Use of heat pipe/heat sink for thermal management of high performance CPUs

2002 ◽  
Author(s):  
T. Nguyen ◽  
M. Mochizuki ◽  
K. Mashiko ◽  
Y. Saito ◽  
I. Sauciuc
Keyword(s):  
Heat Pipe ◽  
Thermal Management ◽  
Heat Sink ◽  
High Performance ◽  
Pipe Heat

Experimental Study on Applied Thin Vapor Chamber and Embedded Heat Pipe Heat Sinks

2009 ◽  
Author(s):  
Garrett A. Glover ◽  
Yongguo Chen ◽  
Annie Luo ◽  
Herman Chu
Keyword(s):  
Heat Pipe ◽  
Heat Sink ◽  
High Performance ◽  
Structural Integrity ◽  
Heat Pipes ◽  
Electronic Cooling ◽  
Working Fluid ◽  
Vapor Chamber ◽  
Trade Offs ◽  
Pipe Heat

The current work is a survey of applied applications of passive 2-phase technologies, such as heat pipe and vapor chamber, in heat sink designs with thin base for electronic cooling. The latest improvements of the technologies and manufacturing processes allow achievable heat sink base thickness of 3 mm as compared to around 5 mm previously. The key technical challenge has been on maintaining structural integrity for adequate hollow space for the working fluid vapor in order to retain high performance while reducing the thickness of the overall vapor chamber or flattened heat pipe. Several designs of thin vapor chamber base heat sink and embedded heat pipe heat sink from different vendors are presented for a moderate power density application of a 60 W, 13.2 mm square heat source. Numerous works have been published by both academia and commercial applications in studying the fundamental science of passive 2-phase flow technologies; their performance has been compared to solid materials, like aluminum and copper. These works have established the merits of using heat pipes and vapor chambers in electronic cooling. The intent of this paper is to provide a methodical approach to help to accelerate the process in evaluating the arrays of different commercial designs of these devices in our product design cycle. In this paper, the trade-offs between the different types of technologies are discussed for parameters such as performance advantages, physical attributes, and some cost considerations. This is a bake-off evaluation of the complete heat sink solutions from the various vendors and not a fundamental research of vapor chambers and heat pipes — for that, it is best left to the vendors and universities.

scholarly journals Characterization of a Condenser for a High Performance Multi-Condenser Loop Heat Pipe

2011 ◽  
Author(s):  
Daniel F. Hanks ◽  
Teresa B. Peters ◽  
John G. Brisson ◽  
Evelyn N. Wang
Keyword(s):  
Heat Pipe ◽  
Thermal Management ◽  
Heat Sink ◽  
High Performance ◽  
Electronic Systems ◽  
Loop Heat Pipe ◽  
Particle Sizes ◽  
Vapor Interface ◽  
Liquid Vapor

We experimentally characterized a condenser design for a multi-condenser loop heat pipe (LHP) capable of dissipating 1000 W. The LHP is designed for integration into a high performance air-cooled heat sink to address thermal management challenges in advanced electronic systems. The multi-layer stack of condensers utilizes a sintered wick design to stabilize the liquid-vapor interface and prevent liquid flooding of the lower condenser layers in the presence of a gravitational head. In addition a liquid subcooler is incorporated to suppress vapor flashing in the liquid return line. We fabricated the condensers using photo-chemically etched Monel frames with Monel sintered wicks with particle sizes up to 44 μm. We characterized the performance of the condensers in a custom experimental flow rig that monitors the pressure and temperatures of the vapor and liquid. The condenser dissipated the required heat load with a subcooling of up to 18°C, while maintaining a stable liquid-vapor interface with a capillary pressure of 6.2 kPa. In the future, we will incorporate the condenser into a loop heat pipe for a high performance air-cooled heat sink.

Experimental Investigation of Integrated Heat Pipe Heat Sink for Multi-chip LED Module in Natural Convection

2014 ◽  
Vol 35 (11) ◽  
pp. 1394-1400
Author(s):  
周驰 ZHOU Chi ◽  
左敦稳 ZUO Dun-wen ◽  
孙玉利 SUN Yu-li
Keyword(s):  
Experimental Investigation ◽  
Natural Convection ◽  
Heat Pipe ◽  
Heat Sink ◽  
Pipe Heat

scholarly journals Thermal and Flow Characteristics in a Concentric Annular Heat Pipe Heat Sink

Energies ◽  
2020 ◽  
Vol 13 (20) ◽  
pp. 5282
Author(s):  
Eui-Hyeok Song ◽  
Kye-Bock Lee ◽  
Seok-Ho Rhi ◽  
Kibum Kim
Keyword(s):  
Heat Pipe ◽  
Heat Sink ◽  
Flow Characteristics ◽  
Filling Ratio ◽  
Working Fluid ◽  
Internal Working ◽  
Flow Configurations ◽  
Air Flow Velocity ◽  
Different Diameters ◽  
Pipe Heat

