Simulation of Material Removal Rate in Ultrasonic Drilling Process Using Finite Element Analysis and Taguchi Method

2009 ◽  
pp. 179-190
Author(s):  
R.S. Jadoun ◽  
B.K. Mishra ◽  
Pradeep Kumar ◽  
R.C.S. Mehta
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Taguchi Method ◽  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Drilling Process ◽  
Element Analysis ◽  
Ultrasonic Drilling

scholarly journals Developmental and Experimental Study of Rotary Ultrasonic drilling process

2021 ◽  
Vol 9 (8) ◽  
pp. 2475-2478
Author(s):  
Arpit Srivastava
Keyword(s):  
Taguchi Method ◽  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Drilling Process ◽  
Machining Parameters ◽  
Ultrasonic Drilling ◽  
Machining Parameter ◽  
Rotary Ultrasonic Drilling ◽  
Selection Of

Abstract: The proper selection of machining conditions and machining parameter is an important aspect, before going to machine a brittle material by rotary ultrasonic drilling process Because these conditions will determine such important characteristics as; Material removal rate (MRR) and Surface roughness (SR). The purpose of this work is to determine the optimal values of machining parameters of rotary ultrasonic drilling process. The work has been based on the effect of three design factors: Tool feed rate, vibration frequency and grain size of abrasive particle on such characteristic like material removal rate (MRR). This work has been done by means of the technique of design of experiment (DOE), which provides us to perform the above-mentioned analysis with small number of experiments. In this work, a L9 orthogonal array is used to design the experiment. The adequate selection of machining parameters is very important in manufacturing system, because these parameters determine the surface quality and dimensional accuracy of the manufactured part. The optimal setting of the parameters are determined through experiments planned, conducted and analyzed using the Taguchi method. Keywords: RUSM, Material removal rate, Drilling, Taguchi method

scholarly journals Tentative Investigations on Reducing the Edge Effects in Pre-Polishing the Optics

2020 ◽  
Vol 10 (15) ◽  
pp. 5286
Author(s):  
Xiaolong Ke ◽  
Lei Qiu ◽  
Chunjin Wang ◽  
Zhenzhong Wang
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Edge Effect ◽  
Edge Effects ◽  
Material Removal ◽  
Processing Time ◽  
Grinding Process ◽  
Element Analysis ◽  
Edge Zone ◽  
The Finite Element Analysis

The material removal depth in the pre-polishing stage of the precision optics is usually tens of microns to remove the subsurface damage and grinding marks left by the previous grinding process. This processing of the upstand edge takes a large part of the time at this stage. The purpose of this paper is to develop a method that can reduce the edge effect and largely shorten the processing time of the pre-polishing stage adopting the semirigid (SR) bonnet. The generation of the edge effect is presented based on the finite element analysis of the contact pressure at the edge zone firstly. Then, some experimentations on the edge effect are conducted, and the results proved that the SR bonnet tool can overhang the workpiece edge in the pre-polishing stage to reduce the width and height of the upstand edge to largely shorten the subsequent processing time of it. In addition, there exists a perfect overhang ratio, which generates the upstand edge with the smallest width and height, with no damage to the bonnet tool in the meantime. In addition, one combination of the pre-polishing parameters is concluded according to this method, which can be safely adopted in practical process.

Interaction Between Wire and Ingot in Wiresaw Slicing

1999 ◽  
Author(s):  
Fuqian Yang ◽  
J. C. M. Li ◽  
Imin Kao
Keyword(s):  
Finite Element ◽  
Contact Zone ◽  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Bending Stiffness ◽  
Mechanical Interaction ◽  
Wire Tension ◽  
Cutting Zone ◽  
The Wire

Abstract The deformation of the wire in the wiresaw slicing process was studied by considering directly the mechanical interaction between the wire and the ingot. The wire tension on the upstream is larger than on the downstream due to the friction force between the wire and the ingot. The tension difference across the cutting zone increases with friction and the span of the contact zone. The pressure in the contact zone increases from the entrance to the exit if the wire bending stiffness is ignored. The finite element results show that the wire bending stiffness plays an important role in the wire deformation. Higher wire bending stiffness (larger wire size) generates higher force acting onto the ingot for the same amount of wire deformation, which will leads to higher material removal rate and kerf loss. While larger wire span will reduce the force acting onto the ingot for a given ingot displacement in the direction perpendicular to the wire.

Development and Analysis for a New Compliant XY Micropositioning Stage Applied for Nanoindentation Tester System

2019 ◽  
Vol 894 ◽  
pp. 60-71
Author(s):  
Minh Phung Dang ◽  
Thanh Phong Dao ◽  
Hieu Giang Le ◽  
Ngoc Thoai Tran
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Taguchi Method ◽  
Optimization Problems ◽  
High Reliability ◽  
Hybrid Approach ◽  
Element Analysis ◽  
Amplification Ratio ◽  
Design Variables ◽  
The Finite Element Analysis

A Compliant XY micropositioning stage is purported for situating a material sample in nanoindentation tester process. This paper aims to develop, analyze and optimize a XY compliant micropositioning stage. The working stroke of proposed XY stage is amplified by combining the four-lever and a bridge amplification mechanism. To enhance the performances of the stage, the main geometric parameters are optimized by an integration method of Taguchi method, response surface method (RSM) and genetic algorithm (GA). Firstly, static analysis and dynamic analysis are conducted by the finite element analysis in order to predict initial performances of the XY stage. Secondly, the number of experiments and the data are retrieved by combination of the finite element analysis-integrated Taguchi method. Thirdly, the effects of main design variables on the output response sensitivity are considered. Later on, mathematical model for the amplification ratio was established by the RSM. Finally, based on the mathematical equation, the GA is adopted to define the optimal design variables. The results of numerical validations are in a good agreement with the predicted results. The results depicted that the proposed hybrid approach ensures a high reliability for engineering optimization problems.

Finite Element Modeling of Pad Deformation due to Diamond Disc Conditioning in Chemical Mechanical Polishing (CMP)

2012 ◽  
Author(s):  
Emmanuel A. Baisie ◽  
Z. C. Li ◽  
X. H. Zhang
Keyword(s):  
Mechanical Properties ◽  
Finite Element ◽  
Material Removal ◽  
High Performance ◽  
Removal Rate ◽  
Chemical Mechanical Planarization ◽  
Element Analysis ◽  
Fea Model ◽  
Pad Wear ◽  
Diamond Disc

Chemical mechanical planarization (CMP) is widely used to planarize and smooth the surface of semiconductor wafers. In CMP, diamond disc conditioning is traditionally employed to restore pad planarity and surface asperity. Pad deformation which occurs during conditioning affects the material removal mechanism of CMP since pad shape, stress and strain are related to cut rate during conditioning, pad wear rate and wafer material removal rate (MRR) during polishing. Available reports concerning the effect of diamond disc conditioning on pad deformation are based on simplified models of the pad and do not consider its microstructure. In this study, a two-dimensional (2-D) finite element analysis (FEA) model is proposed to analyze the interaction between the diamond disc conditioner and the polishing pad. To enhance modeling fidelity, image processing is utilized to characterize the morphological and mechanical properties of the pad. An FEA model of the characterized pad is developed and utilized to study the effects of process parameters (conditioning pressure and pad stiffness) on pad deformation. The study reveals that understanding the morphological and mechanical properties of CMP pads is important to the design of high performance pads.

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