Thermal Investigation and Placement Design of High-Brightness LED Array Package on PCB for Uniform Illuminance

2011 ◽  
Vol 133 (1) ◽  
Author(s):  
K. C. Yung ◽  
H. Liem ◽  
H. S. Choy ◽  
W. K. Lun
Keyword(s):  
Surface Temperature ◽  
Printed Circuit Board ◽  
Cfd Simulation ◽  
Light Emitting Diode ◽  
Circuit Board ◽  
Heat Transfer Analysis ◽  
Significant Drop ◽  
High Brightness ◽  
Light Emitting ◽  
Led Array

This paper reports the thermal performance of a high-brightness light-emitting diode (LED) array package with a novel placement method on a printed circuit board (PCB). The precise heat transfer analysis and modeling using computational fluid dynamics (CFD) were performed according to the practical working conditions of the LED array. Emphasis was placed upon investigating how the temperature of the surface of LEDs changed in accordance with different placement methods. A significant drop in the surface temperature of the LEDs was found when the triangular and arithmetic spacing placement methods were used; hence, the overall heat dissipating capability of the LED array to the PCB was improved. By optimizing the placement design, the average surface temperature of the LED array achieved a decrease of about 20%, from 120°C to 100°C. The illuminance level of each placement design was measured and compared. Both CFD simulation and experimental results are provided to demonstrate the efficacy of the proposed approach for LED array thermal management.

Temperature and Humidity Dependent Reliability Analysis of RGB LED Chips

2006 ◽  
Author(s):  
Jun-Xian Fu ◽  
Shukri Souri ◽  
James S. Harris
Keyword(s):  
Reliability Analysis ◽  
Printed Circuit Board ◽  
Light Emitting Diode ◽  
Circuit Board ◽  
Light Emitting ◽  
Printed Circuit ◽  
Root Cause ◽  
Micro Cracks ◽  
Temperature And Humidity

Abstract Temperature and humidity dependent reliability analysis was performed based on a case study involving an indicator printed-circuit board with surface-mounted multiple-die red, green and blue light-emitting diode chips. Reported intermittent failures were investigated and the root cause was attributed to a non-optimized reflow process that resulted in micro-cracks and delaminations within the molding resin of the chips.

PENGARUH DIMENSI GEOMETRIK LAMPU LED TERHADAP PERSEPSI KECERAHAN

2013 ◽  
Vol 3 (2) ◽  
pp. 41
Author(s):  
Andrea Marisi ◽  
Revantino Revantino
Keyword(s):  
Solid State ◽  
Printed Circuit Board ◽  
Light Emitting Diode ◽  
Circuit Board ◽  
Solid State Lighting ◽  
Light Emitting ◽  
Printed Circuit ◽  
Surface Mounting

Perkembangan teknologi di bidang Solid State Lighting selama dekade terakhir membuat diversifikasi penggunaan Light Emitting Diode untuk pelayanan pencahayaan umum. Balai Besar Bahan dan Barang Teknik sejak tahun 2011 telah melakukan penelitian dan pengembangan lampu LED berbasis Surface Mounting Device (SMD) 5050. Pada perancangan Printed Circuit Board (PCB) untuk memasangkan LED-smd tersebut, dilakukan analisis dimensi geometrik yang optimal sehingga dapat memancarkan cahaya ke segala arah dan memberikan persepsi kecerahan yang lebih baik. Untuk perancangan PCB tersebut, dipilih 2 (dua) model berbentuk silinder dengan memperhatikan rasio antara tinggi dan diameter alas. Dari pendekatan sumber titik dan perhitungan eksitansi luminus, diperoleh bahwa model dengan rasio ≈ 1 menghasilkan persepsi lebih cerah terhadap visual manusia.Kata kunci : dimensi geometrik, pendekatan sumber titik, eksitansi luminus, persepsi kecerahan

Chip-On-ACB (Anodized Circuit Board) Package for High Power Light-Emitting Diode

2006 ◽  
Vol 3 (2) ◽  
pp. 67-72
Author(s):  
Kyuho Shin ◽  
Suho Shin ◽  
Soon Cheol Kweon ◽  
Kihwan Kwon ◽  
Seogmoon Choi ◽  
...  
Keyword(s):  
Dielectric Layer ◽  
Heat Dissipation ◽  
Printed Circuit Board ◽  
Light Emitting Diode ◽  
Circuit Board ◽  
Electric Signal ◽  
Anodized Aluminum ◽  
Metal Base ◽  
Light Emitting ◽  
Aluminum Oxide Layer

