A NOVEL PREPARATION ROUTE FOR ELECTROLESS COPPER PLATING ON SURFACE OF CaCO3 POWDERS

In this work, electroless copper plating on the surface of CaCO3 powders modified with hydrophobic and hydrophilic coating was developed in that order. It was found that the surface structure of modified CaCO3 powders could absorb Sn[Formula: see text] and then reduce Ag[Formula: see text]. The Ag atoms were used as catalysts for the electroless face-centered copper crystallites plating on the CaCO3 surface. The compact and uniform copper particles were plated on the CaCO3 surface. The plated coating has a two-layer structure. The size of copper particles in the first layer was around 20[Formula: see text]nm, the one in surface layer was around 100[Formula: see text]nm. The lowest volume resistivity of conductive coating was [Formula: see text].