning the cooling of a large semiconductor, i.e. power electronics, with high heat generation density from a large cooling area. A narrow channel between parallel plates is one of ideal structures for the application of boiling phenomena which uses the cooling for such large semiconductors. To develop high-performance cooling systems for power electronics, experiments on increase in critical heat flux (CHF) for flow boiling in narrow channels by improved liquid supply was conducted. To realize the cooling of large areas at extremely high heat flux under the conditions for a minimum gap size and a minimum flow rate of liquid supplied, the structure with auxiliary liquid supply was devised to prevent the extension of dry-patches underneath flattened bubbles generated in a narrow channel. The heating surface was experimented in two channels with different dimensions. The heating surfaces have the width of 30mm and the lengths of 50mm and 150mm in the flow direction. A large width of actual power electronics is realizable by the parallel installation of the same channel structure in the transverse direction. The cooling liquid is additionally supplied via sintered metal plates from the auxiliary unheated channels located at sides or behind the main heated channel. To supply the liquid to the entire heating surface, fine grooves are machined on the heating surface for enhance the spontaneous liquid supply by the aid of capillary force. The gap size of narrow channels are varied as 0.7mm, 2mm and 5mm. Distribution of liquid flow rate to the main heated channel and the auxiliary unheated channels were varied to investigate its effect on the critical heat flux. Test liquids employed are R113, FC72 and water. The systematic experiments by using water as a test liquid were conducted. Critical heat flux values larger than 2×106W/m2 were obtained at both gap sizes of 2mm and 5mm for a heated length of 150mm. A very high heat transfer coefficient as much as 1×105W/m2K was obtained at very high heat flux near CHF for the gap size of 2mm. This paper is a summary of experimental results obtained in the past by the present authors.

Effects of Downstream Vane Bowing and Asymmetry on Unsteadiness in a Transonic Turbine

2018 ◽  
Author(s):  
John P. Clark ◽  
Richard J. Anthony ◽  
Michael K. Ooten ◽  
John M. Finnegan ◽  
P. Dean Johnson ◽  
...  
Keyword(s):  
Turbine Blades ◽  
Three Dimensional ◽  
Navier Stokes ◽  
Time Resolved ◽  
Turbine Engine ◽  
Shock Interactions ◽  
Design Changes ◽  
Post Test ◽  
Measured Time ◽  
Transonic Turbine

Accurate predictions of unsteady forcing on turbine blades are essential for the avoidance of high-cycle-fatigue issues during turbine engine development. Further, if one can demonstrate that predictions of unsteady interaction in a turbine are accurate, then it becomes possible to anticipate resonant-stress problems and mitigate them through aerodynamic design changes during the development cycle. A successful reduction in unsteady forcing for a transonic turbine with significant shock interactions due to downstream components is presented here. A pair of methods to reduce the unsteadiness was considered and rigorously analyzed using a three-dimensional, time resolved Reynolds-Averaged Navier Stokes (RANS) solver. The first method relied on the physics of shock reflections itself and involved altering the stacking of downstream components to achieve a bowed airfoil. The second method considered was circumferentially-asymmetric vane spacing which is well known to spread the unsteadiness due to vane-blade interaction over a range of frequencies. Both methods of forcing reduction were analyzed separately and predicted to reduce unsteady pressures on the blade as intended. Then, both design changes were implemented together in a transonic turbine experiment and successfully shown to manipulate the blade unsteadiness in keeping with the design-level predictions. This demonstration was accomplished through comparisons of measured time-resolved pressures on the turbine blade to others obtained in a baseline experiment that included neither asymmetric spacing nor bowing of the downstream vane. The measured data were further compared to rigorous post-test simulations of the complete turbine annulus including a bowed downstream vane of non-uniform pitch.

scholarly journals A Three-Dimensional Coupled Internal/External Simulation of a Film-Cooled Turbine Vane

