Numerical Evaluation on the Heat Dissipation Capability of Liquid Metal Based Chip Cooling Device

2005 ◽  
Author(s):  
Zhong-Shan Deng ◽  
Jing Liu
Keyword(s):  
Liquid Metal ◽  
Thermal Management ◽  
Heat Dissipation ◽  
Cooling System ◽  
Three Dimensional ◽  
Heat Transfer Process ◽  
Liquid Cooling ◽  
Chip Cooling ◽  
Cooling Enhancement ◽  
Liquid Cooling System

With the sharp improvement in computational speed of CPU, thermal management becomes a major concern in the current microelectronic industry. Conventional thermal management methods for CPU chip cooling are approaching their limit for quite a few newly emerging high integrity and high power processors. Therefore, liquid metal based chip cooling method has been proposed to accommodate to this request. In order to better understand the mechanisms of the cooling enhancement by the liquid metal based cooling technique, the three-dimensional heat transfer process thus involved in the cooling chip is numerically simulated in this study. A series of calculations with different flow rates and thermal parameters are performed. The cooling capability of the liquid metal is also compared with that of the water-cooling system. The results indicate that the liquid metal has powerful cooling capability, which is much better than that of the conventional liquid-cooling system.

scholarly journals Design of an Optimized Thermal Management System for Li-Ion Batteries under Different Discharging Conditions

Energies ◽  
2020 ◽  
Vol 13 (21) ◽  
pp. 5695 ◽  
Author(s):  
Ankur Bhattacharjee ◽  
Rakesh K. Mohanty ◽  
Aritra Ghosh
Keyword(s):  
Thermal Management ◽  
Cooling System ◽  
Peak Temperature ◽  
Air Cooling ◽  
Li Ion Batteries ◽  
Li Ion Battery ◽  
Liquid Cooling ◽  
Thermal Management System ◽  
Li Ion ◽  
Liquid Cooling System

The design of an optimized thermal management system for Li-ion batteries has challenges because of their stringent operating temperature limit and thermal runaway, which may lead to an explosion. In this paper, an optimized cooling system is proposed for kW scale Li-ion battery stack. A comparative study of the existing cooling systems; air cooling and liquid cooling respectively, has been carried out on three cell stack 70Ah LiFePO4 battery at a high discharging rate of 2C. It has been found that the liquid cooling is more efficient than air cooling as the peak temperature of the battery stack gets reduced by 30.62% using air cooling whereas using the liquid cooling method it gets reduced by 38.40%. The performance of the liquid cooling system can further be improved if the contact area between the coolant and battery stack is increased. Therefore, in this work, an immersion-based liquid cooling system has been designed to ensure the maximum heat dissipation. The battery stack having a peak temperature of 49.76 °C at 2C discharging rate is reduced by 44.87% to 27.43 °C after using the immersion-based cooling technique. The proposed thermal management scheme is generalized and thus can be very useful for scalable Li-ion battery storage applications also.

Evaluation of Single Phase Flow in Microchannels for High Flux Chip Cooling: Thermohydraulic Performance Enhancement and Fabrication Technology

2004 ◽  
Author(s):  
Satish G. Kandlikar ◽  
William J. Grande
Keyword(s):  
Single Phase ◽  
Heat Dissipation ◽  
Performance Enhancement ◽  
Three Dimensional ◽  
Fold Increase ◽  
Fabrication Process ◽  
Liquid Cooling ◽  
Chip Cooling ◽  
Computer Chips ◽  
Circuit Density

The increased circuit density on today’s computer chips is reaching the heat dissipation limits for air-cooled technology. Direct liquid cooling of chips is being considered as a viable alternative. This paper reviews liquid cooling in terms of technological options and challenges. The possibilities presented herein indicate a four-to ten-fold increase in heat flux over the air-cooled systems. The roadmap for single-phase cooling technology is presented to identify research opportunities in meeting the cooling demands of future IC chips. The use of three-dimensional microchannels that incorporate either microstructures in the channel of grooves in the channel surfaces may lead to enhancement in single-phase cooling. A simplified fabrication process is described that can build both classes of three-dimensional microchannels. Proof-of-concept microchannels are presented to demonstrate the efficacy of the fabrication process.

An Integrated Liquid Cooling System Based on Galinstan Liquid Metal Droplets

2016 ◽  
Vol 8 (3) ◽  
pp. 2173-2180 ◽  
Author(s):  
Jiu Yang Zhu ◽  
Shi-Yang Tang ◽  
Khashayar Khoshmanesh ◽  
Kamran Ghorbani
Keyword(s):  
Liquid Metal ◽  
Cooling System ◽  
Liquid Cooling ◽  
Liquid Cooling System ◽  
Metal Droplets

Three-Dimensional Design and Optimization of the Liquid Cooling System for the FITGEN E-Axle

2021 ◽  
Author(s):  
James H. Page ◽  
Michele De Gennaro ◽  
Andreas Müller ◽  
Michael Kerschbaumer ◽  
Tobias Wellerdieck
Keyword(s):  
Cooling System ◽  
Three Dimensional ◽  
Liquid Cooling ◽  
Design And Optimization ◽  
Liquid Cooling System

Based on Taguchi Analysis for High Power LED Liquid-Cooling System Design

2011 ◽  
Vol 130-134 ◽  
pp. 3967-3971
Author(s):  
San Shan Hung ◽  
Hsing Cheng Chang ◽  
Jhih Wei Huang
Keyword(s):  
High Power ◽  
Heat Dissipation ◽  
Cooling System ◽  
Thermal Dissipation ◽  
Liquid Cooling ◽  
K Value ◽  
Control Factors ◽  
Pump Flow Rate ◽  
High Power Led ◽  
Liquid Cooling System

The main result of this study is to propose a liquid-cooling system for high power LED heat dissipation treatment. By using thermal dissipation mechanism and based on ANSYS CFX numerical analysis of change the parameters of cold plat. We will get the optimal heat dissipation structure. The experimental results show that the Taguchi method of thermal mechanisms in this study of the four control factors affecting the order: k value of thermal compound > fan power > liquid type > pump flow rate, and to identify the best combination of factor levels. When the heat source is 90 W, the best factor of the experimental cooling system thermal resistance is 0.563K/W. Nomenclature

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