Stopping Cross-Sections of Rare Gases in Amorphous Silicon for MeV Energy Helium Ions

1983 ◽  
Vol 22 (Part 1, No. 8) ◽  
pp. 1306-1309
Author(s):  
Akio Ootuka ◽  
Ken-ichiro Komaki ◽  
Fuminori Fujimoto ◽  
Kiyoshi Kawatsura ◽  
Kunio Ozawa ◽  
...  

This paper describes the measurement of charge transfer cross-sections for protons, molecular hydrogen ions and helium ions in the rare gases and hydrogen, and electron detachment cross-sections for negative atomic hydrogen ions in the rare gases. Part I describes the energy range 3 to 40 keV. In part II the energy range 100 to 4000 eV is described, and the results are discussed in terms of the pseudo-adiabatic hypothesis. Comparisons are made with other experimental results, and anomalous molecular cases are discussed in terms of reactions involving anti-bonding states.


1990 ◽  
Vol 192 ◽  
Author(s):  
Toshinori Yamazaki ◽  
Nobuaki Kobayashi ◽  
Satoshi Takahashi ◽  
Tatsuo Nakanishi

ABSTRACTIt has been found that photosensitivity of amorphous silicon (a-Si) photoreceptor fabricated by g1ow-discharge decomposition of SiH4 – B2H6 – Ar has specific relation to peak-to-peak value of Rf (13.5 MHz) voltage (Vp - p) and DC bias voltage (Vdc) on the Rf powered-electrode. The lower the Vp - p value is depressed, the higher the photosensitivity is improved. Dependences of the Vp - p value on deposition parameters such as gas pressure, distance between Rf powered-e1ectrode and aluminum substrate, Rf electric power and dilution ratio of SiH4 to Ar seem to indicate correlation of Vp - p with electron energy and electron density in the plasma.Furthermore, the Vp - p and Vdc values have been measured in plasma of He, Ne (rare-gases with no Ramsauer effect), Ar, Kr, Xe (rare-gases with Ramsauer effect), and H2, N2, CH4, SiH4 (molecular-gases): Specific behaviors in Vp - p and Vdc seem to have correlation with collision cross - sections of electrons (with the energy of 2 ∼ 10 eV) in these gases.


1998 ◽  
Vol 10 (4) ◽  
pp. 741-752 ◽  
Author(s):  
B Arezki ◽  
Y Boudouma ◽  
P Benoit-Cattin ◽  
A C Chami ◽  
C Benazeth ◽  
...  

1996 ◽  
Vol 29 (3) ◽  
pp. 435-448 ◽  
Author(s):  
F Yahyaei-Moayyed ◽  
A P Hickman ◽  
A D Streater
Keyword(s):  

1990 ◽  
Vol 59 (3) ◽  
pp. 898-901 ◽  
Author(s):  
Atsushi Fukuroda ◽  
Nobuo Kobayashi ◽  
Yozaburo Kaneko

1986 ◽  
Vol 70 ◽  
Author(s):  
Jože Furlan ◽  
Slavko Amon

ABSTRACTA general expression for generation-recombination rate in a-Si based on classical SRH theory including different electron and hole capture cross-sections for donor-like and acceptor-like centers inside the mobility gap is derived. Applying appropriate approximations and two-exponential model for localized states distribution two methods of analytical solution are presented and discussed.


1997 ◽  
Vol T73 ◽  
pp. 238-239 ◽  
Author(s):  
S Makino ◽  
T Matsuo ◽  
M Mizutani ◽  
M Sano ◽  
T Kohno ◽  
...  

1997 ◽  
Vol 467 ◽  
Author(s):  
David O'Meara ◽  
Chow Ling Chang ◽  
Roc Blumenthal ◽  
Rama I. Hegde ◽  
Lata Prabhu ◽  
...  

ABSTRACTSingle wafer amorphous silicon deposition was characterized through process modeling and film characterization for application in semiconductor production. DOE methodology was used to determine the main deposition parameters, and the responses were limited to device production requirement properties of surface roughness, deposition rate and degree of crystallinity of the as-deposited film. The data trends and models show that deposition temperature and silane flow are the main factors. Increasing either or both factor increases the deposition rate and the surface roughness. The surface morphology, evaluated by AFM, SEM and TEM, was found to be rougher at extreme growth conditions than the poly crystalline film formed after anneal. The as-deposited surface morphology was not a result of pre-anneal crystal formations as determined by TEM cross sections of samples before and after anneal. Lack of crystalinity is important for impurity diffusion considerations. Device application of the single wafer a-Si process will be a compromise between growth rate (and associated throughput) and surface roughness that can be tolerated.


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