1999 ◽  
Author(s):  
James D. Heidmann ◽  
David L. Rigby ◽  
Ali A. Ameri
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Film Cooling ◽  
Three Dimensional ◽  
High Heat ◽  
Operating Conditions ◽  
High Heat Flux ◽  
Nasa Lewis Research ◽  
Turbine Vane ◽  
Film Cooling Holes

A three-dimensional Navier-Stokes simulation has been performed for a realistic film-cooled turbine vane using the LeRC-HT code. The simulation includes the flow regions inside the coolant plena and film cooling holes in addition to the external flow. The vane is the subject of an upcoming NASA Lewis Research Center experiment and has both circular cross-section and shaped film cooling holes. This complex geometry is modeled using a multi-block grid which accurately discretizes the actual vane geometry including shaped holes. The simulation matches operating conditions for the planned experiment and assumes periodicity in the spanwise direction on the scale of one pitch of the film cooling hole pattern. Two computations were performed for different isothermal wall temperatures, allowing independent determination of heat transfer coefficients and film effectiveness values. The results indicate separate localized regions of high heat flux in the showerhead region due to low film effectiveness and high heat transfer coefficient values, while the shaped holes provide a reduction in heat flux through both parameters. Hole exit data indicate rather simple skewed profiles for the round holes, but complex profiles for the shaped holes with mass fluxes skewed strongly toward their leading edges.

Experimental Performance of a Heat Flux Microsensor

1991 ◽  
Vol 113 (2) ◽  
pp. 246-250 ◽  
Author(s):  
J. M. Hager ◽  
S. Simmons ◽  
D. Smith ◽  
S. Onishi ◽  
L. W. Langley ◽  
...  
Keyword(s):  
Heat Flux ◽  
Convection Heat Transfer ◽  
Active Surface ◽  
High Heat ◽  
Active Surface Area ◽  
High Heat Flux ◽  
Time Resolved ◽  
Free Stream Turbulence ◽  
High Frequency Response ◽  
Measurement Surface

The performance characteristics of a heat flux microsensor have been measured and analyzed. This is a new heat flux gage system that is made using microfabrication techniques. The gages are small, have high frequency response, can measure very high heat flux, and output a voltage directly proportional to the heat flux. Each gage consists of a thin thermal resistance layer sandwiched between many thermocouple pairs forming a differential thermopile. Because the gage is made directly on the measurement surface and the total thickness is less than 2 μm, the presence of the gage contributes negligible flow and thermal disruption. The active surface area of the gage is 3 mm by 4 mm, with the leads attached outside this area to relay the surface heat flux and temperature signals. Gages were made and tested on glass and silicon substrates. The steady and unsteady response was measured experimentally and compared with analytical predictions. The analysis was performed using a one-dimensional, transient, finite-difference model of the six layers comprising the gage plus the substrate. Steady-state calibrations were done on a convection heat transfer apparatus and the transient response was measured to step changes of the imposed radiative flux. As an example of the potential capabilities, the time-resolved heat flux was measured at a stagnation point with imposed free-stream turbulence. A hot-film probe placed outside the boundary layer was used to provide a simultaneous signal showing the corresponding turbulent velocity fluctuations.

Heat Transfer in Supercritical Steam Flowing Through Spiral Tubes

2020 ◽  
Vol 142 (11) ◽  
Author(s):  
Deepak Kumar Kanungo ◽  
Sachin Kumar Shrivastava ◽  
Nand Kumar Singh ◽  
Kirti Chandra Sahu
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Three Dimensional ◽  
Tangential Velocity ◽  
Thermal Conditions ◽  
Strong Relationship ◽  
High Heat ◽  
High Heat Flux ◽  
Straight Tube ◽  
Spiral Tube

