Thermal Design and Characteristics of Thermal Distribution in Process Chamber

2005 ◽  
Author(s):  
Y. H. Zheng ◽  
R. S. Amano
Keyword(s):  
Thermal Model ◽  
Thermal Design ◽  
Computational Fluid Mechanics ◽  
Rapid Manufacturing ◽  
Machine Process ◽  
Future Design ◽  
Critical Effect ◽  
Thermal Distribution ◽  
Numerical Studies ◽  
And Control

Thermal distribution has a critical effect on prototyping accuracy in rapid prototyping and rapid manufacturing. Any uneven thermal distribution in the work bed of the prototyping machine process chamber will result in product distortion. In order to optimize the thermal distribution enhance product accuracy of product and guide future design efforts, a full understanding is necessary, of the characteristics of thermal distribution in the process chamber. This study focuses on how to design and control thermal distribution in the process chamber due to natural convection with experimental and numerical thermal model. For optimal thermal design, the computational fluid mechanics (CFD) approach is one of the most powerful tools. Both experimental and numerical studies of six design configurations for different source heater locations and baffle configurations are presented in this paper.

Experimental and Numerical Study in Thermal Design and Characteristics of Thermal Distribution in the Process Chamber

2003 ◽  
Author(s):  
Y. H. Zheng ◽  
R. S. Amano
Keyword(s):  
Numerical Study ◽  
Thermal Design ◽  
Computational Fluid Mechanics ◽  
Rapid Manufacturing ◽  
Machine Process ◽  
Future Design ◽  
Critical Effect ◽  
Thermal Distribution ◽  
Numerical Studies ◽  
And Control

Thermal distribution has a critical effect on prototyping accuracy in rapid prototyping and rapid manufacturing. Any uneven thermal distribution in the work bed of the prototyping machine process chamber will result in product distortion. In order to optimize the thermal distribution enhance product accuracy of product and guide future design efforts, a full understanding is necessary, of the characteristics of thermal distribution in the process chamber. This study will focus on how to design and control thermal distribution in the process chamber due to natural convection with experimental and numerical thermal model. For optimal thermal design, the computational fluid mechanics (CFD) approach is one of the most powerful tools. Both experimental and numerical studies of six design configurations for different source heater locations and baffle configurations are presented in this paper.

Design and Control of Bypass Condensers

2012 ◽  
Author(s):  
Ranga Nadig ◽  
Michael Phipps
Keyword(s):  
Thermal Design ◽  
Waste To Energy ◽  
Inlet Temperature ◽  
Circulating Water ◽  
Large Shell ◽  
Small Tube ◽  
And Performance ◽  
And Control ◽  
Proper Performance ◽  
Energy Plants

In waste to energy plants and certain genre of cogeneration plants, it is mandatory to condense the steam from the boiler or HRSG in a separate bypass condenser when the steam turbine is out of service. The steam from the boiler or HRSG is attemperated in a pressure reducing desuperheating valve and then condensed in a bypass condenser. To avoid flashing of condensate in downstream piping it is customary to subcool the condensate in the bypass condenser. Circulating water from the steam surface condenser is used to condense the steam in the bypass condenser. Some of the challenges involved in the design of the bypass condenser are: • High shellside design pressure and temperature • Condensate subcooling • Large circulating water (tubeside) flow rate • Relatively low circulating water (tubeside) inlet temperature • Large Log Mean Temperature Difference (LMTD) • Large shell diameters • Small tube lengths The diverse requirements complicate the mechanical and thermal design of the bypass condenser. This paper highlights the complexities in the design and performance of the bypass condenser. Similarities with the design and operation of steam surface condensers and feedwater heater are reviewed. The uniqueness of the bypass condenser’s design and operation are discussed and appropriate solutions to ensure proper performance are suggested.

scholarly journals NUMERICAL THERMAL MODEL OF AN INCANDESCENT LAMP FOR SATELLITES TESTING

2020 ◽  
pp. 50-58
Author(s):  
Dmitriy Kulikov ◽  
Keyword(s):  
Mathematical Modeling ◽  
Thermal Model ◽  
High Efficiency ◽  
Complex Problem ◽  
Thermal Design ◽  
Halogen Lamp ◽  
Quality Model ◽  
Good Convergence ◽  
The Monte Carlo Method ◽  
Model Generator

In the present article the author gives the results work to create a numerical thermal model of infrared (IR) emitter on the base of tubular halogen lamp (THL) KGT-220-1300, as one of the elements of the equipment used when conducting thermal vacuum tests (TVT) of satellites. As a tool to solve complex problem of heat transfer used software Thermal Model Generator. Variants of calculations for the operation of the lamp at different voltages are carried out. The results of mathematical modeling using band approximation of the properties of the system elements in combination with the Monte Carlo method in solving the problem of heat exchange by radiation showed high efficiency. The performed analysis of the correctness of the results showed good convergence with the data of previous experiments on measuring the temperature of the quartz bulb, which confirms the reliability of the results. Getting a high-quality model of this type at the disposal of satellite thermal engineer is an important step in the complex work aimed at conducting end-to-end mathematical modeling of satellite thermal design, and will also solve a number of issues related to the methodological support of TVT, their implementation and optimization.

scholarly journals Discretized Thermal Model of Hall-Héroult Cells for Monitoring and Control

2021 ◽  
Vol 54 (11) ◽  
pp. 67-72
Author(s):  
Choon-Jie Wong ◽  
Yuchen Yao ◽  
Jie Bao ◽  
Maria Skyllas-Kazacos ◽  
Barry J. Welch ◽  
...  
Keyword(s):  
Thermal Model ◽  
Monitoring And Control ◽  
And Control

Placement Optimization for Thermal Performance of Embedded Power Chip Microwave Modules Using BP-GA

