Interaction Between Wire and Ingot in Wiresaw Slicing

1999 ◽  
Author(s):  
Fuqian Yang ◽  
J. C. M. Li ◽  
Imin Kao
Keyword(s):  
Finite Element ◽  
Contact Zone ◽  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Bending Stiffness ◽  
Mechanical Interaction ◽  
Wire Tension ◽  
Cutting Zone ◽  
The Wire

Abstract The deformation of the wire in the wiresaw slicing process was studied by considering directly the mechanical interaction between the wire and the ingot. The wire tension on the upstream is larger than on the downstream due to the friction force between the wire and the ingot. The tension difference across the cutting zone increases with friction and the span of the contact zone. The pressure in the contact zone increases from the entrance to the exit if the wire bending stiffness is ignored. The finite element results show that the wire bending stiffness plays an important role in the wire deformation. Higher wire bending stiffness (larger wire size) generates higher force acting onto the ingot for the same amount of wire deformation, which will leads to higher material removal rate and kerf loss. While larger wire span will reduce the force acting onto the ingot for a given ingot displacement in the direction perpendicular to the wire.

OPTIMASI PARAMETER PEMESINAN WIRE ELECTRIC DISCHARGE MACHINING BAJA PERKAKAS SKD 11 MENGGUNAKAN METODE TAGUCHI

ROTOR ◽  
2018 ◽  
Vol 11 (2) ◽  
pp. 33
Author(s):  
Setiawan Okik Aris ◽  
Djumhariyanto Dwi ◽  
Mulyadi Santoso
Keyword(s):  
Material Removal Rate ◽  
Material Removal ◽  
Manufacturing Industry ◽  
Removal Rate ◽  
Dimensional Accuracy ◽  
Current Strength ◽  
Influential Factor ◽  
Hard Material ◽  
Taguchi Optimization ◽  
The Wire

EDM wire is one of the non-conventional machinings that is currently widely used in the manufacturing industry because it can process workpieces with hard material and also produces excellent dimensional accuracy. This research was carried out with variable current, voltage and wire speed processes. While the response variable is the material removal rate and cutting width (kerf), this study aims to determine the effect of each factor on each response as well as on the combined response and to find the right combination of parameters to produce optimal response values. The results of the study stated that the current strong factor contributed 89.84% and the wire speed factor was 8.26% against the cutting width response (kerf). The current strong element contributes 87.88% to the material removal rate response. As for the combined response, the influential factor was wire speed with a contribution of 92.79%. The optimal combination of parameters in the combined response is 7 amperes, 5 volts and 10 m / s wire speed. The conclusion of this study informs that the smaller the current strength, the better the value of the cutting width, while the more significant the current force will result in a higher removal rate material. The factor that influences the combined response is wire speed, where the increase in the value of the wire speed increases the amount of the Gray Relational Grade from the combined response. Keywords: Wire EDM, SKD 11 Steel, Taguchi, Optimization

Study of Electroplated Nickel Layer Thickness and Saw Parameters on Cutting Performance in Diamond Wire Sawing of Sapphire Ingots

2015 ◽  
Vol 656-657 ◽  
pp. 450-455 ◽  
Author(s):  
Rong Hwei Yeh ◽  
H.Y. Chen ◽  
Cheng Kuo Lee ◽  
A.H. Tan
Keyword(s):  
Wear Rate ◽  
Layer Thickness ◽  
Material Removal Rate ◽  
Feed Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Nickel Layer ◽  
Diamond Wire ◽  
Wire Tension ◽  
Diamond Wire Sawing

A production-scale multiwire saw machine and 4 inch sapphire ingots were used in this study. The diamond wire used in the study had a core diameter of 0.1mm with an attached diamond particle size of 8–12μm. This study uses the Taguchi method and Grey relational analysis on the key diamond wire parameters which are electroplated nickel layer thickness, diamond wire tension, diamond wire speed and sapphire ingot feed rate, in order to simultaneously optimize the cutting performance in the diamond wire sawing of sapphire ingots. Based on the analysis, the nickel layer thickness and wire speed are the first and second most significant factors with 31.7 and 29.9% effects on cutting performances. The optimal control factors were then simultaneously evaluated for Ra, material removal rate, diamond wire wear rate and TTV and were found at optimization to be 14 μm nickel layer thickness, 15NT wire tension, 800m/min wire speed and 0.2mm/min feed rate, respectively. Compared with current standard condition, this improved process obtained from the optimization of diamond wire electroplated nickel layer thickness and saw machine parameters in the diamond wire sawing of sapphire ingots can achieve a 33% lower Ra, a 20% lower diamond wear rate, a 13% lower TTV and a 20% higher material removal rate, simultaneously.

Finite Element Modeling for Analyzing Material Removal Rate in ECDM Process

2020 ◽  
Vol 19 (04) ◽  
pp. 815-835 ◽  
Author(s):  
Viveksheel Rajput ◽  
Mudimallana Goud ◽  
Narendra Mohan Suri
Keyword(s):  
Finite Element ◽  
Finite Element Modeling ◽  
Material Removal Rate ◽  
Thermal Model ◽  
Material Removal ◽  
Removal Rate ◽  
Experimental Results ◽  
Temperature Fields ◽  
Work Material ◽  
Transient Thermal

Electrochemical discharge machining (ECDM) has been developed as a hybrid and robust technology for machining non-conductive work material at a preferable removal rate. ECDM exhibits various applications in the micro-machining of these materials like nuclear, automotive, medical industries, etc. Due to some peculiar properties of nonconductive materials, for example, glass transparency, their utilization in MEMS applications are also very numerous. In the ECDM process, removal of material takes place primarily due to high-temperature thermal erosion and secondarily due to electrolyte chemical etching action. Many rigorous experimental studies have reported in the empirical estimation of the material removal rate (MRR) in the ECDM process. However, very few studies have reported in the modeling of the ECDM process for predicting material removal rate through single spark simulation. The present paper attempts to develop a transient thermal model based upon finite element modeling (FEM) to simulate a single spark in the ECDM process for obtaining temperature fields in the work material. The obtained temperature fields are further post-processed to predict the material removal rate. FEM results are compared with the previous simulated and experimental results to confirm the approach. Moreover, an experimental study is also performed to validate the developed thermal model and it was found to be in an acceptable range of the experimental results. Further, a parametric study revealed that MRR increases with the increase in applied voltage and electrolyte concentration during soda-lime glass machining with ECDM. The developed FEM-based transient thermal model can be successfully utilized for predicting the removal rate of nonconductive work material.

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