A new light-emitting diode (LED) package module based on anodized circuit board (ACB) is developed in this study. ACB represents the selectively anodized aluminum board, in which the aluminum oxide layer, formed by anodizing process, serves as a dielectric layer and the electric signal lines are formed on it. LED chips can be directly attached to the metal pads on the aluminum core of ACB, which acts as p-electrode and at the same time easily spreads out the heat generated from the chips. The use of ACB in LED packaging has the benefit that ACB provides an excellent heat dissipation path from junction to board. This characteristic cannot be obtained from metal-core printed circuit board (MC-PCB), because it inevitably has a dielectric layer for electrical insulation of signal lines from metal base, which acts as a blocking layer in the heat path. By using the thermal transient method, the thermal resistance of the LED package (from junction to board) is measured to be about 4 °C/W. Also, we have performed the simulation of heat conduction, of which the results agree well with the experimental results. This chip-on-ACB LED package module has a potential application as a back light unit for display panel.

scholarly journals Machine vision based in-process light-emitting diode chip mounting system

2018 ◽  
Vol 51 (7-8) ◽  
pp. 293-303 ◽  
Author(s):  
Chao-Ching Ho ◽  
You-Min Chen ◽  
Po-Chieh Li
Keyword(s):  
Machine Vision ◽  
Printed Circuit Board ◽  
Vision System ◽  
Light Emitting Diode ◽  
Circuit Board ◽  
Robot Arm ◽  
Light Emitting ◽  
Printed Circuit ◽  
Delta Robot ◽  
A Charge

Background: In this study, a machine vision–based method was developed for automated in-process light-emitting diode chip mounting lines with position uncertainty. In order to place the tiny light-emitting diode chips on the pattern of a printed circuit board, a highly accurate mounting process is achieved with online feedback of the visual assistance. Methods: The system consists of a charge-coupled device camera, a six-axis robot arm, and a delta robot. The lighting system is a critical point for the in-process machine vision problem. Hence, designing the optimal lighting solution is one of the most difficult parts of a machine vision system, and several lighting techniques and experiments are examined in this study. In order to commence the mounting process, the light-emitting diode chip targets inside the camera field were identified and used to guide the delta robot to the grabbing zone based on the calibrated homography transformation. Efforts have been focused on the field of machine vision–based feature extraction of the chip pins and the holes on the printed circuit board. The correspondence of each other is determined by the position of the chip pins and the printed circuit board circuit pattern. The image acquisition is achieved directly online in real time. The image analysis algorithm must be sufficiently fast to follow the production rate. In order to compensate for the uncertainty of the light-emitting diode chip mounting process, a visual feedback strategy in conjunction with an uncertainty compensation strategy is employed. Results: Finally, the light-emitting diode chip was automatically grabbed and accurately placed at the desired positions. Conclusion: On-line and off-line experiments were conducted to investigate the performance of the vision system with respect to detecting and mounting light-emitting diode chips.

Maker Chemistry: Exploring Redox Reactions in Introductory Laboratory through Light-Emitting Diode Printed Circuit Board Fabrication

2019 ◽  
Vol 97 (2) ◽  
pp. 490-496
Author(s):  
Scott L. Wallen ◽  
Jaspreet Dhau ◽  
Robert Green ◽  
Laura B. Wemple ◽  
Troy Kelly ◽  
...  
Keyword(s):  
Redox Reactions ◽  
Printed Circuit Board ◽  
Light Emitting Diode ◽  
Circuit Board ◽  
Light Emitting ◽  
Printed Circuit

Enhancement of the Optical Performances for the LED Backlight Systems with a Novel Dual Lens-Cap

2007 ◽  
Vol 364-366 ◽  
pp. 132-137
Author(s):  
Paul C.P. Chao ◽  
Lun De Liao ◽  
Chi Wei Chiu ◽  
Chien Yu Shen
Keyword(s):  
Light Source ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Dual Cone ◽  
High Brightness ◽  
Light Emitting ◽  
Lower Power ◽  
Printed Circuit ◽  
High Uniformity ◽  
Led Backlight

