scholarly journals Fabrication of Spin-Transfer Nano-Oscillator by Colloidal Lithography

2015 ◽  
Vol 2015 ◽  
pp. 1-6
Author(s):  
Bin Fang ◽  
Jiafeng Feng ◽  
Hongxiang Wei ◽  
Xiufeng Han ◽  
Baoshun Zhang ◽  
...  

We fabricate nanoscale spin-transfer oscillators (STOs) by utilizing colloidal nanoparticles as a lithographic mask. By this approach, high quality STO devices can be fabricated, and as an example the fabricated STO devices using MgO magnetic tunnel junction as the basic cell exhibit current-induced microwave emission with a large frequency tunability of 0.22 GHz/mA. Compared to the conventional approaches that involve a step of defining nanoscale elements by means of electron beam lithography, which is not readily available for many groups, our strategy for STO fabrication does not require the sophisticated equipment (~ million dollars per unit) and expensive lithography resist, while being cost-effective and easy to use in laboratory level. This will accelerate efforts to implement STO into on-chip integrated high-radio frequency applications.

SPIN ◽  
2019 ◽  
Vol 09 (03) ◽  
pp. 1940010
Author(s):  
Jiaqi Wei ◽  
Kaihua Cao ◽  
Hushan Cui ◽  
Kewen Shi ◽  
Wenlong Cai ◽  
...  

Owing to improved thermal stability and scalability, materials with perpendicular magnetic anisotropy (PMA) are extremely attractive. The all perpendicular magnetic tunnel junction ([Formula: see text]-MTJ) devices are primarily devoted to spin transfer torque (STT)-induced switching and few works report their microwave emission. Here, we demonstrate the basic results of RF function in nanoscale [Formula: see text]-MTJ which has two different thickness free layers separated by atom-thick tungsten insertion. The ultrathin W spacer layer not only enables the two CoFeB free layers precess as a single layer but also greatly enhances the PMA which further induces high-emission frequency. The all perpendicular spin transfer torque nano-oscillator (STNO) exhibited high frequency (7.6[Formula: see text]GHz) and large current modulation capability of [Formula: see text] at moderate external magnetic field. Along with our previous work on STT switching utilizing the similar stack, such a multifunctional structure could bring low cost solutions to Internet of Things (IoT) network applications.


2021 ◽  
Vol 11 (1) ◽  
Author(s):  
Haoran Wang ◽  
Anton Enders ◽  
John-Alexander Preuss ◽  
Janina Bahnemann ◽  
Alexander Heisterkamp ◽  
...  

Abstract3D printing of microfluidic lab-on-a-chip devices enables rapid prototyping of robust and complex structures. In this work, we designed and fabricated a 3D printed lab-on-a-chip device for fiber-based dual beam optical manipulation. The final 3D printed chip offers three key features, such as (1) an optimized fiber channel design for precise alignment of optical fibers, (2) an optically clear window to visualize the trapping region, and (3) a sample channel which facilitates hydrodynamic focusing of samples. A square zig–zag structure incorporated in the sample channel increases the number of particles at the trapping site and focuses the cells and particles during experiments when operating the chip at low Reynolds number. To evaluate the performance of the device for optical manipulation, we implemented on-chip, fiber-based optical trapping of different-sized microscopic particles and performed trap stiffness measurements. In addition, optical stretching of MCF-7 cells was successfully accomplished for the purpose of studying the effects of a cytochalasin metabolite, pyrichalasin H, on cell elasticity. We observed distinct changes in the deformability of single cells treated with pyrichalasin H compared to untreated cells. These results demonstrate that 3D printed microfluidic lab-on-a-chip devices offer a cost-effective and customizable platform for applications in optical manipulation.


2010 ◽  
Vol 97 (24) ◽  
pp. 242510 ◽  
Author(s):  
H. Liu ◽  
D. Bedau ◽  
D. Backes ◽  
J. A. Katine ◽  
J. Langer ◽  
...  

Nanoscale ◽  
2021 ◽  
Author(s):  
Daniel Sanchez Hazen ◽  
Stephane Auffret ◽  
Isabelle Joumard ◽  
Laurent Vila ◽  
Liliana Buda-Prejbeanu ◽  
...  

