Thermal Expansion of Three-Phase Composite Materials

1989 ◽  
Vol 56 (2) ◽  
pp. 418-422 ◽  
Author(s):  
George J. Dvorak ◽  
Tungyang Chen
Keyword(s):  
Thermal Expansion ◽  
Heterogeneous Media ◽  
Transversely Isotropic ◽  
Local Fields ◽  
Stress Fields ◽  
Cylindrical Shape ◽  
Thermal Expansion Coefficients ◽  
Decomposition Procedure ◽  
Transverse Geometry ◽  
Expansion Coefficients

Exact expressions are found for overall thermal expansion coefficients of a composite medium consisting of three perfectly-bonded transversely isotropic phases of cylindrical shape and arbitrary transverse geometry. The results show that macroscopic thermal expansion coefficients depend only on the thermoelastic constants and volume fractions of the phases, and on the overall compliance. The derivation is based on a decomposition procedure which indicates that spatially uniform elastic strain fields can be created in certain heterogeneous media by superposition of uniform phase thermal strains with local strains caused by piecewise uniform stress fields, which are in equilibrium with prescribed surface tractions. The procedure also allows evaluation of thermal stress fields in the aggregate in terms of known local fields caused by axisymmetric overall stresses. Finally, averages of local fields are found with the help of known mechanical stress and strain concentration factors.

Influence of Cr deficiency on sintering, thermal expansion and electrical properties of La0.75Sr0.25Cr1−xO3−δ as a SOFC interconnect material

2016 ◽  
Vol 30 (11) ◽  
pp. 1650127 ◽  
Author(s):  
Yi Ren ◽  
Wen Ma ◽  
Xiaoying Li ◽  
Jun Wang ◽  
Yu Bai ◽  
...  
Keyword(s):  
Thermal Expansion ◽  
Electrical Properties ◽  
Perovskite Phase ◽  
Ignition Process ◽  
Thermal Expansion Coefficients ◽  
Auto Ignition ◽  
Pure Perovskite Phase ◽  
Maximum Conductivity ◽  
Expansion Coefficients ◽  
Interconnect Material

The SOFC interconnect materials La[Formula: see text]Sr[Formula: see text]Cr[Formula: see text]O[Formula: see text] [Formula: see text]–[Formula: see text] were prepared using an auto-ignition process. The influences of Cr deficiency on their sintering, thermal expansion and electrical properties were investigated. All the samples were pure perovskite phase after sintering at 1400[Formula: see text]C for 4 h. The cell volume of La[Formula: see text]Sr[Formula: see text]Cr[Formula: see text]O[Formula: see text] decreased with increasing Cr deficient content. The relative density of the sintered bulk samples increased from 93.2% [Formula: see text] to a maximum value of 94.7% [Formula: see text] and then decreased to 87.7% [Formula: see text]. The thermal expansion coefficients of the sintered bulk samples were in the range of [Formula: see text]–[Formula: see text] (30–1000[Formula: see text]C), which are compatible with that of YSZ. Among the investigated samples, the sample with 0.02 Cr deficiency had a maximum conductivity of 40.4 Scm[Formula: see text] and the lowest Seebeck coefficient of 154.8 [Formula: see text]VK[Formula: see text] at 850[Formula: see text]C in pure He. The experimental results indicate that La[Formula: see text]Sr[Formula: see text]Cr[Formula: see text]O[Formula: see text] has the best properties and is much suitable for SOFC interconnect material application.

Novel Silicon-Elastomers for Advanced Soft Lithography

2006 ◽  
Vol 947 ◽  
Author(s):  
Kyung Choi
Keyword(s):  
Thermal Expansion ◽  
High Resolution ◽  
Soft Lithography ◽  
Materials Properties ◽  
Nano Scale ◽  
Thermal Expansion Coefficients ◽  
High Thermal Expansion ◽  
Expansion Coefficients

ABSTRACTHigh resolution pattern transfers in the nano-scale regime have been considerable challenges in ‘soft lithography’ to achieve nanodevices with enhanced performances. In this technology, the resolution of pattern integrations is significantly rely on the materials' properties of polydimethylsiloxane (PDMS) stamps. Since commercial PDMS stamps have shown limitations in nano-scale resolution soft lithography due to their low physical toughness and high thermal expansion coefficients, we developed stiffer, photocured PDMS silicon elastomers designed, specifically for nano-sized soft lithography and photopatternable nanofabrications.

