Multi-Objective Design Optimization of Multiple Microchannel Heat Transfer Systems Based on Multiple Prioritized Preferences

2017 ◽  
Vol 9 (2) ◽  
Author(s):  
Po Ting Lin ◽  
Mark Christian E. Manuel ◽  
Jingru Zhang ◽  
Yogesh Jaluria ◽  
Hae Chang Gea
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Optimal Design ◽  
Pressure Drop ◽  
Design Optimization ◽  
Integrated Circuit ◽  
Pareto Frontier ◽  
User Preferences ◽  
Optimization Strategy ◽  
Design Variables

Accelerated development in the field of electronics and integrated circuit technology further pushed the need for better heat dissipating devices with reduced component dimensions. In the design optimization of microchannel heat transfer systems, multiple objectives must be satisfied but correlations limit the satisfaction levels. End users define their preferences associated with the desired quality/quantity of each parameter and specify the priorities among each preference. In this paper, an optimization strategy based on the prioritized performances is developed to find the optimal design variables for the preferences in three different aspects namely: minimized thermal resistances, minimized pressure drop, and maximized heat flux. The preferences are often fuzzy and correlated but can be modeled mathematically using Gaussian membership functions with respect to different levels of user preferences. The overall performances are maximized to find the most favorable solution on the Pareto frontier. Two different types of single-phase liquid cooling (straight and U-shaped microchannel heat sinks) have been utilized as heat exchangers of electronic chips and made as practical examples for the proposed optimization strategy. The optimal design points vary with respect to the priorities of the preferences. The proposed methodology finds the most favored solution on the Pareto frontiers. It is novel to reveal that the chosen significant factors were maximized with results yielding to lower thermal resistance, lower pressure drop, and higher heat flux in the microchannel heat sink based on the design preferences with different priorities.

Embedded Two-Phase Cooling of High Flux Electronics via Micro-Enabled Surfaces and Fluid Delivery Systems (FEEDS)

2015 ◽  
Author(s):  
Raphael Mandel ◽  
Serguei Dessiatoun ◽  
Patrick McCluskey ◽  
Michael Ohadi
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Pressure Drop ◽  
Saturation Temperature ◽  
Absolute Pressure ◽  
High Flux ◽  
Vapor Quality ◽  
Two Phase ◽  
Fluid Delivery ◽  
Future Work

This work presents the experimental design and testing of a two-phase, embedded manifold-microchannel cooler for cooling of high flux electronics. The ultimate goal of this work is to achieve 0.025 cm2-K/W thermal resistance at 1 kW/cm2 heat flux and evaporator exit vapor qualities at or exceeding 90% at less than 10% absolute pressure drop. While the ultimate goal is to obtain a working two-phase embedded cooler, the system was first tested in single-phase mode to validate system performance via comparison of experimentally measured heat transfer coefficient and pressure drop to the values predicted by CFD simulations. Upon validation, the system was tested in two phase mode using R245fa at 30°C saturation temperature and achieved in excess of 1 kW/cm2 heat flux at 45% vapor quality. Future work will focus on increasing the exit vapor quality as well as use of SiC for the heat transfer surface upon completion of current experiments with Si.

A Study on Flow Boiling in Microchannel With Piranha Pin Fin

2015 ◽  
Author(s):  
X. Yu ◽  
C. Woodcock ◽  
Y. Wang ◽  
J. Plawsky ◽  
Y. Peles
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Fluid Flow ◽  
Pressure Drop ◽  
Heat Transfer Performance ◽  
Flow Boiling ◽  
Transfer Performance ◽  
Flow Conditions ◽  
Pin Fin ◽  
Flow And Heat Transfer

In this paper we reported an advanced structure, the Piranha Pin Fin (PPF), for microchannel flow boiling. Fluid flow and heat transfer performance were evaluated in detail with HFE7000 as working fluid. Surface temperature, pressure drop, heat transfer coefficient and critical heat flux (CHF) were experimentally obtained and discussed. Furthermore, microchannels with different PPF geometrical configurations were investigated. At the same time, tests for different flow conditions were conducted and analyzed. It turned out that microchannel with PPF can realize high-heat flux dissipation with reasonable pressure drop. Both flow conditions and PPF configuration played important roles for both fluid flow and heat transfer performance. This study provided useful reference for further PPF design in microchannel for flow boiling.

