RF Modeling of Large Gate-Width Multi-Finger Si/SiGe Power MODFETs

2019 ◽  
Vol 3 (7) ◽  
pp. 981-987
Author(s):  
Hao-Chih Yuan ◽  
Ningyue Jiang ◽  
Edward Croke ◽  
Zhenqiang Ma
Keyword(s):  

2001 ◽  
Vol 693 ◽  
Author(s):  
Seikoh Yoshida ◽  
Hirotatsu Ishii

AbstractAn AlGaN/GaN hetero field effect transistor (HFET) was operated at 20 A. Its on-state resistance was lower than that of a Si-based FET. GaN and related materials were grown by gas-source molecular beam epitaxy (GSMBE). Sapphire substrates were used for GaN growth. An undoped GaN/Al0.2Ga0.8N heterostructure wasgrown on the substrate. The sheet carrier density of two dimensional electron gas was 1x1013 cm2 and the mobility was 1200 cm2/Vs at room temperature. The breakdown field of undoped high resistive GaN layer was about 2.0 MV/cm. Al0.2Ga0.8N/GaN HFET for a large current operation was fabricated. The gate width was 20 cm and thegate length was 2000 nm. The electrode material of the source and the drain was Al/Ti/Au and the Schottky electrodes were Pt/Au. The distance between the source and the drain was 6000 nm. The maximum breakdown voltage of gate and source was 600 V. The on-state resistance of the HFET was about 2 mohm•cm2 at 100 V. The transconductance (gm) of this HFET was about 120 mS/mm. It was confirmed that the HFET with a gate width of20 cm could be operated at the condition of a large current operation.



Author(s):  
Daniel P. Weatherill ◽  
Daniel Wood ◽  
Ian Shipsey ◽  
Richard Plackett ◽  
Andrea Loreti ◽  
...  
Keyword(s):  






2013 ◽  
Vol 29 (3) ◽  
pp. 261-273
Author(s):  
Geunho Cho ◽  
Fabrizio Lombardi
Keyword(s):  


2007 ◽  
Vol 47 (9-11) ◽  
pp. 1462-1467 ◽  
Author(s):  
P. Coppens ◽  
G. Jenicot ◽  
H. Casier ◽  
F. De Pestel ◽  
F. Depuydt ◽  
...  
Keyword(s):  


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