Integrated Heterogeneous Design of Semiconductor Heat Sink via Scaled Direct Micro-Modeling, Upper Scale VAT Simulation and Experiment: Comparison and Verification of Properties

2001 ◽  
Author(s):  
V. S. Travkin ◽  
E. D. Sergievsky ◽  
E. V. Krinitsky ◽  
I. Catton
Keyword(s):  
Heat Transfer ◽  
Heat Sink ◽  
Hydrodynamic Characteristic ◽  
Volume Averaging ◽  
Air Cooling ◽  
Simulation And Experiment ◽  
Micro Modeling ◽  
Forced Air ◽  
Work Supports ◽  
Effectiveness Parameter

Abstract The thermal and hydrodynamic characteristic of straight-channel longitudinal fin heat sink under forced air-cooling is studied experimentally and numerically using a Phoenics 3.3 (CHAM, UK) CFD software. The aim of the study is to simulate and compare the viability of employing Phoenics code as effective and efficient means gathering the vast amount of data required to adequately quantify heat sink characteristics on the lower scale with the two scale experimental data reduced according to requirements of VAT. For this case is analyzed the basic homogeneous heat transfer performance features and shown insolvency of using heat transfer and effectiveness parameter. A number of data reduction parameters and procedures were developed using scaling heterogeneous formulation by volume averaging theory (VAT). Analysis brought in this work supports the procedures used to connect the two scale VAT experiment with the full lower scale direct numerical modeling for the semiconductor heat sink.

Compact Modeling of Fluid Flow and Heat Transfer in Straight Fin Heat Sinks

2004 ◽  
Vol 126 (2) ◽  
pp. 247-255 ◽  
Author(s):  
Duckjong Kim ◽  
Sung Jin Kim
Keyword(s):  
Heat Transfer ◽  
Porous Medium ◽  
Fluid Flow ◽  
Pressure Drop ◽  
Heat Sink ◽  
Volume Averaging ◽  
Thermal Design ◽  
Heat Sinks ◽  
Compact Modeling ◽  
Flow And Heat Transfer

In the present work, a compact modeling method based on a volume-averaging technique is presented. Its application to an analysis of fluid flow and heat transfer in straight fin heat sinks is then analyzed. In this study, the straight fin heat sink is modeled as a porous medium through which fluid flows. The volume-averaged momentum and energy equations for developing flow in these heat sinks are obtained using the local volume-averaging method. The permeability and the interstitial heat transfer coefficient required to solve these equations are determined analytically from forced convective flow between infinite parallel plates. To validate the compact model proposed in this paper, three aluminum straight fin heat sinks having a base size of 101.43mm×101.43mm are tested with an inlet velocity ranging from 0.5 m/s to 2 m/s. In the experimental investigation, the heat sink is heated uniformly at the bottom. The resulting pressure drop across the heat sink and the temperature distribution at its bottom are then measured and are compared with those obtained through the porous medium approach. Upon comparison, the porous medium approach is shown to accurately predict the pressure drop and heat transfer characteristics of straight fin heat sinks. In addition, evidence indicates that the entrance effect should be considered in the thermal design of heat sinks when Re Dh/L>∼O10.

A Two-Dimensional Conjugate Heat Transfer Model for Forced Air Cooling of an Electronic Device

1989 ◽  
Vol 111 (1) ◽  
pp. 41-45 ◽  
Author(s):  
A. Zebib ◽  
Y. K. Wo
Keyword(s):  
Heat Transfer ◽  
Conjugate Heat Transfer ◽  
Electronic Device ◽  
Transfer Problem ◽  
Maximum Temperature ◽  
Transfer Model ◽  
Air Cooling ◽  
Two Dimensional ◽  
Component Design ◽  
Forced Air

Thermal analysis of forced air cooling of an electronic component is modeled as a two-dimensional conjugate heat transfer problem. The velocity field in a constricted channel is first computed. Then, for a typical electronic module, the energy equation is solved with allowance for discontinuities in the thermal conductivity. Variation of the maximum temperature with the average air velocity is presented. The importance of our approach in evaluating possible benefits due to changes in component design and the limitations of the two-dimensional model are discussed.

Thermal Optimization of Microchannel Heat Sink With Pin Fin Structures

2003 ◽  
Author(s):  
Duckjong Kim ◽  
Sung Jin Kim
Keyword(s):  
Heat Transfer ◽  
Porous Medium ◽  
Fluid Flow ◽  
Heat Sink ◽  
Volume Averaging ◽  
Heat Sinks ◽  
Pumping Power ◽  
Heat Transfer Characteristics ◽  
Pin Fin ◽  
Flow And Heat Transfer

In the present work, a novel compact modeling method based on the volume-averaging technique and its application to the analysis of fluid flow and heat transfer in pin fin heat sinks are presented. The pin fin heat sink is modeled as a porous medium. The volume-averaged momentum and energy equations for fluid flow and heat transfer in pin fin heat sinks are obtained using the local volume-averaging method. The permeability, the Ergun constant and the interstitial heat transfer coefficient required to solve these equations are determined experimentally. To validate the compact model proposed in this paper, 20 aluminum pin fin heat sinks having a 101.43 mm × 101.43 mm base size are tested with an inlet velocity ranging from 1 m/s to 5 m/s. In the experimental investigation, the heat sink is heated uniformly at the bottom. Pressure drop and heat transfer characteristics of pin fin heat sinks obtained from the porous medium approach are compared with experimental results. Upon comparison, the porous medium approach is shown to predict accurately the pressure drop and heat transfer characteristics of pin fin heat sinks. Finally, surface porosities of the pin fin heat sink for which the thermal resistance of the heat sink is minimal are obtained under constraints on pumping power and heat sink size. The optimized pin fin heat sinks are shown to be superior to the optimized straight fin heat sinks in thermal performance by about 50% under the same constraints on pumping power and heat sink size.