Experimental Study of Heat Transfer to Supercritical Pressure Water Flowing in a 2×2 Rod Bundle

2014 ◽  
Author(s):  
Han Wang ◽  
Qincheng Bi ◽  
Linchuan Wang ◽  
Haicai Lv ◽  
Laurence K. H. Leung
Keyword(s):  
Heat Transfer ◽  
Experimental Data ◽  
Heat Flux ◽  
Pressure Drop ◽  
Wall Temperature ◽  
Mass Flux ◽  
Heat Fluxes ◽  
Outer Diameter ◽  
Square Channel ◽  
Rod Bundle

An experiment has recently been performed at Xi’an Jiaotong University to study the wall temperature and pressure drop at supercritical pressures with upward flow of water inside a 2×2 rod bundle. A fuel-assembly simulator with four heated rods was installed inside a square channel with rounded corner. The outer diameter of each heated rod is 8 mm with an effective heated length of 600 mm. Experimental parameters covered the pressure of 23–28 MPa, mass flux of 350–1000 kg/m2s and heat flux on the rod surface of 200–1000 kW/m2. According to the experimental data, it was found that the circumferential wall temperature distribution of a heated rod is not uniform. The temperature difference between the maximum and the minimum varies with heat flux and/or mass flux. Heat transfer characteristics of supercritical water in bundle were discussed with respect to various heat fluxes. The effect of heat flux on heat transfer in rod bundles is similar with that in tubes or annuli. In addition, flow resistance reflected in the form of pressure loss has also been studied. Experimental results showed that the total pressure drop increases with bulk enthalpy and mass flux. Four heat transfer correlations developed for supercritical pressures water were compared with the present test data. Predictions of Jackson correlation agrees closely with the experimental data.

scholarly journals Experimental Investigation of Embedded Micropin-Fins for Single-Phase Heat Transfer and Pressure Drop

2018 ◽  
Vol 140 (2) ◽  
Author(s):  
Chirag R. Kharangate ◽  
Ki Wook Jung ◽  
Sangwoo Jung ◽  
Daeyoung Kong ◽  
Joseph Schaadt ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Pressure Drop ◽  
Friction Factor ◽  
Integrated Circuit ◽  
Single Phase ◽  
Absolute Error ◽  
Heat Fluxes ◽  
Operating Conditions ◽  
Working Fluid ◽  
Pin Fin

Three-dimensional (3D) stacked integrated circuit (IC) chips offer significant performance improvement, but offer important challenges for thermal management including, for the case of microfluidic cooling, constraints on channel dimensions, and pressure drop. Here, we investigate heat transfer and pressure drop characteristics of a microfluidic cooling device with staggered pin-fin array arrangement with dimensions as follows: diameter D = 46.5 μm; spacing, S ∼ 100 μm; and height, H ∼ 110 μm. Deionized single-phase water with mass flow rates of m˙ = 15.1–64.1 g/min was used as the working fluid, corresponding to values of Re (based on pin fin diameter) from 23 to 135, where heat fluxes up to 141 W/cm2 are removed. The measurements yield local Nusselt numbers that vary little along the heated channel length and values for both the Nu and the friction factor do not agree well with most data for pin fin geometries in the literature. Two new correlations for the average Nusselt number (∼Re1.04) and Fanning friction factor (∼Re−0.52) are proposed that capture the heat transfer and pressure drop behavior for the geometric and operating conditions tested in this study with mean absolute error (MAE) of 4.9% and 1.7%, respectively. The work shows that a more comprehensive investigation is required on thermofluidic characterization of pin fin arrays with channel heights Hf < 150 μm and fin spacing S = 50–500 μm, respectively, with the Reynolds number, Re < 300.

The effect of single-sided ribs on heat transfer and pressure drop within a trailing edge internal channel of a gas turbine blade

2021 ◽  
pp. 1-43
Author(s):  
Suhyun Kim ◽  
Seungwon Suh ◽  
Seungchan Baek ◽  
Wontae Hwang
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Pressure Drop ◽  
Secondary Flow ◽  
Gas Turbine ◽  
Turbine Blade ◽  
Sharp Corner ◽  
Trailing Edge ◽  
Edge Channel ◽  
Ribbed Channel

Abstract Convective cooling in a gas turbine blade internal trailing edge channel is often insufficient at the sharp trailing edge. This study examines convective heat transfer and pressure drop within a simplified trailing edge channel. The internal passage has been modeled as a right triangular channel with a 9&amp;#176; angle sharp corner. Smooth baseline and ribbed copper plates were heated from underneath via a uniform heat flux heater and examined via infrared thermography. Non-uniformity in the heat flux due to conduction is corrected by a RANS conjugate heat transfer calculation, which was validated by the mean velocity, friction factor, and temperature fields from experiments and LES simulations. Nusselt number distributions illustrate that surface heat transfer is increased considerably with ribs, and coupled with the vortices in the flow. Heat transfer at the sharp corner is increased by more than twofold due to ribs placed at the center of the channel, due to secondary flow. The present partially ribbed channel utilizes secondary flow toward the corner, and is presumed to have better thermal performance than a fully ribbed channel. Thus, it is important to set the appropriate rib length within the channel.

