Lapping of Polycrystalline Diamond Compact (PDC)

2010 ◽  
Vol 126-128 ◽  
pp. 469-474 ◽  
Author(s):  
Alex Fang ◽  
Elena Castell Perez ◽  
Alex Puerta Gomez ◽  
Song Sheng Zhou ◽  
Jason Sowers
Keyword(s):  
Flow Rate ◽  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Polycrystalline Diamond ◽  
Size Distributions ◽  
Diamond Grit ◽  
Before And After ◽  
Polycrystalline Diamond Compact ◽  
Insight Into

This paper is aimed at developing an efficient process, in terms of the material removal rate (MRR), for the lapping of polycrystalline diamond compact (PDC). A carbomer based viscoelastic vehicle with a non-reversible shear-thinning property was first developed for the effective suspension of diamond grits used for lapping. The effects of key process parameters on the MRR such as lapping pressure, speed, vehicle concentration, diamond grit concentration, and vehicle flow rate have been investigated through experiments. To obtain an insight into what happened to the diamond grits during lapping, diamond abrasives were reclaimed and sieved after lapping. The grit size distributions of diamond abrasives before and after the lapping were then compared.

Studies on the Lapping of Polycrystalline Diamond Compact (PDC)

2011 ◽  
Vol 325 ◽  
pp. 495-501 ◽  
Author(s):  
Jason Sowers ◽  
Alex Fang
Keyword(s):  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Polycrystalline Diamond ◽  
Size Distributions ◽  
Design Constraints ◽  
Material Removal Mechanisms ◽  
Removal Mechanisms ◽  
Polycrystalline Diamond Compact ◽  
Abrasive Size

Researching the effect that certain parameters have on the lapping process is crucial to understanding the fundamental material removal mechanisms and implementing a procedure that most efficiently produces desired results. This study examines the lapping procedure for polycrystalline diamond compacts (PDCs). Tests were conducted using different sample carriers, PDC arrangements, and abrasive size distributions. Previous studies have focused on the material removal rate (MRR), which is of interest, but this study also examines the MRR uniformity within a group of PDCs lapped together. The goal of this research was to determine the optimal lapping conditions and PDC arrangement required to achieve the highest productivity. Results indicate that a hard specimen carrier is necessary to produce PDCs with uniform MRRs, and the number of PDC samples in a carrier can be increased with certain design constraints kept in mind.

Temperature Characterization for Nano-Polishing of PCD Composites

2008 ◽  
Vol 381-382 ◽  
pp. 513-516 ◽  
Author(s):  
Y. Chen ◽  
Liang Chi Zhang ◽  
Joseph A. Arsecularatne
Keyword(s):  
Surface Roughness ◽  
Material Removal Rate ◽  
Temperature Rise ◽  
Material Removal ◽  
Removal Rate ◽  
Polycrystalline Diamond ◽  
Theoretical Modelling ◽  
Interface Temperature ◽  
Higher Temperature ◽  
Polishing Pressure

This paper discusses the temperature characterization for nano-polishing of polycrystalline diamond composites (PCDCs) by combined experimental and theoretical modelling. It was found that a higher polishing pressure-speed combination results in a higher temperature rise and material removal rate. To optimize the nano-polishing of PCDCs and achieve a surface roughness of Ra = 50 nm, the interface temperature at polishing needs to be maintained at an appropriate level.

Modeling Material Removal in Lapping of Brittle Materials

2012 ◽  
Author(s):  
Songsheng Zhou ◽  
Alex Fang
Keyword(s):  
Material Removal ◽  
Removal Rate ◽  
Applied Pressure ◽  
Polycrystalline Diamond ◽  
Current Approach ◽  
Influential Factors ◽  
Proposed Model ◽  
Modeling Material ◽  
Series Of Experiments ◽  
Polycrystalline Diamond Compact

Lapping of polycrystalline diamond compact (PDC) is a costly and time-consuming process that demands fundamental studies to improve its efficiency and quality. A series of experiments are conducted in this study to gain insights into the effects of the most influential factors on material removal rate (MRR). The well-known Preston’s equation is found to be insufficient for a satisfactory prediction of MRR associated with PDC lapping, and a new model is developed. The current approach treats MRR as the product of removal intensity and removal density, which are formulated as simple functions of pressure, velocity and grain concentration. The newly derived model is in good accordance with the analyzed experimental results. The decrease in MRR at higher pressure and the connections between applied pressure, grain concentration and MRR can all be well explained by the proposed model.

scholarly journals Optimization of Machining Parameters for Milling Zirconia Ceramics by Polycrystalline Diamond Tool