Abstract We investigate heat transfer in supercritical steam flowing in a spiral tube by conducting three-dimensional numerical simulations. The current numerical solver has been validated with the existing experimental results, and simulations are performed by varying different geometric parameters of a spiral tube. The flow dynamics and heat transfer in a spiral tube are compared against those in a straight tube. For the parameters range considered in the present study, it is found that the heat transfer coefficient (HTC) in the spiral tube is 29% higher than that in the case of a straight tube for the same flow and thermal conditions. Our results indicate that the tangential velocity component resulting due to the spiraling effect of the steam is the primary reason for the enhancement of the HTC value. It is observed that while the HTC in a spiral tube is inversely related to the spiral diameter, it does not exhibit a strong relationship with the spiral pitch. Moreover, three existing heat transfer correlations are evaluated under the spiral flow condition and it is observed that none of them can calculate the HTC value accurately in spiral tubes. Using the Buckingham π-theorem, three modified correlations are proposed for the low, moderate, and high heat flux regimes, which accurately predict the wall temperature and HTC of supercritical steam in spiral tubes in all the heat flux regimes. The correlations have an error band of less than ±20%.

A Review of Two-Phase Forced Cooling in Three-Dimensional Stacked Electronics: Technology Integration

2015 ◽  
Vol 137 (4) ◽  
Author(s):  
Craig Green ◽  
Peter Kottke ◽  
Xuefei Han ◽  
Casey Woodrum ◽  
Thomas Sarvey ◽  
...  
Keyword(s):  
Heat Flux ◽  
Heat Sink ◽  
Three Dimensional ◽  
High Heat ◽  
Heat Fluxes ◽  
Thermal Design ◽  
High Heat Flux ◽  
Two Phase ◽  
Forced Cooling ◽  
Fluidic Routing

Three-dimensional (3D) stacked electronics present significant advantages from an electrical design perspective, ranging from shorter interconnect lengths to enabling heterogeneous integration. However, multitier stacking exacerbates an already difficult thermal problem. Localized hotspots within individual tiers can provide an additional challenge when the high heat flux region is buried within the stack. Numerous investigations have been launched in the previous decade seeking to develop cooling solutions that can be integrated within the 3D stack, allowing the cooling to scale with the number of tiers in the system. Two-phase cooling is of particular interest, because the associated reduced flow rates may allow reduction in pumping power, and the saturated temperature condition of the coolant may offer enhanced device temperature uniformity. This paper presents a review of the advances in two-phase forced cooling in the past decade, with a focus on the challenges of integrating the technology in high heat flux 3D systems. A holistic approach is applied, considering not only the thermal performance of standalone cooling strategies but also coolant selection, fluidic routing, packaging, and system reliability. Finally, a cohesive approach to thermal design of an evaporative cooling based heat sink developed by the authors is presented, taking into account all of the integration considerations discussed previously. The thermal design seeks to achieve the dissipation of very large (in excess of 500 W/cm2) background heat fluxes over a large 1 cm × 1 cm chip area, as well as extreme (in excess of 2 kW/cm2) hotspot heat fluxes over small 200 μm × 200 μm areas, employing a hybrid design strategy that combines a micropin–fin heat sink for background cooling as well as localized, ultrathin microgaps for hotspot cooling.

Single-Side Heated Monoblock, High Heat Flux Removal Using Water Subcooled Flow Boiling

2003 ◽  
Author(s):  
Ronald D. Boyd ◽  
Ali Ekhlassi ◽  
Penrose Cofie ◽  
Richard Martin ◽  
Hongtao Zhang
Keyword(s):  
Heat Flux ◽  
Wall Temperature ◽  
Test Section ◽  
Flow Boiling ◽  
Three Dimensional ◽  
High Heat ◽  
High Heat Flux ◽  
Subcooled Flow Boiling ◽  
Subcooled Flow ◽  
Single Side

