Development of Advanced High Heat Flux Cooling System for Power Electronics

2009 ◽  
Author(s):  
Yasuhisa Shinmoto ◽  
Shinichi Miura ◽  
Koichi Suzuki ◽  
Yoshiyuki Abe ◽  
Haruhiko Ohta
Keyword(s):  
Heat Flux ◽  
Power Electronics ◽  
Critical Heat Flux ◽  
Heating Surface ◽  
Narrow Channel ◽  
High Heat ◽  
High Heat Flux ◽  
Gap Size ◽  
Narrow Channels ◽  
Very High

Recent development in electronic devices with increased heat dissipation requires severe cooling conditions and an efficient method for heat removal is needed for the cooling under high heat flux conditions. Most researches are concentrated on small semiconductors with high heat flux density, while almost no existing researches concerning the cooling of a large semiconductor, i.e. power electronics, with high heat generation density from a large cooling area. A narrow channel between parallel plates is one of ideal structures for the application of boiling phenomena which uses the cooling for such large semiconductors. To develop high-performance cooling systems for power electronics, experiments on increase in critical heat flux (CHF) for flow boiling in narrow channels by improved liquid supply was conducted. To realize the cooling of large areas at extremely high heat flux under the conditions for a minimum gap size and a minimum flow rate of liquid supplied, the structure with auxiliary liquid supply was devised to prevent the extension of dry-patches underneath flattened bubbles generated in a narrow channel. The heating surface was experimented in two channels with different dimensions. The heating surfaces have the width of 30mm and the lengths of 50mm and 150mm in the flow direction. A large width of actual power electronics is realizable by the parallel installation of the same channel structure in the transverse direction. The cooling liquid is additionally supplied via sintered metal plates from the auxiliary unheated channels located at sides or behind the main heated channel. To supply the liquid to the entire heating surface, fine grooves are machined on the heating surface for enhance the spontaneous liquid supply by the aid of capillary force. The gap size of narrow channels are varied as 0.7mm, 2mm and 5mm. Distribution of liquid flow rate to the main heated channel and the auxiliary unheated channels were varied to investigate its effect on the critical heat flux. Test liquids employed are R113, FC72 and water. The systematic experiments by using water as a test liquid were conducted. Critical heat flux values larger than 2×106W/m2 were obtained at both gap sizes of 2mm and 5mm for a heated length of 150mm. A very high heat transfer coefficient as much as 1×105W/m2K was obtained at very high heat flux near CHF for the gap size of 2mm. This paper is a summary of experimental results obtained in the past by the present authors.

Experimental Study on Heat Transfer Augmentation for High Heat Flux Removal in Rib-Roughened Narrow Channels

1998 ◽  
Vol 35 (9) ◽  
pp. 671-678 ◽  
Author(s):  
Md. Shafiqul ISLAM ◽  
Ryutaro HINO ◽  
Katsuhiro HAGA ◽  
Masanori MONDE ◽  
Yukio SUDO
Keyword(s):  
Heat Transfer ◽  
Experimental Study ◽  
Heat Flux ◽  
High Heat ◽  
High Heat Flux ◽  
Narrow Channels ◽  
Heat Transfer Augmentation ◽  
Rib Roughened

Development of Cooling System for a Large Area at High Heat Flux by Using Flow Boiling in Narrow Channels

2009 ◽  
Author(s):  
Shinichi Miura ◽  
Yukihiro Inada ◽  
Yasuhisa Shinmoto ◽  
Haruhiko Ohta
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Flow Rate ◽  
Mass Velocity ◽  
Cooling System ◽  
Volumetric Flow Rate ◽  
High Heat ◽  
High Heat Flux ◽  
Gap Size ◽  
Heated Channel

Advance of an electronic technology has caused the increase of heat generation density for semiconductors densely integrated. Thermal management becomes more important, and a cooling system for high heat flux is required. It is extremely effective to such a demand using flow boiling heat transfer because of its high heat removal ability. To develop the cooling system for a large area at high heat flux, the cold plate structure of narrow channels with auxiliary unheated channel for additional liquid supply was devised and confirmed its validity by experiments. A large surface of 150mm in heated length and 30mm in width with grooves of an apex angle of 90 deg, 0.5mm depth and 1mm in pitch was employed. A structure of narrow rectangular heated channel between parallel plates with an unheated auxiliary channel was employed and the heat transfer characteristics were examined by using water for different combinations of gap sizes and volumetric flow rates. Five different liquid distribution modes were tested and their data were compared. The values of CHF larger than 1.9×106W/m2 for gap size of 2mm under mass velocity based on total volumetric flow rate and on the cross section area of main heated channel 720kg/m2s or 1.7×106W/m2 for gap size of 5mm under 290kg/m2s were obtained under total volumetric flow rate 4.5×10−5m3/s regardless of the liquid distribution modes. Under several conditions, the extensions of dry-patches were observed at the upstream location of the main heated channel resulting burnout not at the downstream but at the upstream. High values of CHF larger than 2×106W/m2 were obtained only for gap size of 2mm. The result indicates that higher mass velocity in the main heated channel is more effective for the increase in CHF. It was clarified that there is optimum flow rate distribution to obtain the highest values of CHF. For gap size of 2mm, high heat transfer coefficient as much as 7.4×104W/m2K were obtained at heat flux 1.5×106W/m2 under mass velocity 720kg/m2s based on total volumetric flow rate and on the cross section area of main heated channel. Also to obtain high heat transfer coefficient, it is more useful to supply the cooling liquid from the auxiliary unheated channel for additional liquid supply in the transverse direction perpendicular to the flow in the main heated channel.