Materials ◽  
2021 ◽  
Vol 15 (1) ◽  
pp. 208
Author(s):  
Xuefeng Yan ◽  
Shuliang Dong ◽  
Xianzhun Li ◽  
Zhonglin Zhao ◽  
Shuling Dong ◽  
...  
Keyword(s):  
Material Removal Rate ◽  
Feed Rate ◽  
Material Removal ◽  
Diamond Tool ◽  
Flank Wear ◽  
Removal Rate ◽  
Polycrystalline Diamond ◽  
Zirconia Ceramics ◽  
Cutting Depth ◽  
Tool Flank Wear

Zirconia ceramics are widely used in many fields because of their excellent physical and mechanical properties. However, there are some challenges to machine zirconia ceramics with high processing efficiency. In order to optimize parameters for milling zirconia ceramics by polycrystalline diamond tool, finite element method was used to simulate machining process based on Johnson-Cook constitutive model. The effects of spindle speed, feed rate, radial and axial cutting depth on cutting force, tool flank wear and material removal rate were investigated. The results of the simulation experiment were analyzed and optimized by the response surface method. The optimal parameter combination was obtained when the spindle speed, feed rate, radial and axial cutting depth were 8000 r/min, 90.65 mm/min, 0.10 mm and 1.37 mm, respectively. Under these conditions, the cutting force was 234.81 N, the tool flank wear was 33.40 μm when the milling length was 60 mm and the material removal rate was 44.65 mm3/min.

scholarly journals Investigation of the Effects of Machining Parameters on Material Removal Rate in Abrasive Waterjet Turning

2014 ◽  
Vol 6 ◽  
pp. 624203 ◽  
Author(s):  
Iman Zohourkari ◽  
Mehdi Zohoor ◽  
Massimiliano Annoni
Keyword(s):  
Flow Rate ◽  
Material Removal Rate ◽  
Rotational Speed ◽  
Material Removal ◽  
Removal Rate ◽  
Traverse Speed ◽  
Abrasive Waterjet ◽  
Depth Of Cut ◽  
Machining Parameters ◽  
Cutting Head

The effects of the main operational machining parameters on the material removal rate (MRR) in abrasive waterjet turning (AWJT) are presented in this paper using a statistical approach. The five most common machining parameters such as water pressure, abrasive mass flow rate, cutting head traverse speed, workpiece rotational speed, and depth of cut have been put into a five-level central composite rotatable experimental design (CCRD). The main effects of parameters and the interaction among them were analyzed by means of the analysis of variance (ANOVA) and the response surfaces for MRR were obtained fitting a second-order polynomial function. It has been found that depth of cut and cutting head traverse speed are the most influential parameters, whereas the rotational speed is insignificant. In addition, the investigations show that interactions between traverse speed and pressure, abrasive mass flow rate and depth of cut, and pressure and depth of cut are significant on MRR. This result advances the AWJT state of the art. A complete model discussion has been reported drawing interesting considerations on the AWJT process characterising phenomena, where parameters interactions play a fundamental role.

scholarly journals Analysis and Optimization of Process Parameters in Abrasive Waterjet Contour Cutting of AISI 304L

Metals ◽  
2021 ◽  
Vol 11 (9) ◽  
pp. 1362
Author(s):  
Jennifer Milaor Llanto ◽  
Ana Vafadar ◽  
Muhammad Aamir ◽  
Majid Tolouei-Rad
Keyword(s):  
Surface Roughness ◽  
Mass Flow Rate ◽  
Mass Flow ◽  
Process Parameters ◽  
Flow Rate ◽  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Traverse Speed ◽  
Abrasive Waterjet

Abrasive waterjet machining is applied in various industries for contour cutting of heat-sensitive and difficult-to-cut materials like austenitic stainless steel 304L, with the goal of ensuring high surface integrity and efficiency. In alignment with this manufacturing aspiration, experimental analysis and optimization were carried out on abrasive waterjet machining of austenitic stainless steel 304L with the objectives of minimizing surface roughness and maximizing material removal rate. In this machining process, process parameters are critical factors influencing contour cutting performance. Accordingly, Taguchi’s S/N ratio method has been used in this study for the optimization of process parameters. Further in this work, the impacts of input parameters are investigated, including waterjet pressure, abrasive mass flow rate, traverse speed and material thickness on material removal rate and surface roughness. The study reveals that an increasing level of waterjet pressure and abrasive mass flow rate achieved better surface integrity and higher material removal values. The average S/N ratio results indicate an optimum value of waterjet pressure at 300 MPa and abrasive mass flow rate of 500 g/min achieved minimum surface roughness and maximum material removal rate. It was also found that an optimized value of a traverse speed at 90 mm/min generates the lowest surface roughness and 150 mm/min produces the highest rate of material removed. Moreover, analysis of variance in the study showed that material thickness was the most influencing parameter on surface roughness and material removal rate, with a percentage contribution ranging 90.72–97.74% and 65.55–78.17%, respectively.

