Evaluation of response characteristics of thin film gauge for conductive heat transfer mode

2020 ◽  
pp. 014233122096066
Author(s):  
Tanweer Alam ◽  
Rakesh Kumar
Keyword(s):  
Thin Film ◽  
Heat Transfer ◽  
Heat Flux ◽  
Short Duration ◽  
Temperature Data ◽  
Heat Transfer Analysis ◽  
Transient Temperature ◽  
Conductive Heat ◽  
Sensing Element ◽  
Element Analysis

Heat transfer analysis is the one of the most important designing aspects for many engineering systems. The design prospect in the preview of heat transfer focuses on the prediction of heat flux with the help of measured transient temperature data. Thin film gauges are one of the most predominant method for the heat flux prediction especially for short duration transient temperature measurement. Thin film gauges are usually exposed to the heated environment for the measurement purpose. However, there are some prominent research areas like ablation phenomenon met to spacecraft thermal shields during re-entry to the atmosphere, for which direct exposure of the thin film gauge to the heated environment causes the functional and working difficulties associated with the gauge. In the present study, it is aimed to investigate the suitability of thin film gauge for the conduction-based short duration measurement. An experimental set up is fabricated, which is used to supply the heat load to the hand-made thin film gauge using platinum as sensing element and quartz as a substrate. The transient temperature data is recorded during experiment is further compared with the simulated temperature histories obtained through finite element analysis. The heat flux estimation for both the analysis is made using measured transient temperature data by convolute integral of one- dimensional heat conduction equation. The estimated heat flux value for the experimental and numerical result is found to be in excellent agreement.

scholarly journals Dynamic calibration of temperature sensors from light rays for transient measurement

2019 ◽  
Vol 23 (3 Part B) ◽  
pp. 1901-1910
Author(s):  
Rishikesh Goswami ◽  
Rakesh Kumar
Keyword(s):  
Thin Film ◽  
Heat Transfer ◽  
Numerical Simulation ◽  
Heat Flux ◽  
Short Duration ◽  
Surface Heat ◽  
Heat Fluxes ◽  
Transient Temperature ◽  
Element Analysis ◽  
Radiation Mode

Measurement of transient heat fluxes in the applications involving very short duration of a heating environment which has been promised for the candidate by measurement of surface heating rates with thin film gauges (TFG). They are basically resistance temperature detectors having to measure in a very short duration of time. In the present study, a platinum based TFG has been fabricated and dynamically calibrated (radiation based) in the laboratory with a view to assessing the performance of platinum thin film gauges (PTFG) in the dynamic environment. These examinations are focusing to explore the probability of using TFG for small duration transient measurements with pure radiation mode of heat transfer. Radiation based heat flux is applied on the gauge by using the halogen bulb in a square box and its response is obtained through measured transient temperature. Subsequently, the surface heat fluxes are estimated by using radiation-based heat transfer. The purpose of this work is to statically calibrate each handmade heat transfer gauges by using quartz as substrate material deposited on platinum paste. This experiment has been carried out by oil bath based experimental technique. The similar experimental environment is also studied to observe the transient temperature response by using numerical simulation. The experiments are carried out by exposing the platinum TFG to various known step heat load of known input wattage, for the duration of 10 seconds. Then, the voltage signals are recorded due to change in temperature of air-flow past the TFG. The numerical simulation (ANSYS-Fluent v. 14.5) is performed in the similar experimental environmental conditions, for the same heating loads. Experimentally recorded temperature signals from the gauges are compared with simulated temperature histories obtained through finite element analysis. Cubic spline methods of the 1-D heat conduction equation are used to predict surface heat flux and compared with input heat loads. The presently developed calibration set-up is seen to very useful for radiation-based measurements of TFG.

Approach to Heat Transfer Mechanism Beneath Boiling Bubble With MEMS Sensor

2009 ◽  
Author(s):  
Tomohide Yabuki ◽  
Osamu Nakabeppu
Keyword(s):  
Thin Film ◽  
Heat Transfer ◽  
Heat Flux ◽  
Heated Surface ◽  
Bubble Nucleation ◽  
Temperature Data ◽  
Heated Wall ◽  
Measured Temperature ◽  
Back Side ◽  
Mems Sensor

