Characterizing the Stability of Carbon Nanotube Enhanced Water as a Heat Transfer Nanofluid

2010 ◽  
Author(s):  
Brian K. Ryglowski ◽  
Randall D. Pollak ◽  
Young W. Kwon
Keyword(s):  
Heat Transfer ◽  
Thermal Conductivity ◽  
Electrical Conductivity ◽  
Phase Change ◽  
Heat Dissipation ◽  
Coolant Fluid ◽  
Conductivity Enhancement ◽  
Design Variables ◽  
The Stability ◽  
The Many

Heat dissipation is a major challenge for many technologies. Possible solutions include thermal energy transfer via coolant fluid to a phase change material (PCM), with higher thermal conductivity a design goal. In recent years, heat transfer nanofluids (fluids with suspended nanoparticles) have received attention based on their potential for improving thermal conductivity. Carbon nanotubes (CNTs) are an attractive additive due to their enhanced thermal conductivity and ability to remain suspended over long times. However, characterizing their potential is difficult due to the many design variables and the need for repeated thermal conductivity tests for comparison. Since thermal conductivity enhancement is dependent on a dispersed nanotube network, the electrical conductivity of CNTs can be exploited to monitor the stability of such nanofluids, as such testing is quick and simple. The aim of this research was to evaluate electrical conductivity testing as a means to monitor stability of CNT-enhanced distilled water as a PCM, with varying CNT size, type, and concentration; and various other processing variables. The prepared nanofluids were tested after repeated phase change cycles. Results indicate that electrical conductivity testing is a practical means of monitoring the nanofluid stability, and CNT-based nanofluids show both promise and limitations as a PCM.

Thermal Conductivity Enhancement in a Latent Heat Storage Device

2013 ◽  
Vol 860-863 ◽  
pp. 590-593
Author(s):  
Cha Xiu Guo ◽  
Ding Bao Wang ◽  
Gao Lin Hu
Keyword(s):  
Heat Transfer ◽  
Thermal Conductivity ◽  
Solid State ◽  
Liquid Phase ◽  
Phase Change ◽  
Latent Heat ◽  
Heat Storage ◽  
Storage Device ◽  
Latent Heat Storage ◽  
Conductivity Enhancement

High conductivity porosity materials are proposed to enhance the phase change materials (PCM) in order to solve the problem of low conductivity of PCM in the latent heat storage device (LHSD), and two-dimensional numerical simulation is conducted to predict the performance of the PCM by CFD software. During the phase change process, the PCM is heated from the solid state to the liquid phase in the process of melting and from the liquid phase to the solid state in the solidification process. The results show that porosity materials can improve heat transfer rate effectively, but the effect of heat transfer of Al foam is superior to that of graphite foam although the heat storage capacity is almost the same for both. The heat transfer is enhanced and the solidification time of PCM is decreased since the effective thermal conductivity of composite PCM is increased.

Numerical Evaluation of Multiple Phase Change Materials for Pulsed Electronics Applications

2016 ◽  
Author(s):  
David Gonzalez-Nino ◽  
Lauren M. Boteler ◽  
Dimeji Ibitayo ◽  
Nicholas R. Jankowski ◽  
Pedro O. Quintero
Keyword(s):  
Heat Transfer ◽  
Thermal Conductivity ◽  
Heat Source ◽  
Phase Change ◽  
Phase Change Materials ◽  
High Energy ◽  
Heat Of Fusion ◽  
Maximum Temperature ◽  
Conductivity Enhancement ◽  
Fast Transient

A simple and easy to implement 1-D heat transfer modeling approach is presented in order to investigate the performance of various phase change materials (PCMs) under fast transient thermal loads. Three metallic (gallium, indium, and Bi/Pb/Sn/In alloy) and two organic (erythritol and n-octadecane) PCMs were used for comparison. A finite-difference method was used to model the transient heat transfer through the system while a heat integration or post-iterative method was used to model the phase change. To improve accuracy, the material properties were adjusted at each iteration depending on the state of matter of the PCM. The model assumed that the PCM was in direct contact with the heat source, located on the top of the chip, without the presence of a thermal conductivity enhancement. Results show that the three metallic PCMs outperform organic PCMs during fast transient pulses in spite of the fact that two of the metallic PCMs (i.e. indium and Bi/Pb/Sn/In) have considerably lower volumetric heats of fusion than erythritol. This is due to the significantly higher thermal conductivity values of metals which allow faster absorption of the heat energy by the PCM, a critical need in high-energy short pulses. The most outstanding case studied in this paper, Bi/Pb/Sn/In having only 52% of erythritol’s heat of fusion, showed a maximum temperature 20°C lower than erythritol during a 32 J and 0.02 second pulse. This study has shown thermal buffering benefits by using a metallic PCM directly in contact with the heat source during short transient heat loads.

