Thermal Conductivity Measurements of Nylon 11-Carbon Nanofiber Nanocomposites

2005 ◽  
Author(s):  
Antonette T. Cummings ◽  
Li Shi ◽  
Joseph H. Koo
Keyword(s):  
Thermal Conductivity ◽  
Thermal Contact Resistance ◽  
Carbon Nanofiber ◽  
Thermal Contact ◽  
Conductivity Measurements ◽  
Fire Retardancy ◽  
Commercial Use ◽  
Transmission Electron ◽  
Nylon 11 ◽  
Microscopy Images

Nylon 11, a popular material for commercial use, has been combined with low-percent loads of carbon nanofibers (CNFs) to tailor mechanical, fire retardancy, and thermal properties. Transmission electron microscopy images show that the CNFs are randomly aligned in the polymer matrix. We show that the thermal conductivity is minimized at a certain percent loading of CNFs due to a large thermal contact resistance between the CNFs and the medium.

Thermal Contact Resistance and Thermal Conductivity of a Carbon Nanofiber

2005 ◽  
Author(s):  
Choongho Yu ◽  
Li Shi ◽  
Alan M. Cassell ◽  
Brett A. Cruden ◽  
Quoc Ngo ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Contact Resistance ◽  
Thermal Contact Resistance ◽  
Carbon Nanofiber ◽  
Thermal Contact ◽  
Chemical Vapor ◽  
Chemical Vapor Deposition Method ◽  
High Temperature Heat Treatment ◽  
Graphite Fibers ◽  
Platinum Layer

We have used a microfabricated device to measure the thermal contact resistance between a 152-nm-diameter carbon nanofiber and the measurement device, and found that heat conduction models based on Fourier’s law can underestimate the thermal contact resistance at the nanoscale constriction if a large reduction in the effective thermal conductivity of the constriction is not taken into account. With the thermal contact resistance reduced by the deposition of a platinum layer on the contact, we observed that the thermal conductivity of the carbon nanofiber grown by using a plasma enhanced chemical vapor deposition method is comparable to that of graphite fibers grown by pyrolysis of natural gas prior to high-temperature heat treatment.

scholarly journals Correction on the influence of thermal contact resistance in thermal conductivity measurements using the guarded hot plate method

2009 ◽  
Vol 6 (3) ◽  
pp. 479-488 ◽  
Author(s):  
Nenad Stepanic ◽  
Nenad Milosevic
Keyword(s):  
Thermal Conductivity ◽  
Thermal Contact Resistance ◽  
Thermal Contact ◽  
Correction Method ◽  
Conductivity Measurements ◽  
Hot Plate ◽  
Plate Method ◽  
Conductive Materials ◽  
Guarded Hot Plate ◽  
Material Sample

This work considers the influence of finite thermal contact resistances which exist in thermal conductivity measurements of homogeneous and poor thermal conductive materials using the guarded hot plate method. As an example of correction method proposed in this work, different experimental results obtained from a standard reference material sample (with the conductivity of about 1 W/mK) have been presented.

High‐Temperature Skin Softening Materials Overcoming the Trade‐Off between Thermal Conductivity and Thermal Contact Resistance

Small ◽  
2021 ◽  
pp. 2102128
Author(s):  
Taehun Kim ◽  
Seongkyun Kim ◽  
Eungchul Kim ◽  
Taesung Kim ◽  
Jungwan Cho ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
High Temperature ◽  
Contact Resistance ◽  
Thermal Contact Resistance ◽  
Thermal Contact ◽  
Trade Off

Through-Plane Thermal Conductivity of PEMFC Porous Transport Layers

2010 ◽  
Vol 8 (2) ◽  
Author(s):  
Odne S. Burheim ◽  
Jon G. Pharoah ◽  
Hannah Lampert ◽  
Preben J. S. Vie ◽  
Signe Kjelstrup
Keyword(s):  
Thermal Conductivity ◽  
Contact Resistance ◽  
Thermal Contact Resistance ◽  
Thermal Contact ◽  
Residual Water ◽  
Order Of Magnitude ◽  
Thermal Conductivities

We report the through-plane thermal conductivities of the several widely used carbon porous transport layers (PTLs) and their thermal contact resistance to an aluminum polarization plate. We report these values both for wet and dry samples and at different compaction pressures. We show that depending on the type of PTL and the existence of residual water, the thermal conductivity of the materials varies from 0.15 W K−1 m−1 to 1.6 W K−1 m−1, one order of magnitude. This behavior is the same for the contact resistance varying from 0.8 m2 K W−1 to 11×10−4 m2 K W−1. For dry PTLs, the thermal conductivity decreases with increasing polytetrafluorethylene (PTFE) content and increases with residual water. These effects are explained by the behavior of air, water, and PTFE in between the PTL fibers. It is also found that Toray papers of differing thickness exhibit different thermal conductivities.

scholarly journals Effects of pressure and temperature on thermal contact resistance between different materials