Temperature variation beneath isolated bubble during saturated boiling of water was measured with a MEMS (Micro-Electro-Mechanical Systems) sensor having high temporal and spatial resolution. Then, local heat transfer from the heated surface was evaluated by a transient heat conduction analysis of the wall with measured temperature data as a boundary condition. The MEMS sensor on a 20 × 20 mm2 silicon substrate includes an electrolysis trigger and eight thin film thermocouples on the top side, and two thin film heaters on the back side. The thin film thermocouple was calibrated with a thermal scan method using two alloy samples with different melting point. The condition of the sensor was smoothly controlled with the heater. The bubble is initiated with electrolysis at a gap of the trigger electrode, where slight hydrogen gasses are supplied as bubble nuclei. Then, local and fast temperature variations in wide region are measured with the thermocouples with cutoff frequency of 100 kHz arranged in a line at 40 – 2000 μm far from the trigger gap. Measured temperature data presents formation of microlayer and expansion of dryout area in bubble growth process and rewetting in bubble departure process. The numerical analysis showed that average heat flux beneath the bubble indicated the maximum value of 19 W/cm2 during the microlayer evaporation, and then after hitting a bottom slightly lower than a heat flux at the bubble nucleation, recovers to the nucleation level. The contribution of the heat transfer from the heated wall was evaluated to approximately one-fourth of latent heat in the bubble at departure.

Thin-Film Heat-Flux Microsensor for Heat-Transfer Measurement in Micro-Heat Exchangers/Microreactors

2012 ◽  
Author(s):  
Houssein Ammar ◽  
David Hamadi ◽  
Bertrand Garnier ◽  
Ahmed Ould El Moctar ◽  
Hassan Peerhossaini ◽  
...  
Keyword(s):  
Thin Film ◽  
Heat Transfer ◽  
Heat Flux ◽  
Heat Exchangers ◽  
Measurement Techniques ◽  
Heat Transfer Analysis ◽  
Heat Flux Sensor ◽  
Transfer Measurement ◽  
Heat Transfer Measurement ◽  
Flux Sensor

Heat-transfer analysis in microfluidic devices is of great importance in applications such as micro-heat exchangers and microreactors. This work reports on improvements in temperature measurement techniques, which can be the source of large errors due to their intrusiveness and the unreliability of conventional thermal sensors. Gold thin films were deposited on a borosilicate substrate to realize a 2D heat flux sensor for heat-transfer measurement along the main flow within microchannels. Two applications are shown, one related to micro-heat exchangers and the other to microreactors. For the micro-heat exchanger, the effect of length scale on heat transfer in a straight microchannel was investigated and the validity of macroscale correlations for convective heat transfer was checked for deionized water flowing in microchannels of heights 12 to 52 μm. For the microreactor, the reaction enthalpy of an acid–base reaction measured using the new heat-flux sensor had only a 5% discrepancy from the standard value, showing the efficiency of the new thin-film device.

Effective Thermal Diffusivity of Porous Media in the Wall Vicinity

2005 ◽  
Author(s):  
Hitoshi Sakamoto ◽  
Francis A. Kulacki
Keyword(s):  
Heat Transfer ◽  
Porous Medium ◽  
Thermal Diffusivity ◽  
Interstitial Fluid ◽  
Saturated Porous Medium ◽  
Heat Transfer Analysis ◽  
Transient Temperature ◽  
Conductive Heat ◽  
Particulate Solid ◽  
Near Wall

Transient conduction on a vertical, constant heat flux surface in a saturated porous medium is studied experimentally and analytically with a focus on determining near-wall thermal diffusivity. For combinations of different particulate solid and interstitial fluid, which give a range of conductivity ratios, ks/kf, from 0.5 to 2400, the present study finds that early-time transient temperature profiles can be analytically predicted using the thermal conductivity of the interstitial fluid because the near-wall porosity approaches 1.0. The conjugate heat transfer analysis accurately predicts the time the conductive front takes to travel through the impermeable wall. The present study also finds that conductive heat transfer along the wall is dependent on the wall thickness and must be taken into account when assessing measurement of local and overall Nusselt numbers. The present results raise the possibility of reinterpretation of much of the porous medium heat transfer experiments that make up the current database.

Effects of Thin Film Heat Spreader on Hot Spots Mitigation in Heat Sinks

2021 ◽  
pp. 1-17
Author(s):  
Sohail Reddy ◽  
George S. Dulikravich ◽  
Ann-Kayana Blanchard
Keyword(s):  
Thin Film ◽  
Heat Transfer ◽  
Heat Flux ◽  
Integrated Circuit ◽  
Conjugate Heat Transfer ◽  
Hot Spot ◽  
Heat Transfer Analysis ◽  
Temperature Uniformity ◽  
Heat Spreader ◽  
Heat Spreaders

