Pool Boiling Heat Transfer and Bubble Dynamics Over Plain and Enhanced Microchannels

2010 ◽  
Author(s):  
Dwight Cooke ◽  
Satish G. Kandlikar
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Bubble Dynamics ◽  
Pool Boiling ◽  
High Heat ◽  
Heat Fluxes ◽  
Electronic Cooling ◽  
High Heat Flux ◽  
Heat Of Evaporation ◽  
Cooling Ability

Pool boiling is of interest in high heat flux applications because of its potential for removing large amount of heat resulting from the latent heat of evaporation and little pressure drop penalty for circulating coolant through the system. However, the heat transfer performance of pool boiling systems is not adequate to match the cooling ability provided by enhanced microchannels operating under single-phase conditions. The objective of this work is to evaluate the pool boiling performance of structured surface features etched on a silicon chip. The performance is normalized with respect to a plain chip. This investigation also focuses on the bubble dynamics on plain and structured microchannel surfaces under various heat fluxes in an effort to understand the underlying heat transfer mechanism. This work is expected to lead to improved enhancement features for extending the pool boiling option to meet the high heat flux removal demands in electronic cooling applications.

Pool Boiling Heat Transfer and Bubble Dynamics Over Plain and Enhanced Microchannels

2011 ◽  
Vol 133 (5) ◽  
Author(s):  
Dwight Cooke ◽  
Satish G. Kandlikar
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Boiling Heat Transfer ◽  
Bubble Dynamics ◽  
Pool Boiling ◽  
High Heat ◽  
Heat Fluxes ◽  
High Heat Flux ◽  
Silicon Chips ◽  
Heat Of Evaporation

Pool boiling is of interest in high heat flux applications because of its potential for removing large amount of heat resulting from the latent heat of evaporation and little pressure drop penalty for circulating coolant through the system. However, the heat transfer performance of pool boiling systems is not adequate to match the cooling ability provided by enhanced microchannels operating under single-phase conditions. The objective of this work is to evaluate the pool boiling performance of structured surface features etched on a silicon chip. The performance is normalized with respect to a plain chip. This investigation also focuses on the bubble dynamics on plain and structured microchannel surfaces under various heat fluxes in an effort to understand the underlying heat transfer mechanism. It was determined that surface modifications to silicon chips can improve the heat transfer coefficient by a factor up to 3.4 times the performance of a plain chip. Surfaces with microchannels have shown to be efficient for boiling heat transfer by allowing liquid to flow through the open channels and wet the heat transfer surface while vapor is generated. This work is expected to lead to improved enhancement features for extending the pool boiling option to meet the high heat flux removal demands in electronic cooling applications.

Heat Transfer Enhancement in Compact Phase Change Microchannel Heat Exchangers for High Flux Laser Diodes

2018 ◽  
Author(s):  
Jensen Hoke ◽  
Todd Bandhauer ◽  
Jack Kotovsky ◽  
Julie Hamilton ◽  
Paul Fontejon
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Phase Change ◽  
Flow Boiling ◽  
Laser Diodes ◽  
High Heat ◽  
Heat Fluxes ◽  
High Heat Flux ◽  
Maximum Heat ◽  
Average Maximum

Liquid-vapor phase change heat transfer in microchannels offers a number of significant advantages for thermal management of high heat flux laser diodes, including reduced flow rates and near constant temperature heat rejection. Modern laser diode bars can produce waste heat loads >1 kW cm−2, and prior studies show that microchannel flow boiling heat transfer at these heat fluxes is possible in very compact heat exchanger geometries. This paper describes further performance improvements through area enhancement of microchannels using a pyramid etching scheme that increases heat transfer area by ∼40% over straight walled channels, which works to promote heat spreading and suppress dry-out phenomenon when exposed to high heat fluxes. The device is constructed from a reactive ion etched silicon wafer bonded to borosilicate to allow flow visualization. The silicon layer is etched to contain an inlet and outlet manifold and a plurality of 40μm wide, 200μm deep, 2mm long channels separated by 40μm wide fins. 15μm wide 150μm long restrictions are placed at the inlet of each channel to promote uniform flow rate in each channel as well as flow stability in each channel. In the area enhanced parts either a 3μm or 6μm sawtooth pattern was etched vertically into the walls, which were also scalloped along the flow path with the a 3μm periodicity. The experimental results showed that the 6μm area-enhanced device increased the average maximum heat flux at the heater to 1.26 kW cm2 using R134a, which compares favorably to a maximum of 0.95 kw cm2 dissipated by the plain walled test section. The 3μm area enhanced test sections, which dissipated a maximum of 1.02 kW cm2 showed only a modest increase in performance over the plain walled test sections. Both area enhancement schemes delayed the onset of critical heat flux to higher heat inputs.