This paper reports the first experimental demonstration of a new concept of double magnetic tunnel junction comprising a magnetically switchable assistance layer. These double junctions are used as memory cells...


Author(s):  
Animita Das

Hearing aids are electroacoustic gadgets commonly worn in or behind the ear and are intended to enhance the speech Nowadays hearing aids support various application unlike the traditional ones such that it can act like headphones streaming audio signals from internet-enabled devices connected wirelessly via Bluetooth. This paper aims to review the various advancements in the hearing aid technology. System on chip technology of the microcontroller have been used in various studies to develop and design an effective hearing assistant device and help the people with hearing impairment to lead a normal life. Ten articles have been reviewed for the study and it can be concluded that IoT is the future for an efficient, cost effective hearing assistive system [1]


2010 ◽  
Vol 97 (24) ◽  
pp. 243109 ◽  
Author(s):  
Niklas C. Schirmer ◽  
Jan Hesselbarth ◽  
Stefan Ströhle ◽  
Brian R. Burg ◽  
Manish K. Tiwari ◽  
...  

2018 ◽  
Vol 185 ◽  
pp. 01015
Author(s):  
Niazbeck Useinov

The theoretical model of spin-dependent transport in magnetic tunnel junctions (MTJ) containing magnetic or non-magnetic nanoparticle is developed. The dependences of tunnel magnetoresistance (TMR) and in-plane component of spin transfer torque (STT) on the applied voltage for various sizes of nanoparticles of the order of the mean free path of the conduction electron are calculated. The calculation is performed in the approximation of the ballistic transport of conduction electrons through the insulating layers of the MTJ and the nanoparticles.


Author(s):  
Alessandro Strano ◽  
Carles Hernández ◽  
Federico Silla ◽  
Davide Bertozzi

In the context of multi-IP chips making use of internal communication paths other than the traditional buses, source synchronous links for use in multi-synchronous Networks-on-Chip (NoCs) are becoming the most vulnerable points for correct network operation and therefore need to be safeguarded against intra-link delay variations and signal misalignments. The intricacy of matching link net attributes during placement and routing and the growing role of process parameter variations in nanoscale silicon technologies, as well as the deterioration due to the ageing of the chip, are the root causes for this. This chapter addresses the challenge of designing a timing variation and layout mismatch tolerant link for synchronizer-based GALS NoCs by implementing a self-calibration mechanism. A timing variation detector senses the misalignment, due to process variation and wearout, between data lines with themselves and with the transmitter clock routed with data in source synchronous links. Then, a suitable delayed replica of the transmitter clock is selected for safe sampling of misaligned data. This chapter proves the robustness of the link in isolation with respect to a detector-less link, also addressing integration issues with the downstream synchronizer and switch architecture, proving the benefits in a realistic experimental setting for cost-effective NoCs.


2011 ◽  
Vol 2011 (DPC) ◽  
pp. 001269-001290
Author(s):  
Jeb H. Flemming ◽  
Kevin Dunn ◽  
James Gouker ◽  
Carrie Schmidt

The most singular focus of the electronics industry during the last 50 years has been to miniaturize ICs by miniaturization of transistors and on-chip interconnections. Two major problems are foreseen with this approach; electrical leakage and lack of improved electrical performance beyond 16nm. As a result, industry is transitioning from the current SOC-based approach to a through-silicon-via (TSV) based 3D IC-stacked approach. However, a major challenge remains; these 3D ICs need to be interconnected to other ICs with a much higher number of I/Os than are available with current ceramic or organic interposers. While silicon interposers currently in development can provide these high I/Os, they cannot do so at low enough cost. In this talk, we will present on our efforts in glass interposers fabrication. Glass interposers possess many advantages over silicon interposers including: cost, production time, and scale. Life MicroFab's APEX™ Glass ceramic is a photo-sensitive material used to create high density arrays of through glass vias (TGVs) using three simple processing steps: exposure, baking, and etching. To date, we have been successful in producing large arrays of 12 micron diameter TGVs, with 14 micron center-to-center pitchs, in 125 micron thick APEX™ Glass ceramic. We will present (1) on our efforts producing high aspect ratio TGVs in thin (500-250 micron) and ultra thin (250-75 micron) APEX™ Glass ceramic wafers, (2) maximum TGV aspect ratios, and (3) TGV fidelity and limits of manufacturing.


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