A high performance readout circuit (ROIC) with BDI structure for SWIR FPAs

2011 ◽  
Author(s):  
Li-chao Hao ◽  
Rui-jun Ding ◽  
Ai-bo Huang ◽  
Hong-lei Chen ◽  
Chun Zhou ◽  
...  
2020 ◽  
Vol 2 (11) ◽  
Author(s):  
Pablo N. Agra Belmonte ◽  
Ursula V. Abecassis ◽  
Lucas Chaves ◽  
Luciana P. Salles ◽  
Davies W. de Lima Monteiro

AIP Advances ◽  
2020 ◽  
Vol 10 (10) ◽  
pp. 105026
Author(s):  
Honghui Yuan ◽  
Yongping Chen

2011 ◽  
Vol 361-363 ◽  
pp. 1918-1921
Author(s):  
Jiang Wang ◽  
Wei Ping Jing ◽  
Yan Jin Li

Recently, scientists discovered that relaxor-based ferroelectric single crystals, such as (1-x)Pb(Mg1/3Nb2/3)O3 -xPbTiO3 (PMN-xPT, or PMNT) single crystals, exhibit extra-high pyroelectric responses. They are promising candidates for optical power detectors in broad bandwidth at ultraviolet, visible and infrared wavelength.To fabricate high performance infrared detectors with relaxor-based single crystals, the related readout circuit was investigated to increase signal-to-noise ratio, and 8×1 CMOS readout circuit is fabricated to gain very weak current, which provides a solution for uncooled large focal plane arrays devices based on relaxor-based single crystals.


2019 ◽  
Vol 1176 ◽  
pp. 062014
Author(s):  
Tong Zhou ◽  
Han Liu ◽  
Yun Xu ◽  
Bo Jiang ◽  
Yan Su

2017 ◽  
Vol 15 ◽  
pp. 123-130
Author(s):  
Mourad Elsobky ◽  
Yigit Mahsereci ◽  
Jürgen Keck ◽  
Harald Richter ◽  
Joachim N. Burghartz

Abstract. Flexible electronics represents an emerging technology with features enabling several new applications such as wearable electronics and bendable displays. Precise and high-performance sensors readout chips are crucial for high quality flexible electronic products. In this work, the design of a CMOS readout circuit for an array of printed strain gauges is presented. The ultra-thin readout chip and the printed sensors are combined on a thin Benzocyclobutene/Polyimide (BCB/PI) substrate to form a Hybrid System-in-Foil (HySiF), which is used as an electronic skin for robotic applications. Each strain gauge utilizes a Wheatstone bridge circuit, where four Aerosol Jet® printed meander-shaped resistors form a full-bridge topology. The readout chip amplifies the output voltage difference (about 5 mV full-scale swing) of the strain gauge. One challenge during the sensor interface circuit design is to compensate for the relatively large dc offset (about 30 mV at 1 mA) in the bridge output voltage so that the amplified signal span matches the input range of an analog-to-digital converter (ADC). The circuit design uses the 0. 5 µm mixed-signal GATEFORESTTM technology. In order to achieve the mechanical flexibility, the chip fabrication is based on either back thinned wafers or the ChipFilmTM technology, which enables the manufacturing of silicon chips with a thickness of about 20 µm. The implemented readout chip uses a supply of 5 V and includes a 5-bit digital-to-analog converter (DAC), a differential difference amplifier (DDA), and a 10-bit successive approximation register (SAR) ADC. The circuit is simulated across process, supply and temperature corners and the simulation results indicate excellent performance in terms of circuit stability and linearity.


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