Plasma-facing components for fusion reactors and other high heat flux heat sinks are usually subjected to a peripherally non-uniform heat flux. The configuration under study is related to these applications and consists of a single-side heated monoblock cross-section test section with a circular coolant channel bored through the center. The monoblock test section has a heated length of 180.0 mm and has 10.0 mm and 30.0 mm inside diameter and outside square sides, respectively. It was subjected to a constant heat flux on one side only, and the remaining portion of the outside surfaces is not exposed to a heat flux. The inlet channel water temperature was held near at 26.0°C, the exit pressure was maintained at 0.207 MPa, and the mass velocity was 0.59 Mg/m2s. The results consist of three-dimensional monoblock test section wall temperature distributions and a clear display of both critical heat flux and post-critical heat flux for this single-side heated configuration. These results are very encouraging in that they are among the first full set of truly three-dimensional monoblock test section wall temperature measurements for a one-side heated monoblock flow channel which contains the effects of conjugate heat transfer for turbulent, subcooled flow boiling. Comparisons are made between these results for the monoblock test section and those for a single-side heated circular test section.

Single-Side Heated Monoblock, High Heat Flux Removal Using Water Subcooled Turbulent Flow Boiling

2004 ◽  
Vol 126 (1) ◽  
pp. 17-21
Author(s):  
Ronald D. Boyd ◽  
Penrose Cofie ◽  
Hongtao Zhang ◽  
Ali Ekhlassi
Keyword(s):  
Heat Flux ◽  
Wall Temperature ◽  
Test Section ◽  
Flow Boiling ◽  
Three Dimensional ◽  
High Heat ◽  
Constant Heat Flux ◽  
Phase Region ◽  
High Heat Flux ◽  
Single Side

Plasma-facing components for fusion reactors and other high heat flux heat sinks are subjected to a peripherally nonuniform heat flux. The monoblock test section under study is a single-side heated square cross-section heat sink with a circular coolant channel bored through the center. The heated length of the test section is 180 mm. The inside diameter and outside square sides are 10 mm and 30 mm, respectively. It was subjected to a constant heat flux on one side of the outside surfaces, and the remaining portion was not heated. The exit water subcooling varied from 55 to 101°C, the exit pressure was maintained at 0.207 MPa, and the mass velocity was 0.59Mg/m2s. The results consist of three-dimensional wall temperature distributions and a display of two-dimensional quasi-boiling curves. These results are among the first full set of three-dimensional wall temperature measurements for a single-side heated monoblock flow channel which contains the effects of conjugate heat transfer for turbulent, subcooled flow boiling. In the single-phase region, good predictability resulted when the thermal hydraulic diameter was used.

scholarly journals A Three-Dimensional Coupled Internal/External Simulation of a Film-Cooled Turbine Vane

1999 ◽  
Vol 122 (2) ◽  
pp. 348-359 ◽  
Author(s):  
James D. Heidmann ◽  
David L. Rigby ◽  
Ali A. Ameri
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Film Cooling ◽  
Three Dimensional ◽  
High Heat ◽  
Operating Conditions ◽  
High Heat Flux ◽  
Nasa Lewis Research ◽  
Turbine Vane ◽  
Film Cooling Holes

A three-dimensional Navier–Stokes simulation has been performed for a realistic film-cooled turbine vane using the LeRC-HT code. The simulation includes the flow regions inside the coolant plena and film cooling holes in addition to the external flow. The vane is the subject of an upcoming NASA Lewis Research Center experiment and has both circular cross-sectional and shaped film cooling holes. This complex geometry is modeled using a multiblock grid, which accurately discretizes the actual vane geometry including shaped holes. The simulation matches operating conditions for the planned experiment and assumes periodicity in the spanwise direction on the scale of one pitch of the film cooling hole pattern. Two computations were performed for different isothermal wall temperatures, allowing independent determination of heat transfer coefficients and film effectiveness values. The results indicate separate localized regions of high heat flux in the showerhead region due to low film effectiveness and high heat transfer coefficient values, while the shaped holes provide a reduction in heat flux through both parameters. Hole exit data indicate rather simple skewed profiles for the round holes, but complex profiles for the shaped holes with mass fluxes skewed strongly toward their leading edges. [S0889-504X(00)02802-6]

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