Observations of the Critical Heat Flux Process During Pool Boiling of FC-72

2014 ◽  
Vol 136 (4) ◽  
Author(s):  
J. Jung ◽  
S. J. Kim ◽  
J. Kim
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Critical Heat Flux ◽  
Pool Boiling ◽  
High Heat ◽  
Line Length ◽  
Boiling Curve ◽  
High Heat Flux ◽  
Transfer Coefficients ◽  
Ir Camera

Experimental work was undertaken to investigate the process by which pool-boiling critical heat flux (CHF) occurs using an IR camera to measure the local temperature and heat transfer coefficients on a heated silicon surface. The wetted area fraction (WF), the contact line length density (CLD), the frequency between dryout events, the lifetime of the dry patches, the speed of the advancing and receding contact lines, the dry patch size distribution on the surface, and the heat transfer from the liquid-covered areas were measured throughout the boiling curve. Quantitative analysis of this data at high heat flux and transition through CHF revealed that the boiling curve can simply be obtained by weighting the heat flux from the liquid-covered areas by WF. CHF mechanisms proposed in the literature were evaluated against the observations.

Enhanced Pool Boiling Performance on Micro-, Nano-, and Hybrid-Structured Surfaces

2011 ◽  
Author(s):  
Qian Li ◽  
Wei Wang ◽  
Chris Oshman ◽  
Benoit Latour ◽  
Chen Li ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Thermal Management ◽  
Pool Boiling ◽  
High Heat ◽  
High Heat Flux ◽  
Maximum Heat ◽  
Structured Surfaces ◽  
Maximum Heat Transfer ◽  
Functional Components

Thermal management plays an important role in both high power electronics and energy conversion systems. A key issue in thermal management is the dissipation of the high heat flux generated by functional components. In this paper, various microstructures, nanostructures and hybrid micro/nano-structures were successfully fabricated on copper (Cu) surfaces, and the corresponding pool boiling heat transfer performance was systematically studied. It is found that the critical heat flux (CHF) of hybrid structured surfaces is about 15% higher than that of the surfaces with nanowires only and micro-pillars only. More importantly, the superheat at CHF for the hybrid structured surface is much smaller than that of the micro-pillared surface (about 35%), and a maximum heat transfer coefficient (HTC) of about 90,000W/m2K is obtained. Compared with the known best pool boiling performance on biporous media, a much larger HTC and much lower superheat at a heat flux of 250W/cm2 have been obtained on the novel hybrid-structured surfaces.

Heat Transfer and Hydraulic Characteristics of Cooling Water in a Flat Plate Heat Sink for High Heat Flux IGBT

2016 ◽  
Author(s):  
Chang-Nian Chen ◽  
Ji-Tian Han ◽  
Wei-Ping Gong ◽  
Tien-Chien Jen
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Flat Plate ◽  
Heat Sink ◽  
High Heat ◽  
Heat Fluxes ◽  
High Heat Flux ◽  
Hydraulic Characteristics ◽  
Flow Rates ◽  
Plate Heat

High heat flux is very dangerous for electronic heat transfer, such as IGBT (Insulated Gate Bipolar Transistor) cooling. In order to explore and master the heat transfer and hydraulic characteristics for IGBT cooling, experiments have been carried out to study the situation mentioned above in a flat plate heat sink, which was designed for high heat flux IGBT cooling. The geometrical parameters of the test section are as follows: outline dimension 229 mm × 124 mm × 30 mm; flow channels of 229 mm × 3 mm × 4 mm in total of 20. The experiments performed at atmospheric pressure and with inlet temperatures of 25–35°C, heat fluxes of 3.5–18.9 kW/m2. The influence of temperatures, heat fluxes on IGBT surface temperature and the cooling effect of the liquid cold plate have been investigated under a range of flow rates of 280–2300 kg/m2s. It was found that the heat transfer enhancement was very obvious using this kind of small sized channel for IGBT cooling, which was tens of times of the effect than air cooling or triple of the effect than that in normal sized channels. And the heat transfer enhancement increases with increasing heat fluxes and flow rates, while it decreases with increasing inlet temperatures. Most of the experimental results show good cooling effect as expected. However, it is dangerous for the cooling system under high heat fluxes when the system starts or stops suddenly, when the Respond Time (RT) is less than 5 seconds to cut off heated power. Also, the cooling performance is bad when the heat fluxes increased greatly, which is considered as abnormal situation in operating. The effect on IGBT surface temperature of heat flux is more obvious when the average Nusselt Number is smaller. For hydraulic characteristics observed, it was found that the flow friction increased with flow rates increasing, but the pressure drops of heated flow channels ahead were slightly larger than those back, especially under large flow rates conditions. That is because the temperatures of flow heated in channels ahead are lower than those back, which causes the fluid viscosity to be higher. At last, this paper suggested a series of method for enhancing heat transfer in flat plate heat sink, and also gave some ways to avoid heat transfer dangerous situations for IGBT cooling, which can provide a basis for thermodynamic and hydraulic calculation of flat plate heat sink design and lectotype.