2011 ◽  
Vol 189-193 ◽  
pp. 639-642
Author(s):  
Sheng Zhang ◽  
Zhao Hua Wu ◽  
Hong Yan Huang ◽  
Pin Chen ◽  
Tang Wen Bi
Keyword(s):  
Finite Element Analysis ◽  
Temperature Field ◽  
Thermal Field ◽  
Thermal Design ◽  
Internal Temperature ◽  
Element Analysis ◽  
Thermal Distribution ◽  
Placement Optimization ◽  
Field Distributions ◽  
Embedded Power

In the thermal design of Embedded Power Chip Microwave Modules, the placement of chips on substrate has a significant effect on internal temperature field, thus, influence the reliability of the modules. In this paper, Based on BP-GA, the optimization for chips placement of EPCM is achieved by corresponding optimization program. To demonstrate the effectiveness of the results, ANSYS, finite element analysis (FEA) is carried out to assess the thermal field distribution of the optimization for chips placement. The result shows that the thermal field distributions of the optimization are consistent with the FEA results. The internal highest temperature of the initial placements is 90.369°C. After optimization, the internal highest temperature is 86.128°C, the highest temperature be reduced more than 5°C. It can effectively deal with the problem about optimize the thermal placement of EPCM chips, and improves the internal thermal distribution.

Thermal Design of a Hierarchical Radially Expanding Cavity for Two-Phase Cooling of Integrated Circuits

2015 ◽  
Author(s):  
Arvind Sridhar ◽  
Chin Lee Ong ◽  
Stefan Paredes ◽  
Bruno Michel ◽  
Thomas Brunschwiler ◽  
...  
Keyword(s):  
Design Process ◽  
Thermal Model ◽  
Thermal Design ◽  
Design Flow ◽  
Qualitative Description ◽  
System Level ◽  
Two Phase ◽  
Ongoing Research ◽  
Level Pressure ◽  
Phase Liquid

A major challenge in the implementation of evaporative two-phase liquid-cooled ICs with embedded fluid microchannels/cavities is the high pressure drops arising from evaporation-induced expansion and acceleration of the flowing two-phase fluid in small hydraulic diameters. Our ongoing research effort addresses this challenge by utilizing a novel hierarchical radially expanding channel networks with a central embedded inlet manifold and drainage at the periphery of the chip stack. This paper presents a qualitative description of the thermal design process that has been adopted for this radial cavity. The thermal design process first involves construction of a system-level pressure-thermal model for the radial cavity based on both fundamental experiments as well as numerical simulations performed on the building block structures of the final architecture. Finally, this system-level pressure-thermal model can be used to identify the design space and optimize the geometry to maximize thermal performance, while respecting design specifications. This design flow presents a good case study for electrical-thermal co-design of two-phase liquid cooled ICs.

Transient and Steady-State Thermal Design Evaluation of a Carbon Monoxide Gas Sensor Using CFD Tool

1998 ◽  
Vol 120 (2) ◽  
pp. 135-140 ◽  
Author(s):  
T.-Y. Tom Lee ◽  
R. Sharma ◽  
A. Peyre-Lavigne
Keyword(s):  
Carbon Monoxide ◽  
Gas Sensor ◽  
Thermal Model ◽  
Chemical Sensor ◽  
Low Cost ◽  
Complex Structure ◽  
Temperature Response ◽  
Thermal Design ◽  
High And Low Temperatures ◽  
Sensor Package

This paper summarizes thermal modeling work performed on the Motorola Carbon Monoxide (CO) chemical sensor. Gas sensors need low cost reliable packages, good thermal operation, and low power consumption. The goal is to provide a validated thermal model of a gas sensor and its package and to develop a sensor design capability with reduced design cycle time. Due to the complex structure of the sensor package, a computational fluid dynamics (CFD) tool was used to analyze the heat transfer and fluid flow within the package. Based on the validated model, parametric studies on filter location and package orientation were performed. In order to minimize the influence of humidity, the sensor is toggled between high and low temperatures by applying 5 volts for 5 s of heating, and 1 volt for 10 s of cooling. Transient thermal analysis was also performed to predict the temperature response of various components. A detailed description of the thermal model and its results are described in the paper.

scholarly journals An Anisotropic Equivalent Thermal Model for Shield Differential Through-Silicon Vias

Micromachines ◽  
2021 ◽  
Vol 12 (10) ◽  
pp. 1223
Author(s):  
Guangbao Shan ◽  
Guoliang Li ◽  
Dongdong Chen ◽  
Zifeng Yang ◽  
Di Li ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Finite Element Method ◽  
Thermal Model ◽  
Maximum Temperature ◽  
The Finite Element Method ◽  
Equivalent Thermal Conductivity ◽  
Thermal Distribution ◽  
Mathematical Expressions ◽  
Proposed Model ◽  
Silicon Vias

An accurate equivalent thermal model is proposed to calculate the equivalent thermal conductivity (ETC) of shield differential through-silicon via (SDTSV). The mathematical expressions of ETC in both horizontal and vertical directions are deduced by considering the anisotropy of SDTSV. The accuracy of the proposed model is verified by the finite element method (FEM), and the average errors of temperature along the X-axis, Y-axis, diagonal line, and vertical directions are 1.37%, 3.42%, 1.76%, and 0.40%, respectively. Compared with COMSOL, the proposed model greatly improves the computational efficiency. Moreover, the effects of different parameters on the thermal distribution of SDTSV are also investigated. The thermal conductivity is decreased with the increase in thickness of SiO2. With the increase in pitch, the maximum temperature of SDTSV increases very slowly when β = 0°, and decreases very slowly when β = 90°. The proposed model can be used to accurately and quickly describe the thermal distribution of SDTSV, which has a great prospect in the design of 3D IC.

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