CMP for Cu Interconnect with Advanced Barrier Materials

Barrier coatings are used in applications including food packaging, dry goods, and consumer products to prevent transport of different compounds either through or into paper and paperboard substrates. These coatings are useful in packaging to contain active ingredients, such as fragrances, or to protect contents from detrimental substances, such as oxygen, water, grease, or other chemicals of concern. They also are used to prevent visual changes or mechanical degradation that might occur if the paper becomes saturated. The performance and underlying mechanism depends on the barrier coating type and, in particular, on whether the barrier coating is designed to prevent diffusive or capillary transport. Estimates on the basis of fundamental transport phenomena and data from a broad screening of different barrier materials can be used to understand the limits of various approaches to construct barrier coatings. These estimates also can be used to create basic design rules for general classes of barrier coatings.

Download Full-text

Al-Cu interconnect corrosion prevention in post metal etch and wet polymer clean wafers

2017 40th International Convention on Information and Communication Technology, Electronics and Microelectronics (MIPRO) ◽

10.23919/mipro.2017.7966547 ◽

2017 ◽

Author(s):

Wan Tatt Wai ◽

Ng Cheah Ling

Keyword(s):

Corrosion Prevention ◽

Cu Interconnect

Download Full-text

Impact of Backbone Amide Substitution at the Meta- and Para-Positions on the Gas Barrier Properties of Polyimide

Materials ◽

10.3390/ma14092097 ◽

2021 ◽

Vol 14 (9) ◽

pp. 2097

Author(s):

Qian Wen ◽

Ao Tang ◽

Chengliang Chen ◽

Yiwu Liu ◽

Chunguang Xiao ◽

...

Keyword(s):

Transmission Rate ◽

Barrier Properties ◽

Polyimide Film ◽

Flexible Display ◽

Gas Barrier ◽

Positron Annihilation Lifetime ◽

Barrier Materials ◽

Oxygen Transmission Rate ◽

Display Technology ◽

Gas Barrier Properties

This study designed and synthesised a meta-amide-substituted dianiline monomer (m-DABA) as a stereoisomer of DABA, a previously investigated para-amide-substituted dianiline monomer. This new monomer was polymerised with pyromellitic dianhydride (PMDA) to prepare a polyimide film (m-DABPI) in a process similar to that employed in a previous study. The relationship between the substitution positions on the monomer and the gas barrier properties of the polyimide film was investigated via molecular simulation, wide-angle X-ray diffraction (WXRD), and positron annihilation lifetime spectroscopy (PALS) to gain deeper insights into the gas barrier mechanism. The results showed that compared with the para-substituted DABPI, the m-DABPI exhibited better gas barrier properties, with a water vapour transmission rate (WVTR) and an oxygen transmission rate (OTR) as low as 2.8 g·m−2·d−1 and 3.3 cm3·m−2·d−1, respectively. This was because the meta-linked polyimide molecular chains were more tightly packed, leading to a smaller free volume and lower molecular chain mobility. These properties are not conducive to the permeation of small molecules into the film; thus, the gas barrier properties were improved. The findings have significant implications for the structural design of high-barrier materials and could promote the development of flexible display technology.

Download Full-text

Copper-graphene heterostructure for back-end-of-line compatible high-performance interconnects

npj 2D Materials and Applications ◽

10.1038/s41699-021-00216-1 ◽

2021 ◽

Vol 5 (1) ◽

Author(s):

Myungwoo Son ◽

Jaewon Jang ◽

Yongsu Lee ◽

Jungtae Nam ◽

Jun Yeon Hwang ◽

...

Keyword(s):

High Performance ◽

Direct Synthesis ◽

Chemical Vapor ◽

Multilayer Graphene ◽

Time To Failure ◽

Practical Applications ◽

Cu Interconnects ◽

Pressure Chemical ◽

Cu Interconnect ◽

Pure Cu

AbstractHere, we demonstrate the fabrication of a Cu-graphene heterostructure interconnect by the direct synthesis of graphene on a Cu interconnect with an enhanced performance. Multilayer graphene films were synthesized on Cu interconnect patterns using a liquid benzene or pyridine source at 400 °C by atmospheric pressure chemical vapor deposition (APCVD). The graphene-capped Cu interconnects showed lower resistivity, higher breakdown current density, and improved reliability compared with those of pure Cu interconnects. In addition, an increase in the carrier density of graphene by doping drastically enhanced the reliability of the graphene-capped interconnect with a mean time to failure of >106 s at 100 °C under a continuous DC stress of 3 MA cm−2. Furthermore, the graphene-capped Cu heterostructure exhibited enhanced electrical properties and reliability even if it was a damascene-patterned structure, which indicates compatibility with practical applications such as next-generation interconnect materials in CMOS back-end-of-line (BEOL).

