Adjoint Based Heat Conduction Optimization of Struts Parameters Within Hollow Blade

2021 ◽  
Author(s):  
Yougang Ruan ◽  
Zhenping Feng
Keyword(s):  
Heat Conduction ◽  
Boundary Conditions ◽  
Hollow Cylinder ◽  
Inverse Design ◽  
Ansys Fluent ◽  
Average Temperature ◽  
Hollow Blade ◽  
Target Values ◽  
Solid Region ◽  
Continuous Adjoint

Abstract In gas turbine, the interaction between hot gas mainstream and blade solid region becomes more and more obvious as the turbine inlet temperature increases, thus heat conduction within the blade solid regions should be taken into consideration in optimization design process. In this paper, an adjoint-based optimization method for heat conduction problems in the solid region was built based on ANSYS Fluent and OpenFOAM Solver. The continuous adjoint equation and the corresponding boundary conditions for three typical conduction boundary conditions were derived in detail. To validate the correctness of this method, inverse design problems within the hollow cylinder and hollow blade were calculated, respectively. Inner shape inverse design of the hollow cylinder and the blade thickness inverse design were performed, and the target values were found successfully. Adjoint gradients were compared with finite-difference method or theoretical results. Then a Conjugate Heat Transfer (CHT) calculation was performed using ANSYS Fluent software, and the numerical methods were validated against the experimental results. An optimization of the struts place and thickness within hollow blade for average temperature was performed based on the CHT calculation results. Average temperature within the solid region of the optimized blade decreased 11.1K as compared to the original case.

scholarly journals Heat Conduction in Hollow Cylinders with Radiation

1964 ◽  
Vol 14 (2) ◽  
pp. 159-164 ◽  
Author(s):  
E. Marchi ◽  
G. Zgrablich
Keyword(s):  
Heat Conduction ◽  
Boundary Conditions ◽  
Hollow Cylinder ◽  
Integral Transformation ◽  
Finite Integral Transformation ◽  
Finite Integral ◽  
Hollow Cylinders ◽  
Radiation Type

AbstractA new finite integral transformation (an extension of those given by Sneddon (1)), whose kernel is given by cylindrical functions, is used to solve the problem of finding the temperature at any point of a hollow cylinder of any height, with boundary conditions of radiation type on the outside and inside surfaces, with independent radiation constants. It is to be noticed that all possible problems on boundary conditions in hollow cylinders can be solved by particularising the method described here.

Transient Heat Transfer of a Hollow Cylinder Subjected to Periodic Boundary Conditions

2015 ◽  
Vol 137 (5) ◽  
Author(s):  
Yujia Sun ◽  
Xiaobing Zhang
Keyword(s):  
Heat Transfer ◽  
Boundary Conditions ◽  
Hollow Cylinder ◽  
Periodic Boundary ◽  
Periodic Boundary Conditions ◽  
Transient Heat Transfer ◽  
Maximum Temperature ◽  
Water Cooling ◽  
Chromium Plating ◽  
Inner Surface

The purpose of this paper is to study the transient temperature responses of a hollow cylinder subjected to periodic boundary conditions, which comprises with a short heating period (a few milliseconds) and a relative long cooling period (a few seconds). During the heating process, the inner surface is under complex convection heat transfer condition, which is not so easy to approximate. This paper first calculated the gas temperature history and the convective heat transfer coefficient history between the gas flow and the inner surface and then they were applied to the inner surface as boundary conditions. Finite element analysis was used to solve the transient heat transfer equations of the hollow cylinder. Results show that the inner surface is under strong thermal impact and large temperature gradient occurs in the region adjacent to the inner surface. Sometimes chromium plating and water cooling are used to relief the thermal shock of a tube under such thermal conditions. The effects of these methods are analyzed, and it indicates that the chromium plating can reduce the maximum temperature of the inner surface for the first cycle during periodic heating and the water cooling method can reduce the growth trend of the maximum temperature for sustained conditions. We also investigate the effects of different parameters on the maximum temperature of the inner surface, like chromium thickness, water velocity, channel diameter, and number of cooling channels.

Microprocessor Silicon Die Temperature Prediction by Simplified Boundary Conditions

2015 ◽  
Author(s):  
Koji Nishi ◽  
Tomoyuki Hatakeyama ◽  
Shinji Nakagawa ◽  
Masaru Ishizuka
Keyword(s):  
Heat Transfer ◽  
Heat Conduction ◽  
Boundary Conditions ◽  
Thermal Resistance ◽  
Hot Spot ◽  
Three Dimensional ◽  
Thermal Design ◽  
Target Temperature ◽  
One Dimensional ◽  
Thermal Network

The thermal network method has a long history with thermal design of electronic equipment. In particular, a one-dimensional thermal network is useful to know the temperature and heat transfer rate along each heat transfer path. It also saves computation time and/or computation resources to obtain target temperature. However, unlike three-dimensional thermal simulation with fine pitch grids and a three-dimensional thermal network with sufficient numbers of nodes, a traditional one-dimensional thermal network cannot predict the temperature of a microprocessor silicon die hot spot with sufficient accuracy in a three-dimensional domain analysis. Therefore, this paper introduces a one-dimensional thermal network with average temperature nodes. Thermal resistance values need to be obtained to calculate target temperature in a thermal network. For this purpose, thermal resistance calculation methodology with simplified boundary conditions, which calculates thermal resistance values from an analytical solution, is also introduced in this paper. The effectiveness of the methodology is explored with a simple model of the microprocessor system. The calculated result by the methodology is compared to a three-dimensional heat conduction simulation result. It is found that the introduced technique matches the three-dimensional heat conduction simulation result well.

Sign in / Sign up

Export Citation Format

Share Document