A concentric annular heat pipe heat sink (AHPHS) was proposed and fabricated to investigate its thermal behavior. The present AHPHS consists of two concentric pipes of different diameters, which create vacuumed annular vapor space. The main advantage of the AHPHS as a heat sink is that it can largely increase the heat transfer area for cooling compared to conventional heat pipes. In the current AHPHS, condensation takes place along the whole annular space from the certain heating area as the evaporator section. Therefore, the whole inner space of the AHPHS except the heating area can be considered the condenser. In the present study, AHPHSs of different diameters were fabricated and studied experimentally. Basic studies were carried out with a 50 mm-long stainless steel AHPHS with diameter ratios of 1.1 and 1.3 and the same inner tube diameter of 76 mm. Several experimental parameters such as volume fractions of 10–70%, different air flow velocity, flow configurations, and 10–50 W heat inputs were investigated to find their effects on the thermal performance of an AHPHS. Experimental results show that a 10% filling ratio was found to be the optimum charged amount in terms of temperature profile with a low heater surface temperature and water as the working fluid. For the methanol, a 40% filling ratio shows better temperature behavior. Internal working behavior shows not only circular motion but also 3-D flow characteristics moving in axial and circular directions simultaneously.

Heat Pipe Optimization Team: The Heat Pipe Assisted Heat Sink Project

2004 ◽  
Author(s):  
Damena Agonafer ◽  
Juan Ibarra ◽  
Kendrick McGee ◽  
Frank Platt ◽  
Kendall Harris ◽  
...  
Keyword(s):  
Heat Pipe ◽  
Thermal Management ◽  
Heat Sink ◽  
Cell Phone ◽  
Transfer Cell ◽  
Customer Requirements ◽  
High Increase ◽  
Phone Calls ◽  
Thermal Solution ◽  
Base Transceiver Station

The Heat Pipe Assisted Heat Sink (HPAHS) team will be working on solving challenging thermal management problems for a device known as the base transceiver station (BTS); a device used to transfer cell phone calls. This problem was raised due to transfer cell phone calls. This problem was raised due to the high use of cell phone in recent years. According to 2002 Scarborough Research, the number of cell phones in US was 180 million (2/3 of population). Due to this high increase in demand for cell phone usage, Replacement Handset Shipments are projected to increase worldwide from Current 40% of total shipments to almost 85%. This will increase from 211 million in 2002 to 591 million by 2008 (Nokia). Cell phone calls are transferred via a device known as the base transceiver station (BTS). Cell phone companies are increasing the performance of the BTS by adding more electronics. Nokia is increasing the current BTS performance by adding another power amplifier. We will encounter the problem of designing the thermal solution to ensure optimal thermal performance, while meeting customer requirements of cost and manufacturing process.

Enabling Thermal Management of High-Powered Server Processors Using Passive Thermosiphon Heat Sink

2019 ◽  
Author(s):  
Devdatta P. Kulkarni ◽  
Priyanka Tunuguntla ◽  
Guixiang Tan ◽  
Casey Carte
Keyword(s):  
Heat Pipe ◽  
High Power ◽  
Heat Sink ◽  
Capital Investment ◽  
Thermal Design ◽  
Heat Sinks ◽  
Air Cooling ◽  
Liquid Cooling ◽  
Two Phase ◽  
Pipe Heat

Abstract In recent years, rapid growth is seen in computer and server processors in terms of thermal design power (TDP) envelope. This is mainly due to increase in processor core count, increase in package thermal resistance, challenges in multi-chip integration and maintaining generational performance CAGR. At the same time, several other platform level components such as PCIe cards, graphics cards, SSDs and high power DIMMs are being added in the same chassis which increases the server level power density. To mitigate cooling challenges of high TDP processors, mainly two cooling technologies are deployed: Liquid cooling and advanced air cooling. To deploy liquid cooling technology for servers in data centers, huge initial capital investment is needed. Hence advanced air-cooling thermal solutions are being sought that can be used to cool higher TDP processors as well as high power non-CPU components using same server level airflow boundary conditions. Current air-cooling solutions like heat pipe heat sinks, vapor chamber heat sinks are limited by the heat transfer area, heat carrying capacity and would need significantly more area to cool higher TDP than they could handle. Passive two-phase thermosiphon (gravity dependent) heat sinks may provide intermediate level cooling between traditional air-cooled heat pipe heat sinks and liquid cooling with higher reliability, lower weight and lower cost of maintenance. This paper illustrates the experimental results of a 2U thermosiphon heat sink used in Intel reference 2U, 2 node system and compare thermal performance using traditional heat sinks solutions. The objective of this study was to showcase the increased cooling capability of the CPU by at least 20% over traditional heat sinks while maintaining cooling capability of high-power non-CPU components such as Intel’s DIMMs. This paper will also describe the methodology that will be used for DIMMs serviceability without removing CPU thermal solution, which is critical requirement from data center use perspective.

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