Modeling Material Removal in Lapping of Brittle Materials

Author(s):  
Songsheng Zhou ◽  
Alex Fang

Lapping of polycrystalline diamond compact (PDC) is a costly and time-consuming process that demands fundamental studies to improve its efficiency and quality. A series of experiments are conducted in this study to gain insights into the effects of the most influential factors on material removal rate (MRR). The well-known Preston’s equation is found to be insufficient for a satisfactory prediction of MRR associated with PDC lapping, and a new model is developed. The current approach treats MRR as the product of removal intensity and removal density, which are formulated as simple functions of pressure, velocity and grain concentration. The newly derived model is in good accordance with the analyzed experimental results. The decrease in MRR at higher pressure and the connections between applied pressure, grain concentration and MRR can all be well explained by the proposed model.

2011 ◽  
Vol 325 ◽  
pp. 495-501 ◽  
Author(s):  
Jason Sowers ◽  
Alex Fang

Researching the effect that certain parameters have on the lapping process is crucial to understanding the fundamental material removal mechanisms and implementing a procedure that most efficiently produces desired results. This study examines the lapping procedure for polycrystalline diamond compacts (PDCs). Tests were conducted using different sample carriers, PDC arrangements, and abrasive size distributions. Previous studies have focused on the material removal rate (MRR), which is of interest, but this study also examines the MRR uniformity within a group of PDCs lapped together. The goal of this research was to determine the optimal lapping conditions and PDC arrangement required to achieve the highest productivity. Results indicate that a hard specimen carrier is necessary to produce PDCs with uniform MRRs, and the number of PDC samples in a carrier can be increased with certain design constraints kept in mind.


2010 ◽  
Vol 126-128 ◽  
pp. 469-474 ◽  
Author(s):  
Alex Fang ◽  
Elena Castell Perez ◽  
Alex Puerta Gomez ◽  
Song Sheng Zhou ◽  
Jason Sowers

This paper is aimed at developing an efficient process, in terms of the material removal rate (MRR), for the lapping of polycrystalline diamond compact (PDC). A carbomer based viscoelastic vehicle with a non-reversible shear-thinning property was first developed for the effective suspension of diamond grits used for lapping. The effects of key process parameters on the MRR such as lapping pressure, speed, vehicle concentration, diamond grit concentration, and vehicle flow rate have been investigated through experiments. To obtain an insight into what happened to the diamond grits during lapping, diamond abrasives were reclaimed and sieved after lapping. The grit size distributions of diamond abrasives before and after the lapping were then compared.


2012 ◽  
Vol 271-272 ◽  
pp. 333-337 ◽  
Author(s):  
Song Lin Ding ◽  
John P.T. Mo ◽  
Milan Brandt ◽  
Richard Webb

The poor electric conductivity of polycrystalline diamond (PCD) makes it difficult to machine with the conventional EDM process. Inappropriate selection of parameters of the power generator and the servo system leads to unstable working condition and low material removal rate. This paper introduces a method to find optimal parameters in the Electrical Discharge Grinding (EDG) of PCD materials with Taguchi method. The theory and detailed procedures are presented, experimental results are analyzed. The optimized configuration was validated through confirmation tests.


Author(s):  
Dinc¸er Bozkaya ◽  
Sinan Mu¨ftu¨

The necessity to planarize ultra low-k (ULK) dielectrics [1], and the desire to reduce polishing defects leads to use of lower polishing pressures in chemical mechanical polishing (CMP). However, lowering the applied pressure also decreases the material removal rate (MRR), which causes the polishing time for each wafer to increase. The goal of this work is to investigate effects of pad porosity and abrasive concentration on the MRR.


2008 ◽  
Vol 53-54 ◽  
pp. 57-63 ◽  
Author(s):  
Shao Hui Yin ◽  
Yu Wang ◽  
Takeo Shinmura ◽  
Yong Jian Zhu ◽  
Feng Jun Chen

This paper proposed a viewpoint to explain why vibration assistance may increase material removal rate (MRR) in vibration-assisted magnetic abrasive finishing process. A series of experiments on vibration-assisted finishing have been carried out. On the basis of these experiments, the finishing characteristics are represented summarily. It was shown that the increase in material rate is mainly due to an increase in material removal per unit working distance.