Thermal Conductivity Enhancement of Aluminium Oxide Nanofluid in Ethylene Glycol

2014 ◽  
Vol 660 ◽  
pp. 730-734 ◽  
Author(s):  
Khamisah Abdul Hamid ◽  
Wan Hamzah Azmi ◽  
Rizalman Mamat ◽  
Nur Ashikin Usri
Keyword(s):  
Heat Transfer ◽  
Thermal Conductivity ◽  
Thermal Properties ◽  
Ethylene Glycol ◽  
Volume Concentration ◽  
Conductivity Measurement ◽  
Thermal Conductivity Enhancement ◽  
Heat Transfer Fluid ◽  
Coolant Fluid ◽  
Conductivity Enhancement

Nanofluids are the new coolant fluid that has been widely investigates due to its ability to improved heat transfer better than conventional heat transfer fluid. The need to study the nanofluid properties has been increased to provide better understanding on nanofluid thermal properties and behavior. This study presents the measurement analysis on thermal conductivity enhancement of Al2O3 nanoparticles dispersed in ethylene glycol. The nanofluids are prepared using two step method for volume concentration range from 1.0 % to 4.0 %. The thermal conductivity measurement of the nanofluid is performed by KD2 Pro Thermal Properties Analyzer at working temperature range from 30 °C to 80 °C. The maximum enhancement in thermal conductivity is 21.1 % at volume concentration of 2.0 % and temperature of 70 °C. The results show that the thermal conductivity increases with the increase of nanofluid concentration and temperature. Also, the nanofluid shows enhancement in thermal conductivity compare to the base fluid.

Thermal Conductivity Enhancement of Phase Change Materials Through Aligned Metallic Nanostructures

2017 ◽  
Author(s):  
Che-Fu Su ◽  
Junwei Su ◽  
Hamed Esmaeilzadeh ◽  
Jirui Wang ◽  
Edward Fratto ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Phase Change ◽  
Phase Change Materials ◽  
Heat Dissipation ◽  
Thermal Conductivity Enhancement ◽  
Conductivity Enhancement ◽  
Thermal Enhancement ◽  
Two Samples ◽  
Particle Chains ◽  
Magnetically Aligned

The high conductive nickel (Ni) nanoparticles mixed with paraffin wax at two different volume ratios were prepared to investigate thermal conductivity enhancement of Phase Change Material (PCM) under random and aligned particle distribution. For each particle concentration, two samples were prepared. After mixing of the particles into the melted paraffin through sonication, one sample was placed in a static magnetic field to align the nanoparticles while the PCM was allowed to solidify; whereas, the second sample was solidified immediately after sonication to obtain a randomly distributed nanoparticles in the solid PCM. The thermal conductivity of both nanoPCM samples along with a pure paraffin sample were measured experimentally. The conductivity of both nanoPCM samples were substantially higher than the pure wax and the sample with magnetically aligned nanoparticle exhibited significantly higher thermal conductivity in comparison to the randomly distributed nanoPCM sample. It was anticipated that the configuration of the metallic fillers that are parallelly aligned with the applied heat flux direction does enhance the heat dissipation through the particle chains. However, the magnitude of thermal enhancement and sample fabrication in larger scales require further research efforts.

scholarly journals Thermal Conductivity of Ionic Liquids and IoNanofluids. Can Molecular Theory Help?

Fluids ◽  
2021 ◽  
Vol 6 (3) ◽  
pp. 116
Author(s):  
Xavier Paredes ◽  
Maria José Lourenço ◽  
Carlos Nieto de Castro ◽  
William Wakeham
Keyword(s):  
Heat Transfer ◽  
Thermal Conductivity ◽  
Ionic Liquids ◽  
Imaging Techniques ◽  
Interfacial Area ◽  
Thermal Conductivity Enhancement ◽  
Molecular Theory ◽  
Estimation Methods ◽  
Diphenyl Oxide ◽  
Conductivity Enhancement

