Design for Reliability of Automotive Chip Scale Packages by Calibrated Virtual Prototyping

2021 ◽  
Author(s):  
Ralf Döring ◽  
R. Dudek ◽  
S. Rzepka ◽  
L. Scheiter ◽  
E. Noack ◽  
...  
Keyword(s):  
Finite Element ◽  
Flip Chip ◽  
Optical Measurement ◽  
Plane Deformation ◽  
Virtual Prototyping ◽  
Correlation Method ◽  
Field Analysis ◽  
Reference Object ◽  
Chip Scale Package ◽  
Thermomechanical Reliability

Abstract The thermomechanical reliability of the package and interconnections of assembled flip chip ball grid arrays (FC-BGA) is investigated in comparison to a reference chip scale package (CSP). Comparison is made using finite element (FE-) simulation. A combined measuring-simulation technique is applied to calibrate the finite element simulations on a reference object. Adjustment is made based on the in-plane deformation field evaluated by both simulation and optical measurement. For the latter an optical sensor for in-plane deformation and strain field analysis is used based on grey scale correlation method. A methodology is presented and to extrapolate the knowledge gained to alternative package types of different but similar design in order to evaluate their suitability for the desired application before the physical fabrication (virtual prototyping).

A Nested Finite Element Methodology (NFEM) for Stress Analysis of Electronic Products—Part II: Durability Analysis of Flip Chip and Chip Scale Interconnects

2000 ◽  
Vol 123 (2) ◽  
pp. 147-155 ◽  
Author(s):  
Krishna Darbha ◽  
Abhijit Dasgupta
Keyword(s):  
Finite Element ◽  
Flip Chip ◽  
Damage Model ◽  
Energy Partitioning ◽  
Temperature Cycling ◽  
Electronic Products ◽  
Durability Analysis ◽  
Chip Scale Package ◽  
Cycles To Failure ◽  
Finite Element Methodology

The nested finite element methodology (NFEM) presented in Part I of this series, is used in this paper to analyze the viscoplastic stress-state in a flip-chip-on-board (FCOB) and a chip scale package subjected to temperature cycling loads. The results are validated with conventional finite element method (CFEM). An energy-partitioning (EP) damage model is used to predict cycles to failure, based on the energy densities obtained from NFEM and CFEM, and results are compared with experiments.

Delamination in the scoring and folding of paperboard

TAPPI Journal ◽  
2012 ◽  
Vol 11 (1) ◽  
pp. 61-66 ◽  
Author(s):  
DOEUNG D. CHOI ◽  
SERGIY A. LAVRYKOV ◽  
BANDARU V. RAMARAO
Keyword(s):  
Finite Element ◽  
Plane Deformation ◽  
Strain Analysis ◽  
Local Strain ◽  
Uniaxial Stress ◽  
Material Model ◽  
Element Model ◽  
Plastic Behavior ◽  
Stress Strain ◽  
Strain Fields

Delamination between layers occurs during the creasing and subsequent folding of paperboard. Delamination is necessary to provide some stiffness properties, but excessive or uncontrolled delamination can weaken the fold, and therefore needs to be controlled. An understanding of the mechanics of delamination is predicated upon the availability of reliable and properly calibrated simulation tools to predict experimental observations. This paper describes a finite element simulation of paper mechanics applied to the scoring and folding of multi-ply carton board. Our goal was to provide an understanding of the mechanics of these operations and the proper models of elastic and plastic behavior of the material that enable us to simulate the deformation and delamination behavior. Our material model accounted for plasticity and sheet anisotropy in the in-plane and z-direction (ZD) dimensions. We used different ZD stress-strain curves during loading and unloading. Material parameters for in-plane deformation were obtained by fitting uniaxial stress-strain data to Ramberg-Osgood plasticity models and the ZD deformation was modeled using a modified power law. Two-dimensional strain fields resulting from loading board typical of a scoring operation were calculated. The strain field was symmetric in the initial stages, but increasing deformation led to asymmetry and heterogeneity. These regions were precursors to delamination and failure. Delamination of the layers occurred in regions of significant shear strain and resulted primarily from the development of large plastic strains. The model predictions were confirmed by experimental observation of the local strain fields using visual microscopy and linear image strain analysis. The finite element model predicted sheet delamination matching the patterns and effects that were observed in experiments.

Finite-Element Analysis of the Magnetostatic Field of a Coaxial Magnetic Gear Device

2015 ◽  
Vol 764-765 ◽  
pp. 289-293
Author(s):  
Yi Chang Wu ◽  
Han Ting Hsu
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Magnetic Flux ◽  
High Speed ◽  
Field Analysis ◽  
Element Analysis ◽  
Magnetostatic Field ◽  
Speed Reduction ◽  
Dimensional Finite Element ◽  
Magnetic Gear

This paper presents the magnetostatic field analysis of a coaxial magnetic gear device proposed by Atallah and Howe. The structural configuration and speed reduction ratio of this magnetic gear device are introduced. The 2-dimensional finite-element analysis (2-D FEA), conducted by applying commercial FEA software Ansoft/Maxwell, is performed to evaluate the magnetostatic field distribution, especially for the magnetic flux densities within the outer air-gap. Once the number of steel pole-pieces equals the sum of the pole-pair numbers of the high-speed rotor and the low-speed rotor, the coaxial magnetic gear device possesses higher magnetic flux densities, thereby generating greater transmitted torque.

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