The Influence of Metal Masks on Matching of the Lower Electrode and a High-Frequency Bias Generator at Reactive Ion Etching of Large Substrates

The effect of metal masks on the matching of the lower electrode with a high-frequency bias generator during selective reactive-ion etching through the mask of massive substrates in freon-14 has been studied theoretically and experimentally. It is shown that masks with a substrate coating above 30% lead to an increase in the reactive power component at distances from the center close to the substrate radius. The absence of influence on the specific reactive power of the thickness and material of the masks is established. It is experimentally shown that masks with any practically significant coating coefficient of the substrate, connected to the lower electrode through the substrate holder, improve the matching, reducing the power reflection coefficient.

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Damage free Al reactive-ion-etching for high frequency SAW devices

10.1109/iemts.1989.76133 ◽

2003 ◽

Author(s):

A. Yuhara ◽

T. Mizutani ◽

N. Hosaka ◽

J. Yamada ◽

A. Iwama

Keyword(s):

High Frequency ◽

Reactive Ion Etching ◽

Ion Etching ◽

Saw Devices

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Deep reactive ion etching of PZT ceramics and PMN-PT single crystals for high frequency ultrasound transducers

Ceramics International ◽

10.1016/j.ceramint.2015.03.258 ◽

2015 ◽

Vol 41 ◽

pp. S656-S661 ◽

Cited By ~ 2

Author(s):

Junshan Zhang ◽

Wei Ren ◽

Xinpan Jing ◽

Peng Shi ◽

Xiaoqing Wu

Keyword(s):

Single Crystals ◽

High Frequency ◽

Reactive Ion Etching ◽

Ultrasound Transducers ◽

High Frequency Ultrasound ◽

Ion Etching ◽

Deep Reactive Ion Etching ◽

Pzt Ceramics ◽

Frequency Ultrasound

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Особенности согласования нижнего электрода с высокочастотным генератором смещения при реактивно-ионном травлении массивных подложек

Журнал технической физики ◽

10.21883/jtf.2021.04.50630.271-20 ◽

2021 ◽

Vol 91 (4) ◽

pp. 657

Author(s):

С.Д. Полетаев ◽

А.И. Любимов

Keyword(s):

Numerical Simulation ◽

Reactive Ion Etching ◽

Experimental Results ◽

Substrate Holder ◽

Rf Power ◽

Special Design ◽

Reactive Component ◽

Lower Electrode ◽

Ion Etching ◽

Simulation Results

This paper presents theoretical and experimental results on reactive ion etching of massive substrates in freon-14 with RF bias at the lower electrode. A hypothesis is proposed according to which a large-sized substrate violates the matching of the lower electrode with the RF generator by adding an additional reactive component to the impedance of the lower electrode. A numerical simulation of reactive ion etching with substrates of various sizes in a CF4 environment is performed . The simulation results showed a significant increase in the reactive component of RF power at the lower electrode if the substrate area exceeds 50% of the area of the lower electrode, which is consistent with the proposed hypothesis. It has been experimentally shown that the etching of massive substrates violates the matching of the lower electrode with the RF generator. A special design of the substrate holder for massive substrates has been developed. It is shown that such a substrate holder significantly improves the matching of the RF generator with the lower electrode, especially when adding 0.3-0.9 l/h argon to the plasma-forming mixture.

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