On the Nature of Critical Heat Flux in Microchannels

2005 ◽  
Vol 127 (1) ◽  
pp. 101-107 ◽  
Author(s):  
A. E. Bergles ◽  
S. G. Kandlikar
Keyword(s):  
Heat Flux ◽  
Critical Heat Flux ◽  
Flow Boiling ◽  
Flow Distribution ◽  
High Heat ◽  
Operating Conditions ◽  
High Heat Flux ◽  
Clear Understanding ◽  
Wide Range ◽  
Parallel Microchannels

The critical heat flux (CHF) limit is an important consideration in the design of most flow boiling systems. Before the use of microchannels under saturated flow boiling conditions becomes widely accepted in cooling of high-heat-flux devices, such as electronics and laser diodes, it is essential to have a clear understanding of the CHF mechanism. This must be coupled with an extensive database covering a wide range of fluids, channel configurations, and operating conditions. The experiments required to obtain this information pose unique challenges. Among other issues, flow distribution among parallel channels, conjugate effects, and instrumentation need to be considered. An examination of the limited CHF data indicates that CHF in parallel microchannels seems to be the result of either an upstream compressible volume instability or an excursive instability rather than the conventional dryout mechanism. It is expected that the CHF in parallel microchannels would be higher if the flow is stabilized by an orifice at the entrance of each channel. The nature of CHF in microchannels is thus different than anticipated, but recent advances in microelectronic fabrication may make it possible to realize the higher power levels.

Observations of the Critical Heat Flux Process During Pool Boiling of FC-72

2014 ◽  
Vol 136 (4) ◽  
Author(s):  
J. Jung ◽  
S. J. Kim ◽  
J. Kim
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Critical Heat Flux ◽  
Pool Boiling ◽  
High Heat ◽  
Line Length ◽  
Boiling Curve ◽  
High Heat Flux ◽  
Transfer Coefficients ◽  
Ir Camera

Experimental work was undertaken to investigate the process by which pool-boiling critical heat flux (CHF) occurs using an IR camera to measure the local temperature and heat transfer coefficients on a heated silicon surface. The wetted area fraction (WF), the contact line length density (CLD), the frequency between dryout events, the lifetime of the dry patches, the speed of the advancing and receding contact lines, the dry patch size distribution on the surface, and the heat transfer from the liquid-covered areas were measured throughout the boiling curve. Quantitative analysis of this data at high heat flux and transition through CHF revealed that the boiling curve can simply be obtained by weighting the heat flux from the liquid-covered areas by WF. CHF mechanisms proposed in the literature were evaluated against the observations.

Critical Heat Flux Enhancement in Water-Based Nanofluid With Honeycomb Porous Plate on Large Heated Surface

2016 ◽  
Author(s):  
Suazlan Mt Aznam ◽  
Shoji Mori ◽  
Kunito Okuyama
Keyword(s):  
Heat Flux ◽  
Critical Heat Flux ◽  
Heated Surface ◽  
Porous Plate ◽  
High Heat ◽  
High Heat Flux ◽  
Heater Surface ◽  
Solid Structure ◽  
Water Based ◽  
Plain Surface

Heat removal through pool boiling is limited by the phenomena of critical heat flux (CHF). CHF enhancement is vitally important in order to satisfy demand for the cooling technology with high heat flux in In Vessel Retention (IVR). Various surface modifications of the boiling surface, e.g., integrated surface structures and coating of a micro-porous have been proven to effectively enhance the CHF in saturated pool boiling. We have been proposed a novel method of attaching a honeycomb structured porous plate on a considerably large heater surface. Previous results, by the authors in [1] reported that CHF has been enhanced experimentally up to more than approximately twice that of a plain surface (approximately 2.0 to 2.5 MW/m2) with a diameter of 30 mm heated surface. However, it is necessary to demonstrate the method together with infinite heater surface within laboratory scale. It is important that cooling techniques for IVR could be applicable to a large heated surface as well as remove high heat flux. Objective of this study is to investigate the CHF of honeycomb porous plate and metal solid structure in nanofluid boiling or water boiling on a large heated surface. Water-based nanofluid offers good wettability and capillarity. While metal solid structure is installed on honeycomb porous plate to increase the number of vapor jet. Experimental results of honeycomb porous plate and combination of honeycomb porous plate and metal solid structure in water-based nanofluid boiling shows that CHF is increased up to twice [2] and thrice, respectively compared to plain surface in water boiling. To the best of the author’s knowledge, the highest value (3.1 MW/m2) was obtained for a large heated surface having a diameter of 50 mm which is regarded as infinite heated surface. This demonstrates potential for general applicability to have more safety margin in IVR method.

