Comparison of Nickel Nanoparticle-Assisted Diffusion Brazing of Stainless Steel to Conventional Diffusion Brazing and Bonding Processes

2010 ◽  
Vol 132 (3) ◽  
Author(s):  
S. K. Tiwari ◽  
B. K. Paul
Keyword(s):  
Stainless Steel ◽  
Bond Strength ◽  
Diffusion Bonding ◽  
Transient Liquid Phase ◽  
Bond Line ◽  
Scanning Electron Micrographs ◽  
Secondary Phases ◽  
Bonding Pressure ◽  
Nickel Nanoparticle ◽  
Diffusion Brazing

Transient liquid phase diffusion brazing is used in precision, hermetic joining applications as a replacement for diffusion bonding to reduce cycle times, reduce bonding pressure, and improve yields. In the present study, stainless steel 316L laminae are diffusion brazed with an interlayer of nickel nanoparticles and compared with samples joined by conventional diffusion bonding and electroplated nickel-phosphorous diffusion brazing. Comparison is made with regard to microstructural evolution, diffusional profile, and bond strength. All bonding was carried out in a uni-axial vacuum hot press at 1000°C with a heating rate of 10°C/min, a dwell time of 2 h and a bonding pressure of 10 MPa. Bond strength measurements show that the sample brazed with a nickel nanoparticle interlayer has the lowest void fraction at 4.8±0.9% and highest shear strength at 141.3±7.0 MPa. Wavelength dispersive spectroscopic analysis of sample cross-sections shows substantial diffusion of Ni and Fe across the nickel nanoparticle bond line. Scanning electron micrographs show no secondary phases along the nickel nanoparticle bond line.

Application of Nickel Nanoparticles in Diffusion Bonding of Stainless Steel Surfaces

2008 ◽  
Author(s):  
Santosh K. Tiwari ◽  
Brian K. Paul
Keyword(s):  
Electron Microscopy ◽  
Stainless Steel ◽  
Bond Strength ◽  
Microstructure Evolution ◽  
Nickel Nanoparticles ◽  
Transient Liquid Phase ◽  
Bond Line ◽  
Stainless Steel 316L ◽  
Bonding Pressure ◽  
Wavelength Dispersive Spectroscopy

In this study, the effect of nickel nanoparticles (NiNPs) interlayer application to transient liquid-phase diffusion brazing was investigated. The primary focus was to bond stainless steel 316L laminae in a stack using a Nickel nanoparticles interlayer and to compare the bond line of the sample with the conventionally bonded and nickel-phosphorous interlayer (NiP) brazed samples for microstructure evolution and bond strength. The bonding was carried out in a vacuum hot press and the bonding parameters were kept same for all the samples: bonding temperatures 1000°C, bonding pressure 1000 psi, heating rate 10°C/min and dwell time of 2 hrs. The cross sections of the bonded samples were investigated for microstructure evolution using optical microscopy and scanning electron microscopy (SEM). The inter-diffusion of the diffusing species across the bond line (interface) was evaluated by wavelength dispersive spectroscopy (WDS). X-ray diffraction technique (XRD) is proposed to determine the formation of any brittle intermetallic phases along the bond line and transmission electron microscopy (TEM) to confirm the same. Bond strength will be measured with the help of samples bonded according to ASTM standards.

Exhibition of veiled features in diffusion bonding of titanium alloy and stainless steel via copper

2017 ◽  
Vol 115 (1) ◽  
pp. 115 ◽  
Author(s):  
Gopinath Thirunavukarasu ◽  
Sukumar Kundu ◽  
Tapas Laha ◽  
Deb Roy ◽  
Subrata Chatterjee
Keyword(s):  
Stainless Steel ◽  
Diffusion Bonding ◽  
Pure Copper ◽  
Bonding Time ◽  
304 Stainless Steel ◽  
Time Interval ◽  
Reaction Products ◽  
Bonding Pressure ◽  
Ternary Intermetallic Compounds ◽  
Cu Foil

