On finite element analysis of material removal rate in microwave drilling of borosilicate glass

2020 ◽  
Author(s):  
Gaurav Kumar ◽  
Radha Raman Mishra ◽  
Apurbba Kumar Sharma
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Material Removal Rate ◽  
Borosilicate Glass ◽  
Material Removal ◽  
Removal Rate ◽  
Element Analysis

scholarly journals Tentative Investigations on Reducing the Edge Effects in Pre-Polishing the Optics

2020 ◽  
Vol 10 (15) ◽  
pp. 5286
Author(s):  
Xiaolong Ke ◽  
Lei Qiu ◽  
Chunjin Wang ◽  
Zhenzhong Wang
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Edge Effect ◽  
Edge Effects ◽  
Material Removal ◽  
Processing Time ◽  
Grinding Process ◽  
Element Analysis ◽  
Edge Zone ◽  
The Finite Element Analysis

The material removal depth in the pre-polishing stage of the precision optics is usually tens of microns to remove the subsurface damage and grinding marks left by the previous grinding process. This processing of the upstand edge takes a large part of the time at this stage. The purpose of this paper is to develop a method that can reduce the edge effect and largely shorten the processing time of the pre-polishing stage adopting the semirigid (SR) bonnet. The generation of the edge effect is presented based on the finite element analysis of the contact pressure at the edge zone firstly. Then, some experimentations on the edge effect are conducted, and the results proved that the SR bonnet tool can overhang the workpiece edge in the pre-polishing stage to reduce the width and height of the upstand edge to largely shorten the subsequent processing time of it. In addition, there exists a perfect overhang ratio, which generates the upstand edge with the smallest width and height, with no damage to the bonnet tool in the meantime. In addition, one combination of the pre-polishing parameters is concluded according to this method, which can be safely adopted in practical process.

Grinding-aided electrochemical discharge drilling in the light of electrochemistry

2018 ◽  
Vol 233 (6) ◽  
pp. 1896-1909 ◽  
Author(s):  
VG Ladeesh ◽  
R Manu
Keyword(s):  
Material Removal Rate ◽  
Borosilicate Glass ◽  
Chemical Etching ◽  
Material Removal ◽  
Removal Rate ◽  
Machining Accuracy ◽  
Hybrid Technique ◽  
Machined Surface ◽  
Influence Of Process Parameters ◽  
Electrochemical Discharge

The electrically non-conductive materials like glass, ceramics, quartz, etc. are of great interest for many applications in modern industries. Machining them with high quality and at a faster rate is a challenging task. In this study, a novel technique called grinding aided electrochemical discharge drilling (G-ECDD) is demonstrated which uses a hollow diamond core drill as the tool for performing electrochemical discharge machining of borosilicate glass. The new hybrid technique enhances the material removal rate and machining accuracy to several folds by combining the thermal melting action of discharges and grinding action of the abrasive tool. This paper presents the experimental investigation on the material removal rate during G-ECDD of glass while using different electrolytes. An attempt has been made to explore the influence of electrolyte temperature on G-ECDD performance by maintaining the electrolyte at different temperatures. Experiments were conducted using three different electrolytes which include NaOH, KOH, and the mixture of both. The results obtained from this study revealed that an increase in temperature will favor chemical etching as well as electrochemical reaction rate. Also, it was observed that heating the electrolyte leads to an increase in the bubble density and enhances the ion mobility. This causes the formation of gas film at a faster rate and thereby improving the discharge activity. Thus, machining will be done at a faster rate. Better results are obtained while using a mixture of NaOH and KOH. From the microscopic images of the machined surface, it was observed that material removal mechanism in G-ECDD is a combination of grinding action, electrochemical discharges, and chemical etching. Response surface methodology was adopted for studying the influence of process parameters on the performance of G-ECDD. The new technique of grinding aided electrochemical discharge drilling proved its potential to machine borosilicate glass and simultaneously offers good material removal rate, repeatability, and accuracy.

Interaction Between Wire and Ingot in Wiresaw Slicing

1999 ◽  
Author(s):  
Fuqian Yang ◽  
J. C. M. Li ◽  
Imin Kao
Keyword(s):  
Finite Element ◽  
Contact Zone ◽  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Bending Stiffness ◽  
Mechanical Interaction ◽  
Wire Tension ◽  
Cutting Zone ◽  
The Wire

Abstract The deformation of the wire in the wiresaw slicing process was studied by considering directly the mechanical interaction between the wire and the ingot. The wire tension on the upstream is larger than on the downstream due to the friction force between the wire and the ingot. The tension difference across the cutting zone increases with friction and the span of the contact zone. The pressure in the contact zone increases from the entrance to the exit if the wire bending stiffness is ignored. The finite element results show that the wire bending stiffness plays an important role in the wire deformation. Higher wire bending stiffness (larger wire size) generates higher force acting onto the ingot for the same amount of wire deformation, which will leads to higher material removal rate and kerf loss. While larger wire span will reduce the force acting onto the ingot for a given ingot displacement in the direction perpendicular to the wire.