Effect of Operated Parameters on Removal Rate and Surface Roughness in Precision Atomization Ultra-Polishing Process of Copper Surface

2011 ◽  
Vol 189-193 ◽  
pp. 4141-4144 ◽  
Author(s):  
Qing Zhong Li ◽  
Yong Guang Wang ◽  
Zhi Xue Guo ◽  
Dong Ming Guo
Keyword(s):  
Surface Roughness ◽  
Material Removal Rate ◽  
Atmospheric Pressure ◽  
Material Removal ◽  
Removal Rate ◽  
Copper Surface ◽  
The Novel ◽  
Optimal Parameters ◽  
Polishing Process ◽  
Insight Into

Compared with the traditional chemical mechanical polishing (CMP) technique, the precision atomization ultra-polishing (PAUP) technology has the advantages of friendly environmental and damage-free. This paper established a novel PAUP tester based on the atmospheric pressure theory, and explored the possibility of PAUP technique. Furthermore, effects of operated parameters on the material removal rate and surface roughness were investigated in PAUP process. It was found that a material removal rate of 78.302 nm/min was obtained with a surface roughness of 0.015 µm at the optimal parameters. This study provides insight into the development of the novel ultra-polishing methods and its underlying theoretical foundation.

Chemical Effect on the Material Removal Rate in the CMP of Silicon Wafers

2010 ◽  
Vol 126-128 ◽  
pp. 511-514
Author(s):  
Yong Guang Wang ◽  
Liang Chi Zhang ◽  
Altabul Biddut
Keyword(s):  
Hydrogen Peroxide ◽  
Flow Rate ◽  
Material Removal Rate ◽  
Material Removal ◽  
Ph Value ◽  
Removal Rate ◽  
Chemical Effect ◽  
Alumina Particles ◽  
Chemical Factors ◽  
Slurry Flow Rate

This paper investigates the effects of some chemical factors on the material removal rate (MRR) in chemo-mechanical polishing (CMP) of Si (100) wafers. The CMP was carried out in alkaline slurry using alumina and ceria particles with hydrogen peroxide. When using the alumina particles, the MRR initially decreases with increasing the slurry pH value until pH = 9. Nevertheless, the application of the ceria particles increases the MRR before the pH of the slurry reaches 10. A higher slurry flow rate brings about a greater MRR.

Study on the Key Parameters in Etching of Fused Silica Using Atmospheric Inductively Coupled Plasma

2014 ◽  
Vol 625 ◽  
pp. 469-474 ◽  
Author(s):  
Qiang Xin ◽  
Bo Wang ◽  
Hui Liang Jin ◽  
Na Li ◽  
Duo Li ◽  
...  
Keyword(s):  
Flow Rate ◽  
Material Removal Rate ◽  
Atmospheric Pressure ◽  
Inductively Coupled Plasma ◽  
Material Removal ◽  
Removal Rate ◽  
Substrate Surface ◽  
Processing Parameters ◽  
Fused Silica ◽  
Inductively Coupled

Atmospheric Pressure Plasma Processing (APPP) of silicon-based optics and wafers is a form of chemical etching technology developed in recent years. The material removal rate is comparable to those of conventional mechanical processing methods in precision fabrication. Moreover, there is no mechanical contact or physical loading on the substrate surface, hence no surface or sub-surface damages are induced. Inductively coupled plasma is one realization of APPP. In this work, inductively coupled plasma torch is used to generate plasma and excite etchant particles at atmospheric pressure. These active particles then diffused to the workpiece surface, react with its atoms to form volatile products. The activity and number of particles in plasma are influenced by processing parameters such as input power, distance between nozzle and substrate surface, flow rate of plasma gas argon and precursor gas CF4. These factors have various impacts on material removal rate. Processing experiments are conducted on fused silica to investigate the parameters’ influences on material removal rate. The basic interaction between substrate surface and plasma is illustrated, then the relationships between processing parameters and material removal rate are analyzed. From the experiments some trends are derived. Material removal rate rises with the increase of power and flow rate of CF4, whereas decreases with the increase of processing distance, etc. The etching footprint is proved to be near Gaussian-shaped and believed to have high potential for deterministic surface processing.

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