A novel dual-cone-shaped side-emitting lens cap for High Brightness Light Emitting Diodes (HB-LEDs) is proposed for improving brightness and high uniformity of the direct LED backlight Units (BLUs) for large-sized LCD-TVs. Combining the designed lens cap with red, green and blue (RGB) chips on a Metal Core Printed Circuit Board (MCPCB), the LED module with the proposed cap is able to provide a compact white light source with unique features such as instant color variability and lower power usage, etc. The dual-cone-shaped of the proposed lens cap is designed to emit most of the light rays to the sides, only a small portion of light upward along the optical axis of the lens, providing a uniform luminance distribution and the high brightness on the backlight. In addition, a small reflective surface in semi-circular shape is designed and placed upon the proposed LED module about 10mm, the surfaces of which are attached with reflective films to increase the level of light mixing in the larger, global reflector optical box. With the structure of the LED module well designed, the LED backlight Module would be designed for the large-sized LCDTV using the fewer number of LEDs to lead to lower power consumption. The results indeed identify the attributes of the BLU, which make it possible to achieve excellent backlight performance using a direct illumination approach from the light source of “Dual-Cone-Shaped Side- Emitting Lens Cap of LEDs.”

scholarly journals Design and Development of Temperature and Humidity Monitoring System

2019 ◽  
Author(s):  
R N Sonawane ◽  
A S Ghule ◽  
A P Bowlekar ◽  
A H Zakane
Keyword(s):  
Monitoring System ◽  
Printed Circuit Board ◽  
Liquid Crystal Display ◽  
Light Emitting Diode ◽  
Field Testing ◽  
Circuit Board ◽  
Light Emitting ◽  
Temperature And Humidity ◽  
Sd Card ◽  
Humidity Monitoring

The temperature and humidity monitoring system was developed using various components viz., Arduino Uno, DHT11 sensor, universal serial bus (USB) type B cable, adaptor, DC power jack, 9-V battery connector, 9-V DC battery, resistor, liquid-crystal display (LCD) screen, trimmer potentiometer, light-emitting diode (LED) bulbs, jumper wires, micro secure digital (SD) card module, printed circuit board (PCB), etc. The field testing of the developed temperature and humidity monitoring system was carried out at various locations of the college campus. It was observed that the system worked between the percent variation of 0–8.00% for temperature and 0–5.97% for humidity. The developed system showed the accuracy of ±2°C for temperature and ±4% for humidity. The total cost incurred for the development of temperature and humidity monitoring system along with all accessories was ₹1625.

Heat Transfer Analysis and Design Optimization of ALOX High Brightness Light Emitting Diode Package

2007 ◽  
Author(s):  
Shan Gao ◽  
Jupyo Hong ◽  
Sanghyun Choi ◽  
Seogmoon Choi ◽  
Sung Yi
Keyword(s):  
Heat Transfer ◽  
Thermal Properties ◽  
Thermal Resistance ◽  
Light Emitting Diode ◽  
Aluminum Substrate ◽  
Heat Transfer Analysis ◽  
Flux Analysis ◽  
High Brightness ◽  
Light Emitting ◽  
Analysis And Design

High Brightness (HB) Light emitting diode (LED) technology is becoming the choice for many lighting applications. However, one potential problem with LED based lighting systems is the thermal issue during service, which has restricted LED in the application of mini-devices. In this study, thermal performance of Al2O3 (ALOX) based HBLED package is considered. Steady state heat transfer analysis is carried out using 3-D finite element method (FEM). A new algorithm has firstly been developed, which combines FEM analysis and thermal transient experimental investigation, to determine the interfacial thermal properties of the package. Then the interfacial thermal properties are applied in the FEM model for heat transfer analysis. Temperature distribution and heat flux analysis are calculated and thermal resistance of the package is determined based on the FEM simulation. The results show that die attachment (solder material) plays the most important role in the thermal resistance of the ALOX package, i.e., it takes about 80% of the total thermal resistance. In addition, thermal resistance of the package is mainly caused by the interfacial thermal resistances, the behavior of which depends strongly on manufacturing processes. The parametric study shows that Al2O3 isolation ring increases the thermal resistance of the package because it creates an interface inside the aluminum substrate. Pure Aluminum substrate achieves a better performance in the respect of thermal behavior of packaging designs.

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