An investigation was carried out to know the extent of influence of bonding-time on the interface structure and mechanical properties of diffusion bonding (DB) of TiA|Cu|SS. DB of Ti6Al4V (TiA) and 304 stainless steel (SS) using pure copper (Cu) of 200-μm thickness were processed in vacuum using 4-MPa bonding-pressure at 1123 K from 15 to 120 min in steps of 15 min. Preparation of DB was not possible when bonding-time was less than 60 min as the bonding at Cu|SS interface was unsuccessful in spite of effective bonding at TiA|Cu interface; however, successful DB were produced when the bonding-time was 60 min and beyond. DB processed for 60 and 75 min (classified as shorter bonding-time interval) showed distinctive characteristics (structural, mechanical, and fractural) as compared to the DB processed for 90, 105, and 120 min (classified as longer bonding-time interval). DB processed for 60 and 75 min exhibited layer-wise Cu–Ti-based intermetallics at TiA|Cu interface, whereas Cu|SS interface was completely free from reaction products. The layer-wise structure of Cu–Ti-based intermetallics were not observed at TiA|Cu interface in the DB processed for longer bonding-time; however, the Cu|SS interface had layer-wise ternary intermetallic compounds (T1, T2, and T3) of Cu–Fe–Ti-based along with σ phase depending upon the bonding-time chosen. Diffusivity of Ti-atoms in Cu-layer (DTi in Cu-layer) was much greater than the diffusivity of Fe-atoms in Cu-layer (DFe in Cu-layer). Ti-atoms reached Cu|SS interface but Fe-atoms were unable to reach TiA|Cu interface. It was observed that DB fractured at Cu|SS interface when processed for shorter bonding-time interval, whereas the DB processed for longer bonding-time interval fractured apparently at the middle of Cu-foil region predominantly due to the existence of brittle Cu–Fe–Ti-based intermetallics.

Corrosion Behavior of the Transient Liquid Phase Diffusion Bonding Joint of TiNi Shape Memory Alloy and Stainless Steel in Hanks' Solution

2013 ◽  
Vol 750-752 ◽  
pp. 739-742
Author(s):  
Ying Ling Wang ◽  
Qiu Zhi Gao ◽  
Gui Fang Sun ◽  
Jie Ye
Keyword(s):  
Stainless Steel ◽  
Corrosion Resistance ◽  
Liquid Phase ◽  
Shape Memory Alloy ◽  
Shape Memory ◽  
Corrosion Behavior ◽  
Pitting Corrosion ◽  
Diffusion Bonding ◽  
Transient Liquid Phase ◽  
Phase Diffusion

The transient liquid phase diffusion bonding (TLP-DB) was employed to join TiNi shape memory alloy (SMA) and stainless steel (SS) with an interlayer metal of Ag-Cu eutectic metal foil.The corrosion behavior of the TLP-DB joint in Hanks solution at 37°C was investigated by electrochemical methods.The results show that the corrosion resistance of the joint is comparable to, but lower than that of base metals during the early anodic polarization, and the corrosion rate of the joint is between that of TiNi SMA and SS in the transpassive region at high potentials. The corrosion resistance of the specimens in Hanks' solution is associated with the surface quality, mircotructure and the intermetallics. Both TiNi SMA and SS display the characteristics of localized corrosion with a little pitting corrosion, while the joints mainly show the characteristics of pitting corrosion concentrated on the enrichment Cu phases.

scholarly journals Gallium-assisted diffusion bonding of stainless steel to titanium; microstructural evolution and bond strength

Materialia ◽  
2018 ◽  
Vol 4 ◽  
pp. 115-126 ◽  
Author(s):  
Amir A. Shirzadi ◽  
Arijit Laik ◽  
Raghvendra Tewari ◽  
Jonathan Orsborn ◽  
Gautam K. Dey
Keyword(s):  
Stainless Steel ◽  
Bond Strength ◽  
Microstructural Evolution ◽  
Diffusion Bonding

scholarly journals Diffusion Bonding and Transient Liquid Phase (TLP) Bonding of Type 304 and 316 Austenitic Stainless Steel—A Review of Similar and Dissimilar Material Joints

Metals ◽  
2020 ◽  
Vol 10 (5) ◽  
pp. 613 ◽  
Author(s):  
Abdulaziz AlHazaa ◽  
Nils Haneklaus
Keyword(s):  
Stainless Steel ◽  
Solid State ◽  
Liquid Phase ◽  
Austenitic Stainless Steel ◽  
Diffusion Bonding ◽  
Transient Liquid Phase ◽  
Dissimilar Material ◽  
Solid State Diffusion ◽  
Tlp Bonding ◽  
State Diffusion

Similar and dissimilar material joints of AISI grade 304 (1.4301) and AISI grade 316 (1.4401) austenitic stainless steel by solid state diffusion bonding and transient liquid phase (TLP) bonding are of interest to academia and industry alike. Appropriate bonding parameters (bonding temperature, bonding time, and bonding pressure) as well as suitable surface treatments, bonding atmosphere (usually high vacuum or protective gas) and interlayers are paramount for successful bonding. The three main parameters (temperature, time, and pressure) are interconnected in a strong non-linear way making experimental data important. This work reviews the three main parameters used for solid state diffusion bonding, TLP bonding and to a smaller degree hot isostatic pressing (HIP) of AISI grade 304 and AISI grade 316 austenitic stainless steel to the aforementioned materials (similar joints) as well as other materials, namely commercially pure titanium, Ti-6A-4V, copper, zircaloy and other non-ferrous metals and ceramic materials (dissimilar joints).

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