Heat Transfer and Pressure Drop Characteristics of Finned Metal Foam Heat Sinks Under Uniform Impinging Flow

2015 ◽  
Vol 137 (2) ◽  
Author(s):  
S. S. Feng ◽  
J. J. Kuang ◽  
T. J. Lu ◽  
K. Ichimiya
Keyword(s):  
Pressure Drop ◽  
Thermal Performance ◽  
Metal Foam ◽  
Channel Length ◽  
Heat Sinks ◽  
Channel Parameters ◽  
Conventional Plate ◽  
Fin Thickness ◽  
Nusselt Number Correlation ◽  
Impinging Flow

A numerical investigation was carried out to characterize the thermal performance of finned metal foam heat sinks subject to an impinging air flow. The main objective of the study was to quantify the effects of all relevant configurational parameters (channel length, channel width, fin thickness, and fin height) of the heat sink upon the thermal performance. Open-cell aluminum foam having fixed porosity of 0.9118 and fixed pore density of five pores per inch (PPI) was used in the study. A previously validated model based on the porous medium approach was employed for the numerical simulation. Various simulation cases for different combinations of channel parameters were carried out to obtain the Nusselt number correlation. Based on the inviscid impinging flow, a pressure drop correlation was derived for impinging flow in finned metal foam heat sinks. By using these correlations, the thermal performance of finned metal foam heat sinks was compared with the conventional plate-fin heat sinks. It was demonstrated that the finned metal foam heat sinks outperformed the plate-fin heat sinks on the basis of given weight or given pumping power.

scholarly journals Evaluation of Active Heat Sinks Design under Forced Convection—Effect of Geometric and Boundary Parameters

Materials ◽  
2021 ◽  
Vol 14 (8) ◽  
pp. 2041
Author(s):  
Eva C. Silva ◽  
Álvaro M. Sampaio ◽  
António J. Pontes
Keyword(s):  
Fluid Dynamics ◽  
Computational Fluid Dynamics ◽  
Additive Manufacturing ◽  
Pressure Drop ◽  
Forced Convection ◽  
Thermal Performance ◽  
Heat Sinks ◽  
Trapezoidal Shape ◽  
Computational Fluid Dynamics Simulations ◽  
Dynamics Simulations

This study shows the performance of heat sinks (HS) with different designs under forced convection, varying geometric and boundary parameters, via computational fluid dynamics simulations. Initially, a complete and detailed analysis of the thermal performance of various conventional HS designs was taken. Afterwards, HS designs were modified following some additive manufacturing approaches. The HS performance was compared by measuring their temperatures and pressure drop after 15 s. Smaller diameters/thicknesses and larger fins/pins spacing provided better results. For fins HS, the use of radial fins, with an inverted trapezoidal shape and with larger holes was advantageous. Regarding pins HS, the best option contemplated circular pins in combination with frontal holes in their structure. Additionally, lattice HS, only possible to be produced by additive manufacturing, was also studied. Lower temperatures were obtained with a hexagon unit cell. Lastly, a comparison between the best HS in each category showed a lower thermal resistance for lattice HS. Despite the increase of at least 38% in pressure drop, a consequence of its frontal area, the temperature was 26% and 56% lower when compared to conventional pins and fins HS, respectively, and 9% and 28% lower when compared to the best pins and best fins of this study.

Numerical Prediction of Thermal Performance of Water Cooled Multi-Stack Microchannel Heat Sink with Counterflow Arrangement

2011 ◽  
Vol 8 (1) ◽  
pp. 16-22 ◽  
Author(s):  
Pradeep Hegde ◽  
Mukesh Patil ◽  
K. N. Seetharamu
Keyword(s):  
Finite Element ◽  
Pressure Drop ◽  
Thermal Resistance ◽  
Thermal Performance ◽  
Heat Sink ◽  
Element Model ◽  
Channel Length ◽  
Computational Time ◽  
Microchannel Heat Sink ◽  
Method Performance

Thermal performance of a water cooled multistack microchannel heat sink with counterflow arrangement has been analyzed using the finite element method. Performance parameters such as thermal resistance, pressure drop, and pumping power are computed for a typical counterflow heat sink with different number of stacks. The temperature distribution in a typical multistack counterflow microchannel heat sink is obtained for different numbers of stacks and plotted along the channel length. A parametric study involving the effects of number of stacks and channel aspect ratio on thermal resistance and pressure drop of the heat sink is done. The finite element model developed for the analysis is simple and consumes less computational time.