Prediction of Refrigerant Flow Boiling Hysteresis With an Augmented Separated-Flow Model

2016 ◽  
Author(s):  
Jianwei Gao ◽  
Hongxia Li ◽  
Saif Almheiri ◽  
TieJun Zhang
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Surface Temperature ◽  
Flow Model ◽  
Flow Boiling ◽  
Separated Flow ◽  
High Heat ◽  
Heat Fluxes ◽  
High Heat Flux ◽  
Boiling Hysteresis

Thermal management is essential to compact devices particularly for high heat flux removal applications. As a popular thermal technology, refrigeration cooling is able to provide relatively high heat flux removal capability and uniform device surface temperature. In a refrigeration cycle, the performance of evaporator is extremely important to the overall cooling efficiency. In a well-designed evaporator, effective flow boiling heat transfer can be achieved whereas the critical heat flux (CHF) or dryout condition must be avoided. Otherwise the device surface temperature would rise significantly and cause device burnout due to the poor heat transfer performance of film boiling. In order to evaluate the influence of varying imposed heat fluxes, saturated flow boiling in the evaporator is systematically studied. The complete refrigerant flow boiling hysteresis between the imposed heat flux and the exit wall superheat is characterized. Upon the occurrence of CHF at the evaporator wall exit, the wall heat flux redistributes due to the axial wall heat conduction, which drives the dryout point to propagate upstream in the evaporator. As a result, a significant amount of thermal energy is stored in the evaporator wall. While the heat flux starts decreasing, the dryout point moves downstream and closer to the exit. The stored heat in the wall dissipates slowly and leads to the delay in rewetting or quenching, which is the key to understand and predict the flow boiling hysteresis. In order to reveal the transient heat releasing mechanism, an augmented separated-flow model is developed to predict the moving rewetting point and minimum heat flux at the evaporator exit, and the model predictions are further validated by experimental data from a refrigeration cooling testbed.

Experimental Study of Heat Transfer Enhancement in Pool Boiling by Using 2-Ethyl 1-Hexanol an Additive

2014 ◽  
Vol 592-594 ◽  
pp. 1601-1606 ◽  
Author(s):  
Sameer Sheshrao Gajghate ◽  
Anil R. Aacharya ◽  
Anil T. Pise ◽  
Ganesh S. Jadhav
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Boiling Heat Transfer ◽  
Bubble Dynamics ◽  
Pool Boiling ◽  
Nucleate Boiling ◽  
Heat Fluxes ◽  
Optimum Level ◽  
Transfer Coefficients ◽  
Nichrome Wire

The addition of additives to the water is known to enhance boiling heat transfer. In the present investigation, boiling heat transfer coefficients are measured for Nichrome wire, immersed in saturated water with & without additive. An additive used is 2-Ethyl 1-Hexanol with varying concentrations in the range of 10-10000 ppm. Extensive experimentation of pool boiling is carried out above the critical heat flux. Boiling behavior i.e. bubble dynamics are observed at higher heat flux for nucleate boiling of water over wide ranges of concentration of additive in water. Results are encouraging and show that a small amount of surface active additive makes the nucleate boiling heat transfer coefficient considerably higher, and that there is an optimum additive (500-1000ppm) concentration for higher heat fluxes. An optimum level of enhancement is observed up to a certain amount of additive 500-1000ppm in the tested range. Thereafter significant enhancement is not observed. This enhancement may be due to change in thermo-physical properties i.e. mainly due to a reduction in surface tension of water in the presence of additive.

High Heat Flux Dissipation Using Symmetric Dual-Taper Manifold in Pool Boiling

2019 ◽  
Author(s):  
Aranya Chauhan ◽  
Satish G. Kandlikar
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Pool Boiling ◽  
Heat Removal ◽  
Heating Surface ◽  
High Heat ◽  
Copper Surface ◽  
High Heat Flux ◽  
Maximum Heat ◽  
Continuous Increase

Abstract The trend of miniaturization in electronics presents a great challenge in the thermal management of devices. The continuous increase in the number of transistors in the processor leads to high heat flux generation, limiting the performance of the device. Boiling heat transfer offers a great heat removal competency while maintaining the low chip temperatures. The critical heat flux (CHF) dictates the maximum heat removal ability, and heat transfer coefficient (HTC) defines the efficiency of the boiling process. This pool boiling study is focused on using a manifold containing a symmetric dual taper over the heating surface. The heat transfer performance of this configuration is evaluated for different taper angles in the manifold. The macro-convection assisted by vapor columns during boiling enhance the CHF and HTC limit significantly. A CHF of 287 W/cm2 with an HTC of 116 kW/cm2°C was achieved with a plain copper surface, representing greater than a 2-fold increases in each over a plain surface.

Sign in / Sign up

Export Citation Format

Share Document