Multiobjective Design Optimization of Microchannel Cooling System Using High Performance Thermal Vias in LTCC Substrates

2013 ◽  
Vol 10 (1) ◽  
pp. 40-47 ◽  
Author(s):  
Aparna Aravelli ◽  
Singiresu S. Rao ◽  
Hari K. Adluru
Keyword(s):  
Heat Transfer ◽  
Design Optimization ◽  
High Performance ◽  
Cooling System ◽  
Optimization Technique ◽  
Optimization Theory ◽  
Thermal Design ◽  
Design Variables ◽  
Microchannel Cooling ◽  
Multiobjective Design

Increased heat generation in semiconductor devices for demanding applications leads to the investigation of highly efficient cooling solutions. Effective options for thermal management include passing of cooling liquid through the microchannel heat sink and using highly conductive materials. In the author's previous work, experimental and computational analyses were performed on LTCC substrates using embedded silver vias and silver columns forming microchannels. This novel technique of embedding silver vias along with forced convection using a coolant resulted in higher heat transfer rates. The present work investigates the design optimization of this cooling system (microheat exchanger) using systems optimization theory. A new multiobjective optimization problem was formulated for the heat transfer in the LTCC model using the log mean temperature difference (LMTD) method of heat exchangers. The goal is to maximize the total heat transferred and to minimize the coolant pumping power. Structural and thermal design variables are considered to meet the manufacturability and energy requirements. Pressure loss and volume of the silver metal are used as constraints. A hybrid optimization technique using sequential quadratic programming (SQP) and branch and bound method of integer programming has been developed to solve the microheat exchanger problem. The optimal design is presented and sensitivity analysis results are discussed.

Performance of Plate Heat Exchangers Used as Refrigerant Liquid-Overfeed Evaporators

2010 ◽  
Author(s):  
Jianchang Huang ◽  
Thomas J. Sheer ◽  
Michael Bailey-McEwan
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Pressure Drop ◽  
Mass Flux ◽  
Heat Exchangers ◽  
Strong Dependence ◽  
Nucleate Boiling ◽  
Small Range ◽  
Plate Heat ◽  
System Pressure

The heat transfer and pressure drop characteristics of plate heat exchangers were measured, when used as refrigerant liquid over-feed evaporators. The three units all had 24 plates but with different chevron-angle combinations of 28°/28°, 28°/60°, and 60°/60°. R134a flowing upwards was used as the refrigerant, in a counter-current arrangement with water flowing on the other side. Heat transfer and pressure drop measurements were made over a range of mass flux, heat flux and corresponding outlet vapour fractions. The effect of system pressure on the evaporator performance was not evaluated due to the small range of evaporating temperature. Experimental data were reduced to obtain the refrigerant-side heat transfer coefficient and frictional pressure drop. The results for heat transfer showed a strong dependence on heat flux and weak dependence on mass flux and vapour fraction. Furthermore, the chevron angle had a small influence on heat transfer but a large influence on frictional pressure drops. Along with observations that were obtained previously on large ammonia and R12 plate evaporators, it is concluded that the dominating heat transfer mechanism in this type of evaporator is nucleate-boiling rather than forced convection. For the two-phase friction factor, various established methods were evaluated; the homogeneous treatment gives good agreement.

Numerical Study of Turbulent Heat Transfer and Pressure Drop Characteristics in a Water-Cooled Minichannel Heat Sink

2006 ◽  
Vol 129 (3) ◽  
pp. 247-255 ◽  
Author(s):  
X. L. Xie ◽  
W. Q. Tao ◽  
Y. L. He
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Pressure Drop ◽  
Wall Thickness ◽  
Heat Sink ◽  
Channel Wall ◽  
High Heat ◽  
Coolant Fluid ◽  
High Heat Flux ◽  
It Industry

With the rapid development of the Information Technology (IT) industry, the heat flux in integrated circuit (IC) chips cooled by air has almost reached its limit at about 100W∕cm2. Some applications in high technology industries require heat fluxes well beyond such a limitation. Therefore, the search for a more efficient cooling technology becomes one of the bottleneck problems of the further development of the IT industry. The microchannel flow geometry offers a large surface area of heat transfer and a high convective heat transfer coefficient. However, it has been hard to implement because of its very high pressure head required to pump the coolant fluid through the channels. A normal channel size could not give high heat flux, although the pressure drop is very small. A minichannel can be used in a heat sink with quite a high heat flux and a mild pressure loss. A minichannel heat sink with bottom size of 20mm×20mm is analyzed numerically for the single-phase turbulent flow of water as a coolant through small hydraulic diameters. A constant heat flux boundary condition is assumed. The effect of channel dimensions, channel wall thickness, bottom thickness, and inlet velocity on the pressure drop, temperature difference, and maximum allowable heat flux are presented. The results indicate that a narrow and deep channel with thin bottom thickness and relatively thin channel wall thickness results in improved heat transfer performance with a relatively high but acceptable pressure drop. A nearly optimized structure of heat sink is found that can cool a chip with heat flux of 350W∕cm2 at a pumping power of 0.314W.