Thermal expansion coefficients of NH4ReO4and NH4IO4down to 58 K

1985 ◽  
Vol 82 (3) ◽  
pp. 1611-1612 ◽  
Author(s):  
Stanley L. Segel ◽  
H. Karlsson ◽  
T. Gustavson ◽  
K. Edstrom
Keyword(s):  
Thermal Expansion ◽  
Thermal Expansion Coefficients ◽  
Expansion Coefficients

scholarly journals Organizing Cells Within Non-Periodic Microarchitectured Materials That Achieve Graded Thermal Expansions

2015 ◽  
Author(s):  
Jonathan B. Hopkins ◽  
Lucas A. Shaw ◽  
Todd H. Weisgraber ◽  
George R. Farquar ◽  
Christopher D. Harvey ◽  
...  
Keyword(s):  
Finite Element Analysis ◽  
Thermal Expansion ◽  
Young’S Modulus ◽  
Young's Modulus ◽  
Element Analysis ◽  
Thermal Expansion Coefficients ◽  
Large Lattice ◽  
Unit Cells ◽  
Expansion Coefficients ◽  
Bulk Behavior

The aim of this paper is to introduce an approach for optimally organizing a variety of different unit cell designs within a large lattice such that the bulk behavior of the lattice exhibits a desired Young’s modulus with a graded change in thermal expansion over its geometry. This lattice, called a graded microarchitectured material, can be sandwiched between two other materials with different thermal expansion coefficients to accommodate their different expansions or contractions caused by changing temperature while achieving a desired uniform stiffness. First, this paper provides the theory necessary to calculate the thermal expansion and Young’s modulus of large multi-material lattices that consist of periodic (i.e., repeating) unit cells of the same design. Then it introduces the theory for calculating the graded thermal expansions of a large multimaterial lattice that consists of non-periodic unit cells of different designs. An approach is then provided for optimally designing and organizing different unit cells within a lattice such that both of its ends achieve the same thermal expansion as the two materials between which the lattice is sandwiched. A MATLAB tool is used to generate images of the undeformed and deformed lattices to verify their behavior and various examples are provided as case studies. The theory provided is also verified and validated using finite element analysis and experimentation.

scholarly journals Temperature-dependent structural behaviour of samarium cobalt oxide

2017 ◽  
Vol 32 (S2) ◽  
pp. S38-S42
Author(s):  
Matthew R. Rowles ◽  
Cheng-Cheng Wang ◽  
Kongfa Chen ◽  
Na Li ◽  
Shuai He ◽  
...  
Keyword(s):  
Thermal Expansion ◽  
Cobalt Oxide ◽  
Sol Gel ◽  
Linear Thermal Expansion ◽  
Rietveld Analysis ◽  
Structural Behaviour ◽  
Temperature Dependent ◽  
Thermal Expansion Coefficients ◽  
Expansion Coefficients ◽  
Sol Gel Synthesis

The crystal structure and thermal expansion of the perovskite samarium cobalt oxide (SmCoO3) have been determined over the temperature range 295–1245 K by Rietveld analysis of X-ray powder diffraction data. Polycrystalline samples were prepared by a sol–gel synthesis route followed by high-temperature calcination in air. SmCoO3 is orthorhombic (Pnma) at all temperatures and is isostructural with GdFeO3. The structure was refined as a distortion mode of a parent $ Pm{\bar 3}m $ structure. The thermal expansion was found to be non-linear and anisotropic, with maximum average linear thermal expansion coefficients of 34.0(3) × 10−6, 24.05(17) × 10−6, and 24.10(18) × 10−6 K−1 along the a-, b-, and c-axes, respectively, between 814 and 875 K.

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