Characterization of Iron Mediated Copper Electrodeposition Process for Semiconductor Interconnect Metallization

2009 ◽  
Keyword(s):  
Copper Electrodeposition ◽  
Electrodeposition Process

Optimized ECD Cu RDL Process with Via Filling Capability for Next Generation Packaging

2019 ◽  
Vol 2019 (1) ◽  
pp. 000046-000050
Author(s):  
Ralf Schmidt
Keyword(s):  
Heterogeneous Integration ◽  
Copper Electrodeposition ◽  
Next Generation ◽  
Rf Filters ◽  
Electrodeposition Process ◽  
Aspect Ratios ◽  
Broad Variety ◽  
Different Dimensions ◽  
Plating Additives ◽  
Size Scales

Abstract Next generation mobile devices, especially those with 5G capability, will require higher functionality and speed in combination with shrinking component as well as package dimensions. These requirements pose challenges to upcoming heterogeneous integration. In order to account for the increasingly complex technologies, filling of vias with copper will be required for packaging of the various components. Examples for such via filling applications include next generation radio frequency (RF) filters and multilayer redistribution layers (RDLs). However, the size scales of these applications vary from 100 μm to sub 5 μm. In addition to via filling of different dimensions and aspect ratios, the copper electrodeposition process is also supposed to be able to plate lines and pads within the RDLs. A combination of electrochemical and spectroscopic experiments was applied to optimize organic plating additives with respect to their suitability to deposit copper into this broad variety of structures.

Preparation and Characterization of PbO2 on Aluminum Substrate

2011 ◽  
Vol 399-401 ◽  
pp. 50-54 ◽  
Author(s):  
Bu Ming Chen ◽  
Zhong Cheng Guo ◽  
Hui Huang
Keyword(s):  
Oxygen Evolution Reaction ◽  
Phase Structure ◽  
Lead Nitrate ◽  
Alkaline Solutions ◽  
Electrodeposition Process ◽  
Structure And Property ◽  
Acidic Solutions ◽  
Beta Form ◽  
Nitrate Solutions

The PbO2 film electrodes have been prepared by different electrodeposition process onto aluminum substrate.The electrochemical activity of the electrode for oxygen evolution reaction in 50g•L-1Zn2++150g•L-1H2SO4 solutions have been studied. The results show that the best activity of the electrodes obtained A1/conductive coating was electrodepositing PbO2 in alkaline lead solutions firstly, then plating PbO2 in acidic lead nitrate solutions. This can be attributed to the conductivity of the substrate, the crystal phase structure and property of PbO2. SEM-EDX analysis shows the beta-form, deposited from acidic solutions of Pb(II), has a distorted rutite structure, and the alpha-form, deposited from alkaline solutions, has the spherical cell. The high non- stoichiometry of PbO2 was obtained in alkaline lead solutions.

scholarly journals ELECTRODEPOSITION OF COPPER IN ULTRASONIC FIELD FROM SPENT ETCHING SOLUTIONS

2020 ◽  
Vol 63 (11) ◽  
pp. 71-76
Author(s):  
Maria P. Larionova ◽  
Nina D. Solovieva ◽  
Elena A. Savelieva
Keyword(s):  
Nitric Acid ◽  
Copper Ions ◽  
Nitrate Solution ◽  
Ultrasonic Field ◽  
Initial Time ◽  
Copper Extraction ◽  
Acid Solutions ◽  
Copper Electrodeposition ◽  
Electrodeposition Process ◽  
Nitric Acid Solutions

It is studied the regeneration and utilization possibility of spent nitric acid solutions for copper and its alloys etching for the creating an environmentally clean closed-cycle production of regenerated electrolytes. It is established that some difficulties arise when using the electrochemical method in the regeneration process of these solutions: during copper electrodeposition from spent copper-containing nitric acid solutions, nitric acid decomposes with vigorous evolution of nitrogen dioxide, which prevents copper ions reduction. In order to suppress the side process, it was proposed to partially neutralize the solution, not reaching the pH of copper hydration (pH 4-5). It is revealed that a decrease in the concentration of metal cations occurs due to partial neutralization of the nitric acid contained in the solution by concentrated alkali solution. The pulsed electrolysis mode was used to increase the efficiency of the metal ions electrodeposition process from dilute solutions. It is established that the using of pulsed electrolysis can reduce diffusion difficulties that arise in a dilute spent nitric acid copper-containing solution, thereby intensify the process of copper electrodeposition. It is showed that the prospects of using ultrasound to increase the rate of the copper electrodeposition process and improve the quality of the resulting coating. It is studied the ultrasound field effect on nucleation during copper electrodeposition in a pulsed mode from a partially neutralized electrolyte simulating the spent nitrate solution of etching copper alloys on various materials by the potentiostatic. It is established an increase in the number of copper nucleus that form on the studied substrates (graphite, copper, steel) at the initial time under the action of an ultrasonic field. It is concluded that the use of ultrasound allows to intensify the process of metal electrodeposition. An increase in current efficiency during copper electrodeposition and an increase in the copper extraction degree using ultrasonic field are achieved at lower cathodic current densities in a pulse. It is substantiated using of graphite foil and steel as cathode materials in the copper extraction from the spent nitric acid etching solution.

Theoretical and experimental study of the influence of PEG and PEI on copper electrodeposition

2021 ◽  
Author(s):  
Xingyou Liang ◽  
Xuefeng Ren ◽  
Runshan He ◽  
Tingli Ma ◽  
Anmin Liu
Keyword(s):  
Experimental Study ◽  
Polyethylene Glycol ◽  
Theoretical Calculation ◽  
Experimental Research ◽  
Copper Catalyst ◽  
Copper Electrodeposition ◽  
Acid Electrolyte ◽  
Polyethylene Imine ◽  
Electrodeposition Process

Through theoretical calculation and experimental research, the electrodeposition process of preparing copper catalyst in acid electrolyte with polyethylene glycol (PEG), polyethylene imine (PEI), PEG and PEI mixture as additives was...

The Influence of Poly(ethylene oxide) and Illumination on the Copper Electrodeposition Process onton-Si(100)

2006 ◽  
Vol 110 (42) ◽  
pp. 21109-21117 ◽  
Author(s):  
Eduardo C. Muñoz ◽  
Ricardo S. Schrebler ◽  
Paula K. Cury ◽  
Claudio A. Suárez ◽  
Ricardo A. Córdova ◽  
...  
Keyword(s):  
Ethylene Oxide ◽  
Copper Electrodeposition ◽  
Electrodeposition Process ◽  
Poly Ethylene Oxide ◽  
Poly Ethylene
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