Towards Electrochemical Process Design for the Production of Valeric Acid

2021 ◽  
Vol MA2021-02 (24) ◽  
pp. 784-784
Author(s):  
Roel J.M. Bisselink ◽  
Jacco van Haveren ◽  
Harry J. Bitter
Author(s):  
Rebecca W. Keller ◽  
Carlos Bustamante ◽  
David Bear

Under ideal conditions, the Scanning Tunneling Microscope (STM) can create atomic resolution images of different kinds of samples. The STM can also be operated in a variety of non-vacuum environments. Because of its potentially high resolution and flexibility of operation, it is now being applied to image biological systems. Several groups have communicated the imaging of double and single stranded DNA.However, reproducibility is still the main problem with most STM results on biological samples. One source of irreproducibility is unreliable sample preparation techniques. Traditional deposition methods used in electron microscopy, such as glow discharge and spreading techniques, do not appear to work with STM. It seems that these techniques do not fix the biological sample strongly enough to the substrate surface. There is now evidence that there are strong forces between the STM tip and the sample and, unless the sample is strongly bound to the surface, it can be swept aside by the tip.


2016 ◽  
pp. 3287-3297
Author(s):  
Tarek El Ashram ◽  
Ana P. Carapeto ◽  
Ana M. Botelho do Rego

Tin-bismuth alloy ribbons were produced using melt-spinning technique. The two main surfaces (in contact with the rotating wheel and exposed to the air) were characterized with Optical Microscopy and AFM, revealing that the surface exposed to the air is duller (due to a long-range heterogeneity) than the opposite surface. Also the XPS chemical composition revealed many differences between them both on the corrosion extension and on the total relative amounts of tin and bismuth. For instance, for the specific case of an alloy with a composition Bi-4 wt % Sn, the XPS atomic ratios Sn/Bi are 1.1 and 3.7 for the surface in contact with the rotating wheel and for the one exposed to air, respectively, showing, additionally, that a large segregation of tin at the surface exists (nominal ratio should be 0.073). This segregation was interpreted as the result of the electrochemical process yielding the corrosion products.


2020 ◽  
Vol 40 (6) ◽  
pp. 488-490
Author(s):  
S. Yu. Kalyakulin ◽  
V. V. Kuz’min ◽  
E. V. Mitin ◽  
S. P. Sul’din

Author(s):  
Bhanu Sood ◽  
Michael Pecht

Abstract Failures in printed circuit boards account for a significant percentage of field returns in electronic products and systems. Conductive filament formation is an electrochemical process that requires the transport of a metal through or across a nonmetallic medium under the influence of an applied electric field. With the advent of lead-free initiatives, boards are being exposed to higher temperatures during lead-free solder processing. This can weaken the glass-fiber bonding, thus enhancing conductive filament formation. The effect of the inclusion of halogen-free flame retardants on conductive filament formation in printed circuit boards is also not completely understood. Previous studies, along with analysis and examinations conducted on printed circuit boards with failure sites that were due to conductive filament formation, have shown that the conductive path is typically formed along the delaminated fiber glass and epoxy resin interfaces. This paper is a result of a year-long study on the effects of reflow temperatures, halogen-free flame retardants, glass reinforcement weave style, and conductor spacing on times to failure due to conductive filament formation.


Author(s):  
Hung-Sung Lin ◽  
Ying-Chin Hou ◽  
Juimei Fu ◽  
Mong-Sheng Wu ◽  
Vincent Huang ◽  
...  

Abstract The difficulties in identifying the precise defect location and real leakage path is increasing as the integrated circuit design and process have become more and more complicated in nano scale technology node. Most of the defects causing chip leakage are detectable with only one of the FA (Failure Analysis) tools such as LCD (Liquid Crystal Detection) or PEM (Photon Emission Microscope). However, due to marginality of process-design interaction some defects are often not detectable with only one FA tool [1][2]. This paper present an example of an abnormal power consumption process-design interaction related defect which could only be detected with more advanced FA tools.


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