A Study of Forced Convection Direct Air Cooling in the Downstream Vicinity of Heat Sinks

1990 ◽  
Vol 112 (3) ◽  
pp. 234-240 ◽  
Author(s):  
G. L. Lehmann ◽  
S. J. Kosteva
Keyword(s):  
Heat Transfer ◽  
Forced Convection ◽  
Heat Sink ◽  
Convection Heat Transfer ◽  
Heat Sinks ◽  
Air Cooling ◽  
Transfer Coefficients ◽  
Packaging System ◽  
Transfer Rates ◽  
Heat Transfer Coefficients

An experimental study of forced convection heat transfer is reported. Direct air cooling of an electronics packaging system is modeled by a channel flow, with an array of uniformly sized and spaced elements attached to one channel wall. The presence of a single or complete row of longitudinally finned heat sinks creates a modified flow pattern. Convective heat transfer rates at downstream positions are measured and compared to that of a plain array (no heat sinks). Heat transfer rates are described in terms of adiabatic heat transfer coefficients and thermal wake functions. Empirical correlations are presented for both variations in Reynolds number (5000 < Re < 20,000) and heat sink geometry. It is found that the presence of a heat sink can both enhance and degrade the heat transfer coefficient at downstream locations, depending on the relative position.

scholarly journals A Numerical and Experimental Study of a Novel Heat Sink Design for Natural Convection Cooling of LED Grow Lights

Energies ◽  
2020 ◽  
Vol 13 (16) ◽  
pp. 4046
Author(s):  
Ram Adhikari ◽  
Dawood Beyragh ◽  
Majid Pahlevani ◽  
David Wood
Keyword(s):  
Heat Transfer ◽  
Natural Convection ◽  
Heat Sink ◽  
Large Scale ◽  
High Efficiency ◽  
Experimental Testing ◽  
Growth Stages ◽  
Air Cooling ◽  
Convection Cooling ◽  
Heat Sink Design

Light-emitting diode (LED) grow lights are increasingly used in large-scale indoor farming to provide controlled light intensity and spectrum to maximize photosynthesis at various growth stages of plants. As well as converting electricity into light, the LED chips generate heat, so the boards must be properly cooled to maintain the high efficiency and reliability of the LED chips. Currently, LED grow lights are cooled by forced convection air cooling, the fans of which are often the points of failure and also consumers of a significant amount of power. Natural convection cooling is promising as it does not require any moving parts, but one major design challenge is to improve its relatively low heat transfer rate. This paper presents a novel heat sink design for natural convection cooling of LED grow lights. The new design consists of a large rectangular fin array with openings in the base transverse to the fins to increase air flow, and hence the heat transfer. Numerical simulations and experimental testing of a prototype LED grow light with the new heat sink showed that openings achieved their intended purpose. It was found that the new heat sink can transfer the necessary heat flux within the safe operating temperature range of LED chips, which is adequate for cooling LED grow lights.

Mixed Convection of Impinging Air Cooling Over Heat Sink in Telecom System Application

2004 ◽  
Vol 126 (4) ◽  
pp. 519-523 ◽  
Author(s):  
Siddharth Bhopte ◽  
Musa S. Alshuqairi ◽  
Dereje Agonafer ◽  
Gamal Refai-Ahmed
Keyword(s):  
Heat Transfer ◽  
Heat Source ◽  
Mixed Convection ◽  
Heat Sink ◽  
Three Dimensional ◽  
Source Surface ◽  
Air Cooling ◽  
Transfer Rates ◽  
Nusselt Numbers ◽  
Air Jet

The current numerical investigation will examine the effect of an impinging mixed convection air jet on the heat transfer rate of a parallel flat plate heat sink. A three-dimensional numerical model was developed to evaluate the effects of the nozzle diameter d, nozzle-to-target vertical placement H/d, Rayleigh number, and the jet Reynolds number on the heat transfer rates from a discrete heat source. Simulations were performed for a Prandtl number of 0.7 and for Reynolds numbers ranging from 100 to 5000. The governing equations were solved in the dimensionless form using a commercial finite-volume package. Average Nusselt numbers were obtained, at H/d=3 and two jet diameters, for the bare heat source, for the heat source with a base heat sink, and for the heat source with the finned heat sink. The heat transfer rates from the bare heat source surface have been compared with the ones obtained with the heat sink in order to determine the overall performance of the heat sink in an impingement configuration.

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