Impact Test and Simulation of Portable Electronic Devices: An Assessment

2004 ◽  
Author(s):  
Sheng Liu ◽  
Xin Wu ◽  
Ronald Gibson ◽  
Xuefang Wang ◽  
Hong Hai Zhang ◽  
...  
Keyword(s):  
Constitutive Modeling ◽  
Insulin Pump ◽  
Electronic Devices ◽  
Drop Impact ◽  
Impact Performance ◽  
Portable Electronics ◽  
Rate Dependent ◽  
Nonlinear Contact ◽  
Drop Tests ◽  
Testing Standards

Portable electronics devices are well known to be susceptible to drop impact which can cause various damage modes such as interconnect breakage, battery separation, possible cracking/debonding along interfaces, display damage, leaking in insulin pump, etc., Drop/impact performance of these products is one of important concerns of product design. Because of the small size of this type of electronics products, it is very expensive, time-consuming and difficult to conduct drop tests to directly detect the failure mechanisms and identify their drop behaviors. A brief review is given in terms of the development in testing standards, material modeling and structure modeling. Barriers and needs are given for both the measurement and modeling, with particular attention to the material rate dependent constitutive modeling, testing facilities development, and nonlinear contact mechanics modeling.

A Comprehensive Review of Drop Impact Modeling on Portable Electronic Devices

2011 ◽  
Vol 64 (2) ◽  
Author(s):  
Y. H. Yau ◽  
Shijie Norman Hua
Keyword(s):  
Impact Analysis ◽  
Electronic Devices ◽  
Time Frame ◽  
Drop Impact ◽  
Current Status ◽  
Impact Performance ◽  
The Past ◽  
Comprehensive Survey ◽  
Board Level ◽  
Future Work

This article is dedicated to the review of publications on drop impact analysis performed on consumer electronic devices such as cellular phones and two-way radios in the past decade. Prior to the highlights of this review, the scope and motivation behind this work will be briefly explained. A comprehensive survey on published literatures devoted to the methodologies established to analyze the reliability of electronic products exposed to the event of drop impact is presented. The scope of the review is extended beyond product level analysis to also include drop impact study at board level. This type of review is novel and has not been published in the past. The focus will be on the different analytical and numerical modeling approaches and the current status of finite element method in predicting the drop impact performance of electronic devices. Of equal interest is the methodology adopted in past work to establish a correlation between numerical and experimental results. This article serves as a reference to all intended future work which could be an extension from the current known art of drop impact analysis on electronic devices. The time frame of this review is up to year 2010.

Constitutive modeling of solder alloys for drop-impact applications

2016 ◽  
Vol 67 ◽  
pp. 135-142 ◽  
Author(s):  
E.H. Wong ◽  
J. Chrisp ◽  
C.S. Selvanayagam ◽  
S.K.W. Seah
Keyword(s):  
Constitutive Modeling ◽  
Drop Impact ◽  
Solder Alloys

scholarly journals Forensic Engineering Analysis Of Dot Verses Non-Dot Helmet Performance As A Function Of Velocities Exceeding Standardized Testing As A Function Of Velocities Exceeding Standardized Testing

2012 ◽  
Vol 29 (2) ◽  
Author(s):  
Laura L. Liptai
Keyword(s):  
Standardized Testing ◽  
The United States ◽  
Department Of Transportation ◽  
Impact Performance ◽  
Performance Improvements ◽  
Motorcycle Helmet ◽  
Road Surfaces ◽  
Hybrid Iii ◽  
Forensic Engineering ◽  
Testing Standards

Motorcyclists Suffer Serious Trauma More Often Than Automotive Occupants Tracing To Contact With Non-Yielding Road Surfaces And/Or Direct Impact From Other Vehicles. A Motorcycle Helmet Is The Principal Defense To Head Impact. If A Motorcycle Helmet Passes Dot, Department Of Transportation, Approval, What Performance Improvements Correlate? Dot And Non-Dot Helmets Were Tested To Determine Impact Performance At Velocities Exceeding Standardized Testing Velocities. Three Types Of Dot Approved And Three Types Of Non-Dot Approved Helmets Were Tested At Two Speeds Outside Of The Federal Testing Standards In The United States. The Analysis Was Performed Using An Inverted Pendulum Sub-System Experimental Device With A Hybrid-Iii Anthropometric Dummy Cranium And Neck. Results Quantify The Performance By Category, Model, And Experiment By Test Metric.