Finned Metal Foam Heat Sinks for Electronics Cooling in Forced Convection

2002 ◽  
Vol 124 (3) ◽  
pp. 155-163 ◽  
Author(s):  
A. Bhattacharya ◽  
R. L. Mahajan
Keyword(s):  
Heat Transfer ◽  
Porous Medium ◽  
Heat Transfer Coefficient ◽  
Pressure Drop ◽  
Transfer Coefficient ◽  
Forced Convection ◽  
Metal Foam ◽  
Experimental Results ◽  
Heat Sinks ◽  
The Heat Transfer Coefficient

In this paper, we present recent experimental results on forced convective heat transfer in novel finned metal foam heat sinks. Experiments were conducted on aluminum foams of 90 percent porosity and pore size corresponding to 5 PPI (200 PPM) and 20 PPI (800 PPM) with one, two, four and six fins, where PPI (PPM) stands for pores per inch (pores per meter) and is a measure of the pore density of the porous medium. All of these heat sinks were fabricated in-house. The forced convection results show that heat transfer is significantly enhanced when fins are incorporated in metal foam. The heat transfer coefficient increases with increase in the number of fins until adding more fins retards heat transfer due to interference of thermal boundary layers. For the 20 PPI samples, this maximum was reached for four fins. For the 5 PPI heat sinks, the trends were found to be similar to those for the 20 PPI heat sinks. However, due to larger pore sizes, the pressure drop encountered is much lower at a particular air velocity. As a result, for a given pressure drop, the heat transfer coefficient is higher compared to the 20 PPI heat sink. For example, at a Δp of 105 Pa, the heat transfer coefficients were found to be 1169W/m2-K and 995W/m2-K for the 5 PPI and 20 PPI 4-finned heat sinks, respectively. The finned metal foam heat sinks outperform the longitudinal finned and normal metal foam heat sinks by a factor between 1.5 and 2, respectively. Finally, an analytical expression is formulated based on flow through an open channel and incorporating the effects of thermal dispersion and interfacial heat transfer between the solid and fluid phases of the porous medium. The agreement of the proposed relation with the experimental results is promising.

scholarly journals Numerical study of metal foam heat sinks under uniform impinging flow

2017 ◽  
Vol 796 ◽  
pp. 012002 ◽  
Author(s):  
A Andreozzi ◽  
N Bianco ◽  
M Iasiello ◽  
V Naso
Keyword(s):  
Metal Foam ◽  
Numerical Study ◽  
Heat Sinks ◽  
Impinging Flow

scholarly journals Numerical Study of Double-Layered Microchannel Heat Sinks with Different Cross-Sectional Shapes

Entropy ◽  
2018 ◽  
Vol 21 (1) ◽  
pp. 16 ◽  
Author(s):  
Daxiang Deng ◽  
Guang Pi ◽  
Weixun Zhang ◽  
Peng Wang ◽  
Ting Fu
Keyword(s):  
Pressure Drop ◽  
Thermal Resistance ◽  
Thermal Performance ◽  
Numerical Study ◽  
Heat Sinks ◽  
High Heat Flux ◽  
Pumping Power ◽  
Cross Sectional ◽  
Prime Concern ◽  
Microchannel Heat Sinks

This work numerically studies the thermal and hydraulic performance of double-layered microchannel heat sinks (DL-MCHS) for their application in the cooling of high heat flux microelectronic devices. The superiority of double-layered microchannel heat sinks was assessed by a comparison with a single-layered microchannel heat sink (SL-MCHS) with the same triangular microchannels. Five DL-MCHSs with different cross-sectional shapes—triangular, rectangular, trapezoidal, circular and reentrant Ω-shaped—were explored and compared. The results showed that DL-MCHS decreased wall temperatures and thermal resistance considerably, induced much more uniform wall temperature distribution, and reduced the pressure drop and pumping power in comparison with SL-MCHS. The DL-MCHS with trapezoidal microchannels performed the worst with regard to thermal resistance, pressure drop, and pumping power. The DL-MCHS with rectangular microchannels produced the best overall thermal performance and seemed to be the optimum when thermal performance was the prime concern. Nevertheless, the DL-MCHS with reentrant Ω-shaped microchannels should be selected when pumping power consumption was the most important consideration.