Finite Element Modeling of Pad Deformation due to Diamond Disc Conditioning in Chemical Mechanical Polishing (CMP)

2012 ◽  
Author(s):  
Emmanuel A. Baisie ◽  
Z. C. Li ◽  
X. H. Zhang
Keyword(s):  
Mechanical Properties ◽  
Finite Element ◽  
Material Removal ◽  
High Performance ◽  
Removal Rate ◽  
Chemical Mechanical Planarization ◽  
Element Analysis ◽  
Fea Model ◽  
Pad Wear ◽  
Diamond Disc

Chemical mechanical planarization (CMP) is widely used to planarize and smooth the surface of semiconductor wafers. In CMP, diamond disc conditioning is traditionally employed to restore pad planarity and surface asperity. Pad deformation which occurs during conditioning affects the material removal mechanism of CMP since pad shape, stress and strain are related to cut rate during conditioning, pad wear rate and wafer material removal rate (MRR) during polishing. Available reports concerning the effect of diamond disc conditioning on pad deformation are based on simplified models of the pad and do not consider its microstructure. In this study, a two-dimensional (2-D) finite element analysis (FEA) model is proposed to analyze the interaction between the diamond disc conditioner and the polishing pad. To enhance modeling fidelity, image processing is utilized to characterize the morphological and mechanical properties of the pad. An FEA model of the characterized pad is developed and utilized to study the effects of process parameters (conditioning pressure and pad stiffness) on pad deformation. The study reveals that understanding the morphological and mechanical properties of CMP pads is important to the design of high performance pads.

Study on the machining distortion of aluminum alloy parts induced by forging residual stresses

2016 ◽  
Vol 231 (4) ◽  
pp. 618-627 ◽  
Author(s):  
Liangbao Liu ◽  
Jianfei Sun ◽  
Wuyi Chen ◽  
Pengfei Sun
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Aluminum Alloy ◽  
Residual Stresses ◽  
Material Removal ◽  
Actual Condition ◽  
Element Analysis ◽  
The Finite Element Analysis ◽  
Layer Removal Method ◽  
Analytical Correction

A weak-rigid monolithic component is subjected to significant distortion after the removal of material. This condition is principally due to flexibility of the part and the release of initial residual stresses resulting from fabrication. This article reports a systematic study on the measurement of initial residual stresses and the distortion of a windshield frame part induced by material removal from the forged blanks of aluminum alloy 7085-T7452. A layer-removal method was employed to measure the stress profiles of the blank. The stresses after analytical correction were found to be closer to actual condition. The effect of material removal on distortion from stressed blank was investigated using the finite element analysis software ANSYS. The simulated results indicate that after the proportion of removed material exceeds 60%, part distortion becomes stable. The comparisons of the simulation with experimental data suggest sufficient agreement with conclusion that the use of finite element analysis proves to be an attractive and reliable method for predicting stress-induced distortion.

Electro-Thermal Modelling for Material Removal Study in Electric Discharge Machining Process

2015 ◽  
Author(s):  
Yash Pachaury ◽  
Puneet Tandon
Keyword(s):  
Material Removal Rate ◽  
Electric Discharge ◽  
Material Removal ◽  
Removal Rate ◽  
Machining Process ◽  
Two Dimensional ◽  
Electric Discharge Machining ◽  
Element Analysis ◽  
Plasma Flushing Efficiency ◽  
Art Research

In the present study, an attempt has been made to model the electric discharge machining process using the numerical simulation technique. Realistic parameters are added in the model such as variable fraction of heat going to the electrodes, and variation in the plasma flushing efficiency with the process parameters. Gaussian distributed heat flux is applied at the spark location and the two-dimensional heat conduction equation is solved with the help of finite element analysis technique to determine the temperature distribution within the two-dimensional process continuum, using averaged thermo-physical properties of the work material. Melting isotherms are determined and the material removed during a single discharge is obtained from it. Material removal rate is determined using a regression model for the plasma flushing efficiency. Experimental validation is made with the help of highly precise AGIE SIT experimental data. The material removal rate is also compared with state of the art research of other researchers. It has been observed that, at low value of the discharge energies, the proposed model is able to predict the experimental material removal rate better than that of the model proposed by other researchers. However, as the discharge energy increases, the accuracy of prediction decreases. The model can be used for achieving process parameter optimization hence saving both the costs and large lead times associated with determining optimized parameters experimentally.

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