Ionic liquids have been suggested as new engineering fluids, specifically in the area of heat transfer, and as alternatives to current biphenyl and diphenyl oxide, alkylated aromatics and dimethyl polysiloxane oils, which degrade above 200 °C, posing some environmental problems. Addition of nanoparticles to produce stable dispersions/gels of ionic liquids has proved to increase the thermal conductivity of the base ionic liquid, potentially contributing to better efficiency of heat transfer fluids. It is the purpose of this paper to analyze the prediction and estimation of the thermal conductivity of ionic liquids and IoNanofluids as a function of temperature, using the molecular theory of Bridgman and estimation methods previously developed for the base fluid. In addition, we consider methods that emphasize the importance of the interfacial area IL-NM in modelling the thermal conductivity enhancement. Results obtained show that it is not currently possible to predict or estimate the thermal conductivity of ionic liquids with an uncertainty commensurate with the best experimental values. The models of Maxwell and Hamilton are not capable of estimating the thermal conductivity enhancement of IoNanofluids, and it is clear that the Murshed, Leong and Yang model is not practical, if no additional information, either using imaging techniques at nanoscale or molecular dynamics simulations, is available.

Possible Mechanisms for Thermal Conductivity Enhancement in Nanofluids

2006 ◽  
Author(s):  
Amit Gupta ◽  
Xuan Wu ◽  
Ranganathan Kumar
Keyword(s):  
Heat Transfer ◽  
Thermal Conductivity ◽  
Brownian Motion ◽  
Brownian Dynamics ◽  
Lattice Vibration ◽  
Experimental Studies ◽  
High Heat ◽  
Conductivity Enhancement ◽  
High Heat Transfer ◽  
Dynamics Simulations

This study discusses the merits of various physical mechanisms that are responsible for enhancing the heat transfer in nanofluids. Experimental studies have cemented the claim that ‘seeding’ liquids with nanoparticles can increase the thermal conductivity of the nanofluid by up to 40% for metallic and oxide nanoparticles dispersed in a base liquid. Experiments have also shown that the rise in conductivity of the nanofluid is highly dependent on the size and concentration of the nanoparticles. On the theoretical side, traditional models like Maxwell or Hamilton-Crosser models cannot explain this unusually high heat transfer. Several mechanisms have been postulated in the literature such as Brownian motion, thermal diffusion in nanoparticles and thermal interaction of nanoparticles with the surrounding fluid, the formation of an ordered liquid layer on the surface of the nanoparticle and microconvection. This study concentrates on 3 possible mechanisms: Brownian dynamics, microconvection and lattice vibration of nanoparticles in the fluid. By considering two nanofluids, copper particles dispersed in ethylene glycol, and silica in water, it is determined that translational Brownian motion of the nanoparticles, presence of an interparticle potential and the microconvection heat transfer are mechanisms that play only a smaller role in the enhancement of thermal conductivity. On the other hand, the lattice vibrations, determined by molecular dynamics simulations show a great deal of promise in increasing the thermal conductivity by as much as 23%. In a simplistic sense, the lattice vibration can be regarded as a means to simulate the phononic transport from solid to liquid at the interface.

Figure of Merit-Based Optimization Approach of Phase Change Material-based Composites for Portable Electronics Using Simplified Model

2021 ◽  
Author(s):  
Ayushman Singh ◽  
Srikanth Rangarajan ◽  
Leila Choobineh ◽  
Bahgat Sammakia
Keyword(s):  
Heat Transfer ◽  
Thermal Conductivity ◽  
Phase Change ◽  
Effective Thermal Conductivity ◽  
Phase Change Material ◽  
Figure Of Merit ◽  
Volume Fraction ◽  
Simplified Model ◽  
Transient Temperature ◽  
Change Material

Abstract This work presents an approach to optimally designing a composite with thermal conductivity enhancers (TCEs) infiltrated with phase change material (PCM) based on figure of merit (FOM) for thermal management of portable electronic devices. The FOM defines the balance between effective thermal conductivity and energy storage capacity. In present study, TCEs are in the form of a honeycomb structure. TCEs are often used in conjunction with PCM to enhance the conductivity of the composite medium. Under constrained composite volume, the higher volume fraction of TCEs improves the effective thermal conductivity of the composite, while it reduces the amount of latent heat storage simultaneously. The present work arrives at the optimal design of composite for electronic cooling by maximizing the FOM to resolve the stated trade-off. In this study, the total volume of the composite and the interfacial heat transfer area between the PCM and TCE are constrained for all design points. A benchmarked two-dimensional direct CFD model was employed to investigate the thermal performance of the PCM and TCE composite. Furthermore, assuming conduction-dominated heat transfer in the composite, a simplified effective numerical model that solves the single energy equation with the effective properties of the PCM and TCE has been developed. The effective thermal conductivity of the composite is obtained by minimizing the error between the transient temperature gradient of direct and simplified model by iteratively varying the effective thermal conductivity. The FOM is maximized to find the optimal volume fraction for the present design.

Sign in / Sign up

Export Citation Format

Share Document