2015 ◽  
Vol 19 (4) ◽  
pp. 1369-1372 ◽  
Author(s):  
Zhe Zhao ◽  
Hai-Ming Huang ◽  
Qing Wang ◽  
Song Ji
Keyword(s):  
Thermal Conductivity ◽  
Contact Resistance ◽  
Thermal Contact Resistance ◽  
Experimental Approach ◽  
Phenolic Resin ◽  
Thermal Conductivity Coefficient ◽  
Thermal Contact ◽  
Carbon Composites ◽  
Interfacial Temperature ◽  
Temperature And Pressure

To explore whether pressure and temperature can affect thermal contact resistance, we have proposed a new experimental approach for measurement of the thermal contact resistance. Taking the thermal contact resistance between phenolic resin and carbon-carbon composites, cuprum, and aluminum as the examples, the influence of the thermal contact resistance between specimens under pressure is tested by experiment. Two groups of experiments are performed and then an analysis on influencing factors of the thermal contact resistance is presented in this paper. The experimental results reveal that the thermal contact resistance depends not only on the thermal conductivity coefficient of materials, but on the interfacial temperature and pressure. Furthermore, the thermal contact resistance between cuprum and aluminum is more sensitive to pressure and temperature than that between phenolic resin and carbon-carbon composites.

scholarly journals Thermal Properties of the Graphene Composites: Application of Thermal Interface Materials

2018 ◽  
Vol 7 (4.33) ◽  
pp. 530
Author(s):  
Mazlan Mohamed ◽  
Mohd Nazri Omar ◽  
Mohamad Shaiful Ashrul Ishak ◽  
Rozyanty Rahman ◽  
Zaiazmin Y.N ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Thermal Contact Resistance ◽  
Thermal Contact ◽  
Matrix Material ◽  
Thermal Interface Material ◽  
Thermal Interface Materials ◽  
Uniform Thickness ◽  
Thermal Interface ◽  
Interface Materials ◽  
Main Material

Epoxy mixed with others filler for thermal interface material (TIM) had been well conducted and developed. There are problem occurs when previous material were used as matrix material likes epoxy that has non-uniform thickness of thermal interface material produce, time taken for solidification and others. Thermal pad or thermal interface material using graphene as main material to overcome the existing problem and at the same time to increase thermal conductivity and thermal contact resistance. Three types of composite graphene were used for thermal interface material in this research. The sample that contain 10 wt. %, 20 wt. % and 30 wt. % of graphene was used with different contain of graphene oxide (GO).  The thermal conductivity of thermal interface material is both measured and it was found that the increase of amount of graphene used will increase the thermal conductivity of thermal interface material. The highest thermal conductivity is 12.8 W/ (mK) with 30 w. % graphene. The comparison between the present thermal interface material and other thermal interface material show that this present graphene-epoxy is an excellent thermal interface material in increasing thermal conductivity.  

Effective Thermal Conductivity of Composites Reinforced with Curvilinearly Anisotropic Inclusions with Kapitza Contact Resistance

2006 ◽  
Vol 306-308 ◽  
pp. 775-780
Author(s):  
Tung Yang Chen
Keyword(s):  
Thermal Conductivity ◽  
Contact Resistance ◽  
Closed Form ◽  
Effective Thermal Conductivity ◽  
Thermal Contact Resistance ◽  
Thermal Contact ◽  
Transversely Isotropic ◽  
Closed Form Expression ◽  
Form Expression ◽  
Micromechanical Models

Effective thermal conductivities of composites consisting of curvilinearly anisotropic inclusions with Kapitza thermal contact resistance between the constituents are considered. We show that the effect of these curvilinearly anisotropic inclusions can be exactly simulated by certain equivalent isotropic or transversely isotropic inclusions. Three different micromechanical models are employed to estimate the effective thermal conductivity of the composite. Interestingly, all these methods result in the same simple, closed-form expression.

scholarly journals Silver Nanoparticle-Deposited Aluminum Oxide Nanoparticle as Fillers for Epoxy Composites with High Thermal Conductivity

2018 ◽  
Vol 27 (6) ◽  
pp. 096369351802700
Author(s):  
Tao Huang ◽  
Yimin Yao ◽  
Gang Zhang ◽  
Fanling Meng
Keyword(s):  
Thermal Conductivity ◽  
Aluminum Nitride ◽  
Silver Nanoparticle ◽  
Ag Nanoparticles ◽  
Thermal Contact Resistance ◽  
Epoxy Composite ◽  
Thermal Contact ◽  
High Thermal Conductivity ◽  
Epoxy Composites ◽  
Oxide Nanoparticle

With the development of polymer-filled composites, the demand of high thermal conductivity materials is much attractive than ever. However, the process of a common method to improve thermal conductivity of composites is considerably complicated. The aim of this study is to investigate thermal conductivity of epoxy filled silver nanoparticle deposited aluminum nitride nanoparticles with relatively convenient process. We found that the thermal conductivities of composites filled with AlN/Ag nanoparticles are effectively enhanced, which is enormously increased from 0.48 Wm-1K-1(1.88 vol%) to 3.66 Wm-1K-1 (19.54 vol%). This can be ascribed to the bridging connections of silver nanoparticle among aluminum nitride nanoparticles. In addition, the thermal contact resistance of the epoxy composites filler with AlN/Ag nanoparticles is decreased, which is proved by the fitting measured thermal conductivity of epoxy composite with one physical model. We believe the finding has great potential for any microelectronic application.

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