Download Full-text

Contribution of top barrier materials to high mobility in near-surface InAs quantum wells grown on GaSb(001)

Physical Review Materials ◽

10.1103/physrevmaterials.3.014603 ◽

2019 ◽

Vol 3 (1) ◽

Cited By ~ 6

Author(s):

Joon Sue Lee ◽

Borzoyeh Shojaei ◽

Mihir Pendharkar ◽

Mayer Feldman ◽

Kunal Mukherjee ◽

...

Keyword(s):

Quantum Wells ◽

High Mobility ◽

Near Surface ◽

Barrier Materials

Download Full-text

Nanotechnology in Food Packaging Applications: Barrier Materials, Antimicrobial Agents, Sensors, and Safety Assessment

Handbook of Ecomaterials ◽

10.1007/978-3-319-68255-6_30 ◽

2019 ◽

pp. 2035-2056

Author(s):

Mariana Pereda ◽

Norma E. Marcovich ◽

María R. Ansorena

Keyword(s):

Safety Assessment ◽

Food Packaging ◽

Antimicrobial Agents ◽

Barrier Materials

Download Full-text

Conductivity Behavior of Salt Deposits on the Surface of Engineered Barrier Materials for the Potential High-Level Nuclear Waste Repository at Yucca Mountain, Nevada

MRS Proceedings ◽

10.1557/proc-824-cc1.4 ◽

2004 ◽

Vol 824 ◽

Cited By ~ 3

Author(s):

Lietai Yang ◽

Miriam R. Juckett ◽

Roberto T. Pabalan

Keyword(s):

Electrical Conductance ◽

Yucca Mountain ◽

Nuclear Waste Repository ◽

Conductivity Measurements ◽

Barrier Materials ◽

Salt Mixtures ◽

High Level Nuclear Waste ◽

Waste Repository ◽

High Level ◽

Conductivity Behavior

AbstractThe electrical conductance or conductivity of three salt mixtures, Na-K-Cl-NO3, Ca-K-Cl and Ca-Na-Cl, were measured at 25, 50 and 70°C [77, 122, and 158 °F] as a function of relative humidity (RH). Mutual deliquescence and efflorescence RH (MDRH and MERH) values were determined based on the conductivity measurements. It was found that the conductivity of the three salt mixtures started to increase at RH values that are approximately 40 % of their MDRH and increased by 1to 2 orders of magnitude just before reaching the MDRH. At the MDRH, a significant increase in conductivity was observed. The MDRH and MERH for the Ca-K-Cl and Ca-Na-Cl mixtures were found to be approximately 15 % in the temperature range of 50 to 70 °C [122 to 158 °F]. The MDRH and MERH for the Na-K-Cl-NO3system were found to be approximately 54 % at 50 °C [122 °F] and decreased significantly with an increase in temperature.

Download Full-text

Diffusion of Radionuclides in Brine-Saturated Backfill Barrier Materials

MRS Proceedings ◽

10.1557/proc-15-735 ◽

1982 ◽

Vol 15 ◽

Cited By ~ 2

Author(s):

E. J. Nowak

Keyword(s):

Sodium Titanate ◽

Distribution Coefficients ◽

Barrier Materials ◽

Compacted Bentonite ◽

Metal Diffusion ◽

Diffusion Cells ◽

Linear Sorption ◽

Backfill Materials ◽

Cylindrical Diffusion ◽

Apparent Distribution

ABSTRACTThe diffusion of cesium(I), strontium(II), pertechnetate and europium in brine-saturated backfill materials was measured. Plastic diffusion cells containing cylindrical diffusion columns were used for low density backfill materials. The diffusion of gamma-emitters was followed by a gamma scanning technique. Metal diffusion cells constructed entirely from Hastelloy C-276 were used for the diffusion of pertechnetate in highly compacted bentonite. Apparent distribution coefficients calculated from diffusion data are (a) 0.02 m3 /kg for cesium(I) in 40 wt.% mordenite and 60 wt.% bentonite; (b) 0.04 m3/kg for strontium(II) in 10 wt.% sodium titanate and 90 wt.% bentonite; (c) 0.5 m3/kg for pertechnetate in 70 wt.% charcoal and 30 wt.% bentonite; and (d) 3 m3/kg for europium in 100% bentonite. Backfill effectiveness estimates based on batch sorption measurements were supported by these results;however, the diffusion results for europium did not agree well with a model for diffusion retarded by linear sorption. First measurements of pertechnetate diffusion in highly compacted bentonite suggest that anion exclusion may play a role in reducing mass transport rates of anions in this material. Needs for diffusion measurements that take into account site-specific materials interactions are described.

Download Full-text