Author(s):  
Chen Jiang ◽  
Haolin Li ◽  
Yunfei Mai ◽  
Debao Guo

A mathematical model of the acoustic emission signal during a grinding cycle is proposed for the monitoring of material removal in precision cylindrical grinding. Acoustic emission signals generated during precision grinding are sensitive to forces in grinding and present opportunities in accurate and reliable process monitoring. The proposed model is developed on the basis of a traditional grinding force model. Using the developed model, a series of experiments were performed to demonstrate the effectiveness of the acoustic emission-sensing approach in estimating the time constant and material removal in grinding. Results indicate that acoustic emission measurements can be used in the prediction of material removal in precision grinding with excellent sensitivity.


Author(s):  
S. Sudharsan

Lapping is a finishing process used especially for removing the material, achieving finer surfaces, correcting minor imperfections and maintaining close tolerances. This process may takes place due to the relative motion between the work material, slurry and lapping plate. This study is done by conducting a series of experiments based on taguchi design of experiments and calculating material removal rate and surface roughness. This study explains about effect of the parameters on material removal rate and surface finish. The final step of this process is to find out the optimum combination of process parameters to determine the material removal rate and the surface finish.


1994 ◽  
Vol 116 (3) ◽  
pp. 363-369 ◽  
Author(s):  
J. Kozak ◽  
K. P. Rajurkar ◽  
S. Z. Wang

Polycrystalline diamond (PCD) tools are now widely used in machining a large variety of advanced materials. However, the manufacture of PCD tool blanks is not an economical and efficient process. The shaping of PCD blanks with conventional machining methods (such as grinding), is a long, labor-intensive and costly process. Wire electric discharge machining (WEDM) promises to be an effective and economical technique for the production of tools from PCD blanks. However, a knowledge base for wire electrical discharge machining of PCD blanks needs comprehensive investigations into the proper parameter setting, metal removal mechanisms, and surface integrity of machined blanks. This paper presents the results of experimental and theoretical investigations of the influence of discharge frequency and discharge energy on the material removal rate of WEDM of PCD blanks. The mechanism of removing diamond grains from the matrix during electrical erosion is also discussed on the basis of thermal stresses between the diamond grain and cobalt phase.


Author(s):  
Sagil James ◽  
Murali M. Sundaram

Vibration assisted nano impact-machining by loose abrasives (VANILA) is a novel nanomachining process that combines the principles of vibration-assisted abrasive machining, and tip-based nanomachining, to perform target specific nano abrasive machining of hard and brittle materials. An atomic force microscope (AFM) is used as a platform in this process wherein, nano abrasives, injected in slurry between the workpiece and the vibrating AFM probe, impact the workpiece and cause nanoscale material removal. The objective of this study is to develop a mathematical model to determine the material removal rate (MRR) in the VANILA process. The experimental machining results reveal that the material removal happens primarily in ductile mode due to repeated deformation which happens at near normal angles of impact. A predictive model for MRR during the VANILA process is analytically developed based on elastoplastic impact theory for normal angles of impact. The model is validated through a series of experiments performed on silicon and borosilicate glass substrates and the results confirm that the model is capable of predicting the machining results within 10% deviation.


2016 ◽  
Vol 693 ◽  
pp. 1082-1089 ◽  
Author(s):  
Rong Quan Wang ◽  
Jian Yong Li ◽  
Yue Ming Liu ◽  
Wen Xi Wang

The heavy belt-grinding is a new machining method, which combined the characters of heavy-duty grinding and belt-grinding together, with high efficiency and low cost. In the present paper the removal rate model of heavy belt-grinding in manufacturing of U71Mn steel is established. It is assumed that the distribution of the abrasive particles protrusion height of the abrasive belt surface closes to Gaussian distribution. The model is presented by calculating the removal volumes of all abrasive grains contributing to cutting action based on the probability theory, elastic-plastic mechanics and abrasive cutting theory. It is analysis that the material removal rate depends essentially on the mechanical properties of the workpiece and the belt and the grinding conditions. It is proportional to the average pressure, belt velocity and the indentation depth and is inverse proportion to the grain size.


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