Correlating Drop Impact Simulations With Drop Impact Testing Using High-Speed Camera Measurements

2009 ◽  
Vol 131 (1) ◽  
Author(s):  
J. J. M. Zaal ◽  
W. D. van Driel ◽  
F. J. H. G. Kessels ◽  
G. Q. Zhang
Keyword(s):  
High Speed ◽  
Simulation Models ◽  
3D Models ◽  
Drop Impact ◽  
Impact Testing ◽  
Navigation Systems ◽  
High Speed Camera ◽  
Impact Performance ◽  
Impact Simulations ◽  
Board Level

The increased use of mobile appliances such as mobile phones and navigation systems in today’s society has resulted in an increase in reliability issues related to drop performance. Mobile appliances are dropped several times during their lifespan and the product is required to survive common drop accidents. A widely accepted method to assess the drop reliability of microelectronics on board-level is the drop impact test. This test has been standardized by international councils such as Joint Electron Device Engineering Council and is widely adopted throughout the industry. In this research the solder loading is investigated by combining high-speed camera measurements of several drop impact tests with verified finite element models. These simulation models are developed in order to gain an insight on the loading pattern of solder joints based on interconnect layout, drop conditions, and product specifications prior to physical prototyping. Deflections and frequencies during drop testing are measured using a high-speed camera setup. The high-speed camera experiments are performed on two levels: machine level (rebounds with and without a catcher) and product level (with different levels of energy and different pulse times). Parametric (dynamic and quasistatic) 3D models are developed to predict the drop impact performance. The experimental results are used to verify and enhance the simulation models, e.g., by tuning the damping parameters. As a result, the verified models can be used to determine the location of the critical solder joint and to obtain estimates of the solder lifetime performance.

Mechanical behaviour of adhesively bonded composite single lap joints under quasi-static and impact conditions with variation of temperature and overlap

2018 ◽  
Vol 52 (26) ◽  
pp. 3621-3635 ◽  
Author(s):  
JJM Machado ◽  
EAS Marques ◽  
LFM da Silva
Keyword(s):  
Automotive Industry ◽  
Full Range ◽  
Testing Temperature ◽  
Unidirectional Composite ◽  
Lap Joints ◽  
Adhesive Joints ◽  
Impact Loads ◽  
Adhesively Bonded ◽  
Impact Performance ◽  
Rate Dependent

The use of adhesively bonded joints in structural components for the automotive industry has significantly increased over the last years, supported by the widespread integration of composite materials. This synergy allows vehicle manufacturers to offer a significant weight reduction of the vehicle allowing for fuel and emissions reduction and, at the same time, providing high mechanical strength. However, to ensure vehicle safety, the crashworthiness of these adhesive joints must be assessed, to evaluate if the structures can sustain large impact loads, transmitting the load and absorbing the energy, without damaging the joint. The novelty of this work is the study of the strain rate dependent behaviour of unidirectional composite adhesive joints bonded with a ductile epoxy crash resistant adhesive, subjected to low and high testing temperatures and using different overlap lengths. It was demonstrated that joints manufactured with this type of adhesive and composite substrates can exhibit excellent quasi-static and impact performance for the full range of temperatures tested. Increasing the overlap length, and independently of the testing temperature, it was observed an increase of energy absorbed for both quasi-static and impact loads, this is of considerable importance for the automotive industry, demonstrating that composite joints exhibit higher performance under impact.

Flexible all-solution-processed all-plastic multijunction solar cells for powering electronic devices

2016 ◽  
Vol 3 (5) ◽  
pp. 452-459 ◽  
Author(s):  
Jinhui Tong ◽  
Sixing Xiong ◽  
Yifeng Zhou ◽  
Lin Mao ◽  
Xue Min ◽  
...  
Keyword(s):  
Solar Cells ◽  
Electronic Devices ◽  
Charge Recombination ◽  
Solution Processed ◽  
Portable Electronics ◽  
Multijunction Solar Cells

Flexible all-plastic multijunction solar cells with high photovoltage have been demonstrated via optimization of the charge-recombination layer and shown to power portable electronics.

Characterization and Constitutive Modeling of a Plasticized Poly(vinyl Chloride) for a Broad Range of Strain Rates

2001 ◽  
Vol 74 (4) ◽  
pp. 560-573 ◽  
Author(s):  
Yan Wang ◽  
Ellen M. Arruda ◽  
Phillip A. Przybylo
Keyword(s):  
Vinyl Chloride ◽  
Constitutive Modeling ◽  
Split Hopkinson Pressure Bar ◽  
Test System ◽  
Strain Rates ◽  
Impact Compression ◽  
Plasticized Pvc ◽  
Rate Dependent ◽  
Poly Vinyl Chloride ◽  
Compression Data

Abstract The mechanical behavior, morphological characterization and constitutive modeling of plasticized poly(vinyl chloride) (or PVC) are studied in this paper. The plasticized PVC is tested to large strains over a broad range of strain rates. Uniaxial and plane strain compression data at various constant strain rates ranging from −0.001 to −10 s−1 are collected on a conventional servohydraulic test system. Additional uniaxial impact compression data at approximately constant strain rates ranging from −1160 to −5560 s−1 are obtained using an aluminum split Hopkinson pressure bar apparatus. The large strain load/unload response of the plasticized PVC is nonlinear, it contains hysteresis and plastic deformation, and the initial response is highly rate dependent when the strain rate spans the transition zone between quasi-static and impact strain rates at room temperature. The morphology of plasticized PVC is analyzed via differential scanning calorimetry (DSC) and dynamic mechanical analysis (DMA), and described as a physically entangled network. A three-dimensional rate dependent constitutive model for plasticized PVC is developed and shown to successfully predict its stress—strain behavior over a broad range of strain rates.

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