Effects of Taper Configurations on Heat Transfer and Pressure Drop in Single-Phase Flows in Microgaps

2020 ◽  
Author(s):  
Debora C. Moreira ◽  
Gherhardt Ribatski ◽  
Satish G. Kandlikar
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Pressure Drop ◽  
Single Phase ◽  
Bubble Nucleation ◽  
Low Flow ◽  
Working Fluid ◽  
Inlet Temperature ◽  
Inlet Section ◽  
Flow Rates

Abstract This paper presents a comparison of heat transfer and pressure drop during single-phase flows inside diverging, converging, and uniform microgaps using distilled water as the working fluid. The microgaps were created on a plain heated copper surface with a polysulfone cover that was either uniform or tapered with an angle of 3.4°. The average gap height was 400 microns and the length and width dimensions were 10 mm × 10 mm, resulting in an average hydraulic diameter of approximately 800 microns for all configurations. Experiments were conducted at atmospheric pressure and the inlet temperature was set to 30 °C. Heat transfer and pressure drop data were acquired for flow rates varying from 57 to 485 ml/min and the surface temperature was monitored not to exceed 90 °C to avoid bubble nucleation, so the heat flux varied from 35 to 153 W/cm2 depending on the flow rate. The uniform configuration resulted in the lowest pressure drop, and the diverging one showed slightly higher pressure drop values than the converging configuration, possibly because the flow is most constrained at the inlet section, where the fluid is colder and presents higher viscosity. In addition, a minor dependence of pressure drop with heat flux was observed due to temperature dependent properties. The best heat transfer performance was obtained with the converging configuration, which was especially significant at low flow rates. This behavior could be explained by an increase in the heat transfer coefficient due to flow acceleration in converging gaps, which compensates the decrease in temperature difference between the fluid and the surface due to fluid heating along the gap. Overall, the comparison between the three configurations shows that converging microgaps have better performance than uniform or diverging ones for single-phase flows, and such effect is more pronounced at lower flow rates, when the fluid experiences higher temperature changes.

scholarly journals Boiling Heat Transfer From an Array of Round Jets With Hybrid Surface Enhancements

2015 ◽  
Vol 137 (7) ◽  
Author(s):  
Matthew J. Rau ◽  
Suresh V. Garimella ◽  
Ercan M. Dede ◽  
Shailesh N. Joshi
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Pressure Drop ◽  
Flat Surface ◽  
Microporous Layer ◽  
Maximum Heat ◽  
Flow Rates ◽  
Pin Fin ◽  
Pin Fins ◽  
Single Jet

The effect of a variety of surface enhancements on the heat transfer achieved with an array of impinging jets is experimentally investigated using the dielectric fluid HFE-7100 at different volumetric flow rates. The performance of a 5 × 5 array of jets, each 0.75 mm in diameter, is compared to that of a single 3.75 mm diameter jet with the same total open orifice area, in single-and two-phase operation. Four different target copper surfaces are evaluated: a baseline smooth flat surface, a flat surface coated with a microporous layer, a surface with macroscale area enhancement (extended square pin–fins), and a hybrid surface on which the pin–fins are coated with the microporous layer; area-averaged heat transfer and pressure drop measurements are reported. The array of jets enhances the single-phase heat transfer coefficients by 1.13–1.29 times and extends the critical heat flux (CHF) on all surfaces compared to the single jet at the same volumetric flow rates. Additionally, the array greatly enhances the heat flux dissipation capability of the hybrid coated pin–fin surface, extending CHF by 1.89–2.33 times compared to the single jet on this surface, with a minimal increase in pressure drop. The jet array coupled with the hybrid enhancement dissipates a maximum heat flux of 205.8 W/cm2 (heat input of 1.33 kW) at a flow rate of 1800 ml/min (corresponding to a jet diameter-based Reynolds number of 7800) with a pressure drop incurred of only 10.9 kPa. Compared to the single jet impinging on the smooth flat surface, the array of jets on the coated pin–fin enhanced surface increased CHF by a factor of over four at all flow rates.

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