scholarly journals Experimental Study on Thermal Performance of a Bent Copper-Water Heat Pipe

2020 ◽  
Vol 2020 ◽  
pp. 1-10
Author(s):  
Shuangshuang Miao ◽  
Jiajia Sui ◽  
Yulong Zhang ◽  
Feng Yao ◽  
Xiangdong Liu
Keyword(s):  
Heat Flux ◽  
Heat Pipe ◽  
Critical Heat Flux ◽  
Working Conditions ◽  
Thermal Performance ◽  
Heat Input ◽  
High Heat ◽  
High Heat Flux ◽  
Electronic Components ◽  
Copper Water

Vapor-liquid phase change is regarded as an efficient cooling method for high-heat-flux electronic components. The copper-water bent heat pipes are particularly suited to the circumstances of confined space or misplaced heat and cold sources for high-heat-flux electronic components. In this paper, the steady and transient thermal performance of a bent copper-water heat pipe is studied based on a performance test system. The effects of cooling temperature, working conditions on the critical heat flux, and equivalent thermal conductivity have been examined and analyzed. Moreover, the influences of heat input and working conditions on the thermal response of a bent heat pipe have also been discussed. The results indicate that the critical heat flux is enhanced due to the increases in cooling temperature and the lengths of the evaporator and condenser. In addition, the critical heat flux is improved by extending the cooling length only when the operating temperature is higher than 50°C. The improvement on the equivalent thermal by increasing the heating length is more evident than that by increasing cooling length. It is also demonstrated by the experiment that the bent copper-water heat pipe can respond quickly to the variation of heat input and possesses superior transient heat transfer performance.

Steady-State Subcooled Nucleate Boiling on a Downward-Facing Hemispherical Surface

1998 ◽  
Vol 120 (2) ◽  
pp. 365-370 ◽  
Author(s):  
K. H. Haddad ◽  
F. B. Cheung
Keyword(s):  
Heat Flux ◽  
Steady State ◽  
Heat Transport ◽  
Bubble Dynamics ◽  
Flow Direction ◽  
Heating Surface ◽  
Nucleate Boiling ◽  
High Heat ◽  
Bubble Nucleation ◽  
High Heat Flux

Steady-state nucleate boiling heat transfer experiments in saturated and subcooled water were conducted. The heating surface was a 0.305 m hemispherical aluminum vessel heated from the inside with water boiling on the outside. It was found that subcooling had very little effect on the nucleate boiling curve in the high heat flux regime where latent heat transport dominated. On the other hand, a relatively large effect of subcooling was observed in the low-heat-flux regime where sensible heat transport was important. Photographic records of the boiling phenomenon and the bubble dynamics indicated that in the high-heat-flux regime, boiling in the bottom center region of the vessel was cyclic in nature with a liquid heating phase, a bubble nucleation and growth phase, a bubble coalescence phase, and a large vapor mass ejection phase. At the same heat flux level, the size of the vapor masses was found to decrease from the bottom center toward the upper edge of the vessel, which was consistent with the increase observed in the critical heat flux in the flow direction along the curved heating surface.

Integrated Vapor Chamber Heat Spreader for Power Module Applications

2017 ◽  
Author(s):  
Clayton L. Hose ◽  
Dimeji Ibitayo ◽  
Lauren M. Boteler ◽  
Jens Weyant ◽  
Bradley Richard
Keyword(s):  
Heat Flux ◽  
Thermal Resistance ◽  
Power Electronics ◽  
Coefficient Of Thermal Expansion ◽  
High Heat ◽  
Heat Fluxes ◽  
High Heat Flux ◽  
Vapor Chamber ◽  
Power Module ◽  
Heat Spreader

This work presents a demonstration of a coefficient of thermal expansion (CTE) matched, high heat flux vapor chamber directly integrated onto the backside of a direct bond copper (DBC) substrate to improve heat spreading and reduce thermal resistance of power electronics modules. Typical vapor chambers are designed to operate at heat fluxes > 25 W/cm2 with overall thermal resistances < 0.20 °C/W. Due to the rising demands for increased thermal performance in high power electronics modules, this vapor chamber has been designed as a passive, drop-in replacement for a standard heat spreader. In order to operate with device heat fluxes >500 W/cm2 while maintaining low thermal resistance, a planar vapor chamber is positioned onto the backside of the power substrate, which incorporates a specially designed wick directly beneath the active heat dissipating components to balance liquid return and vapor mass flow. In addition to the high heat flux capability, the vapor chamber is designed to be CTE matched to reduce thermally induced stresses. Modeling results showed effective thermal conductivities of up to 950 W/m-K, which is 5 times better than standard copper-molybdenum (CuMo) heat spreaders. Experimental results show a 43°C reduction in device temperature compared to a standard solid CuMo heat spreader at a heat flux of 520 W/cm2.

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