scholarly journals Multi-level modeling of woven glass/epoxy composite for multilayer printed circuit board applications

2014 ◽  
Vol 51 (21-22) ◽  
pp. 3679-3688 ◽  
Author(s):  
Zhuo Chen ◽  
Fan Yang ◽  
S.A. Meguid
Keyword(s):  
Printed Circuit Board ◽  
Epoxy Composite ◽  
Circuit Board ◽  
Printed Circuit ◽  
Multi Level

Development of Epoxy/BN Composites with High Thermal Conductivity for Metal-Core Printed Circuit Board (MCPCB)

2015 ◽  
Vol 749 ◽  
pp. 290-294
Author(s):  
Jae Hyun Choi ◽  
Bong Goo Choi ◽  
Min A. Lee ◽  
Jae Sik Na
Keyword(s):  
Thermal Conductivity ◽  
Printed Circuit Board ◽  
Epoxy Composite ◽  
High Thermal Conductivity ◽  
Circuit Board ◽  
Epoxy Composites ◽  
Hot Press ◽  
Metal Core ◽  
Printed Circuit ◽  
Press Method

The epoxy composites with high thermal conductivity for metal-core printed circuit board (MCPCB) can be prepared by varnish coating and a hot press method. Alumina filler of plate-like shape was used as primary micro-filler, while plate-like alumina filler, h-BN, a-BN and s-BN filler were used for blending into the plate-like alumina filler as the secondary filler. Results showed that the secondary fillers a-BN and s-BN loaded epoxy composites have higher thermal conductivity than alumina filler single-loaded composites. Also, BN filler has high thermal conductivity, but h-BN filled epoxy composite has lower thermal conductivity than alumina filled epoxy composite. The decrease of voids in epoxy composite are very important, and the filler shape and surface modification is also necessary to achieve high thermal conductivity in epoxy composite for MCPCB

scholarly journals Evaluation of Printed-Circuit Board Materials for High-Temperature Operation

2017 ◽  
Vol 14 (4) ◽  
pp. 166-171
Author(s):  
Oriol Aviño-Salvado ◽  
Wissam Sabbah ◽  
Cyril Buttay ◽  
Hervé Morel ◽  
Pascal Bevilacqua
Keyword(s):  
High Temperature ◽  
Printed Circuit Board ◽  
Epoxy Composite ◽  
Circuit Board ◽  
Printed Circuit ◽  
Physical Measurements ◽  
Epoxy Material ◽  
High Temperature Operation

This article presents the long-term (1,000 h) behavior of two printed-circuit board materials (Panasonic R1755V, a high-TG glass-epoxy composite and Arlon 85N, a polyimide-based laminate) stored at high temperature (190°C). Tests are performed in air and in nitrogen atmospheres. Electrical and physical measurements are performed regularly (once per week). Almost no degradation is observed for both materials when stored in nitrogen. On the contrary, the board stored in air shows the consequences of ageing. This is especially true for the glass-epoxy material, which becomes unusable after 2 w, because of large swelling.

Characteristics of Radiated Emission from a Printed Circuit Board with a Slit

2012 ◽  
Vol 132 (6) ◽  
pp. 404-410 ◽  
Author(s):  
Kenichi Nakayama ◽  
Kenichi Kagoshima ◽  
Shigeki Takeda
Keyword(s):  
Printed Circuit Board ◽  
Circuit Board ◽  
Printed Circuit ◽  
Radiated Emission

Confirming the Signal Integrity in Transmission of Digital Signals on Microstrip Straight Circuits via the Eye Diagrams

2014 ◽  
Vol 5 (1) ◽  
pp. 737-741
Author(s):  
Alejandro Dueñas Jiménez ◽  
Francisco Jiménez Hernández
Keyword(s):  
Integrated Circuits ◽  
Printed Circuit Board ◽  
Signal Integrity ◽  
High Volume ◽  
Information Storage ◽  
Circuit Board ◽  
Electromagnetic Simulation ◽  
Electronic Systems ◽  
Digital Signals ◽  
Printed Circuit

Because of the high volume of processing, transmission, and information storage, electronic systems presently requires faster clock speeds tosynchronizethe integrated circuits. Presently the “speeds” on the connections of a printed circuit board (PCB) are in the order of the GHz. At these frequencies the behavior of the interconnects are more like that of a transmission line, and hence distortion, delay, and phase shift- effects caused by phenomena like cross talk, ringing and over shot are present and may be undesirable for the performance of a circuit or system.Some of these phrases were extracted from the chapter eight of book “2-D Electromagnetic Simulation of Passive Microstrip Circuits” from the corresponding author of this paper.

Root Cause Analysis of a Connector Time-Delayed Fracture

2015 ◽  
Author(s):  
Prabjit Singh ◽  
Ying Yu ◽  
Robert E. Davis
Keyword(s):  
Printed Circuit Board ◽  
Ceramic Substrate ◽  
Circuit Board ◽  
Delayed Fracture ◽  
Ceramic Substrates ◽  
Printed Circuit ◽  
Root Cause ◽  
Chip Carrier ◽  
Electrical Connections ◽  
Grain Boundary Grooves

Abstract A land-grid array connector, electrically connecting an array of plated contact pads on a ceramic substrate chip carrier to plated contact pads on a printed circuit board (PCB), failed in a year after assembly due to time-delayed fracture of multiple C-shaped spring connectors. The land-grid-array connectors analyzed had arrays of connectors consisting of gold on nickel plated Be-Cu C-shaped springs in compression that made electrical connections between the pads on the ceramic substrates and the PCBs. Metallography, fractography and surface analyses revealed the root cause of the C-spring connector fracture to be plating solutions trapped in deep grain boundary grooves etched into the C-spring connectors during the pre-plating cleaning operation. The stress necessary for the stress corrosion cracking mechanism was provided by the C-spring connectors, in the land-grid array, being compressed between the ceramic substrate and the printed circuit board.

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