Comparative Study of Thermal Performance of Longitudinal and Transversal-Wavy Microchannel Heat Sinks for Electronic Cooling

2013 ◽  
Vol 135 (2) ◽  
Author(s):  
Gongnan Xie ◽  
Jian Liu ◽  
Yanquan Liu ◽  
Bengt Sunden ◽  
Weihong Zhang
Keyword(s):  
Reynolds Number ◽  
Pressure Drop ◽  
Thermal Resistance ◽  
Cross Section ◽  
Thermal Performance ◽  
Heat Load ◽  
Rectangular Cross Section ◽  
Flow Direction ◽  
Heat Sinks ◽  
Liquid Cooling

Liquid cooling incorporating microchannels are used to cool electronic chips in order to remove more heat load. However, such microchannels are often designed to be straight with rectangular cross section. In this paper, on the basis of straight microchannels having rectangular cross section (SRC), longitudinal-wavy microchannel (LWC), and transversal microchannel (TWC) were designed, respectively, and then the corresponding laminar flow and heat transfer were investigated numerically. Among them, the channel wall of LWC undulates along the flow direction according to a sinusoidal function while the TWC undulates along the transversal direction. The numerical results show that for removing an identical heat load, the overall thermal resistance of the LWC is decreased with increasing inlet Reynolds number while the pressure drop is increased greatly, so that the overall thermal performance of LWC is inferior to that of SRC under the considered geometries. On the contrary, TWC has a great potential to reduce the pressure drop compared to SRC, especially for higher wave amplitudes at the same Reynolds number. Thus the overall thermal performance of TWC is superior to that of SRC. It is suggested that the TWC can be used to cool chips effectively with much smaller pressure drop penalty. In addition to the overall thermal resistance, other criteria of evaluation of the overall thermal performance, e.g., (Nu/Nu0)/(f/f0) and (Nu/Nu0)/(f/f0)1/3, are applied and some controversial results are obtained.

Enhanced Thermal Performance of Internal Y-Shaped Bifurcation Microchannel Heat Sinks With Metal Foams

2017 ◽  
Vol 10 (1) ◽  
Author(s):  
Han Shen ◽  
Xueting Liu ◽  
Hongbin Yan ◽  
Gongnan Xie ◽  
Bengt Sunden
Keyword(s):  
Thermal Management ◽  
Thermal Performance ◽  
Metal Foam ◽  
Electronic Devices ◽  
Metal Foams ◽  
Heat Sinks ◽  
High Power Density ◽  
Pore Density ◽  
Transfer Enhancement ◽  
Microchannel Heat Sinks

Internal Y-shaped bifurcation has been proved to be an advantageous way on improving thermal performance of microchannel heat sinks according to the previous research. Metal foams are known due to their predominate performance such as low-density, large surface area, and high thermal conductivity. In this paper, different parameters of metal foams in Y-shaped bifurcation microchannel heat sinks are designed and investigated numerically. The effects of Reynolds number, porosity of metal foam, and the pore density (PPI) of the metal foam on the microchannel heat sinks are analyzed in detail. It is found that the internal Y-shaped bifurcation microchannel heat sinks with metal foam exhibit better heat transfer enhancement and overall thermal performance. This research provides broad application prospects for heat sinks with metal foam in the thermal management of high power density electronic devices.

Analysis of Flow and Thermal Performance of a Water-Cooled Transversal Wavy Microchannel Heat Sink for Chip Cooling

2012 ◽  
Vol 134 (4) ◽  
Author(s):  
Gongnan Xie ◽  
Jian Liu ◽  
Weihong Zhang ◽  
Bengt Sunden
Keyword(s):  
Pressure Drop ◽  
Cross Section ◽  
Thermal Performance ◽  
Integrated Circuit ◽  
Rectangular Cross Section ◽  
Cooling Capacity ◽  
Heat Sinks ◽  
Liquid Cooling ◽  
Rectangular Microchannel ◽  
Microchannel Heat Sinks

With the increasing output power of the integrated circuit chips, the heat flux involved is being accordingly increased. In such situation, the air has almost reached its limit of cooling capacity, and thus the liquid cooling technology incorporating microchannel heat sinks is desired to cool the electronic chips in order to remove more heat loads. However, these microchannel heat sinks are often designed to be straight with rectangular cross section. In this study, on the basis of a straight microchannel having rectangular cross section, a kind of transversal wavy microchannel is designed and then the laminar flow and heat transfer are investigated numerically. It is shown that for removing the identical load, the transversal wavy microchannel has great potential to reduce pressure drop compared to the straight microchannel, especially for higher wave amplitude at the same Reynolds number, indicating the overall thermal performance of the transversal wavy microchannel is superior to the traditional straight rectangular microchannel. It is suggested such wavy microchannel can be used to cool chips effectively with much smaller pressure drop penalty.

THERMAL PERFORMANCE OF HOLLOW HYBRID FIN HEAT SINKS WITH IMPINGING FLOW

2018 ◽  
Author(s):  
Nico Setiawan Effendi ◽  
Byoung Guk Kim ◽  
Kyoung Joon Kim
Keyword(s):  
Thermal Performance ◽  
Heat Sinks ◽  
Impinging Flow
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