Abstract The effects of graphene platelets and diamond based thin film heat spreaders on maximum temperature of integrated electronic circuits were investigated. A fully three-dimensional conjugate heat transfer analysis was performed to investigate the effects of thin film material and thickness on the temperature of a hot spot and temperature uniformity on the heated surface of the integrated circuit when subjected to forced convective cooling. Two different materials, diamond and graphene were simulated as materials for thin films. The thin film heat spreaders were applied to the top wall of an array of micro pin-fins having circular cross sections. The integrated circuit with a 4 × 3 mm footprint featured a 0.5 × 0.5 mm hot spot located on the top wall which was also exposed to a uniform background heat flux of 500 W cm−1. A hot spot uniform heat flux of magnitude 2000 W cm−2 was centrally situated on the top surface over a small area of 0.5 × 0.5 mm. Both isotropic and anisotropic properties of the thin film heat spreaders made of graphene platelets and diamond were computationally analyzed. The conjugate heat transfer analysis incorporated thermal contact resistance between the thin film and the silicon substrate. The isotropic thin film heat spreaders significantly reduced the hot spot temperature and increased temperature uniformity, allowing for increased thermal loads. Furthermore, it was found that thickness of the thin film heat spreader need not be greater than a few tens of microns

High-output diesel engine heat transfer: Part 1 - comparison between piston heat flux and global energy balance

2021 ◽  
pp. 146808742110170
Author(s):  
Eric Gingrich ◽  
Michael Tess ◽  
Vamshi Korivi ◽  
Jaal Ghandhi
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Diesel Engine ◽  
Surface Temperature ◽  
Fast Response ◽  
Temperature Data ◽  
Start Of Injection ◽  
Local Measurements ◽  
Surface Temperature Data ◽  
High Output

High-output diesel engine heat transfer measurements are presented in this paper, which is the first of a two-part series of papers. Local piston heat transfer, based on fast-response piston surface temperature data, is compared to global engine heat transfer based on thermodynamic data. A single-cylinder research engine was operated at multiple conditions, including very high-output cases – 30 bar IMEPg and 250 bar in-cylinder pressure. A wireless telemetry system was used to acquire fast-response piston surface temperature data, from which heat flux was calculated. An interpolation and averaging procedure was developed and a method to recover the steady-state portion of the heat flux based on the in-cylinder thermodynamic state was applied. The local measurements were spatially integrated to find total heat transfer, which was found to agree well with the global thermodynamic measurements. A delayed onset of the rise of spatially averaged heat flux was observed for later start of injection timings. The dataset is internally consistent, for example, the local measurements match the global values, which makes it well suited for heat transfer correlation development; this development is pursued in the second part of this paper.

Transient Temperature and Heat Flux Measurement in Ultrasonic Joining of Battery Tabs Using Thin-Film Microsensors

2013 ◽  
Vol 135 (5) ◽  
Author(s):  
Hang Li ◽  
Hongseok Choi ◽  
Chao Ma ◽  
Jingzhou Zhao ◽  
Hongrui Jiang ◽  
...  
Keyword(s):  
Thin Film ◽  
Heat Flux ◽  
Heat Generation ◽  
Welding Process ◽  
Ultrasonic Welding ◽  
Transient Temperature ◽  
Monitoring And Control ◽  
Change Rate ◽  
Flux Change ◽  
And Control

Process physics understanding, real time monitoring, and control of various manufacturing processes, such as battery manufacturing, are crucial for product quality assurance. While ultrasonic welding has been used for joining batteries in electric vehicles (EVs), the welding physics, and process attributes, such as the heat generation and heat flow during the joining process, is still not well understood leading to time-consuming trial-and-error based process optimization. This study is to investigate thermal phenomena (i.e., transient temperature and heat flux) by using micro thin-film thermocouples (TFTC) and thin-film thermopile (TFTP) arrays (referred to as microsensors in this paper) at the very vicinity of the ultrasonic welding spot during joining of three-layered battery tabs and Cu buss bars (i.e., battery interconnect) as in General Motors's (GM) Chevy Volt. Microsensors were first fabricated on the buss bars. A series of experiments were then conducted to investigate the dynamic heat generation during the welding process. Experimental results showed that TFTCs enabled the sensing of transient temperatures with much higher spatial and temporal resolutions than conventional thermocouples. It was further found that the TFTPs were more sensitive to the transient heat generation process during welding than TFTCs. More significantly, the heat flux change rate was found to be able to provide better insight for the process. It provided evidence indicating that the ultrasonic welding process involves three distinct stages, i.e., friction heating, plastic work, and diffusion bonding stages. The heat flux change rate thus has significant potential to identify the in-situ welding quality, in the context of welding process monitoring, and control of ultrasonic welding process. The weld samples were examined using scanning electron microscopy (SEM) and energy dispersive X-ray spectroscopy (EDS) to study the material interactions at the bonding interface as a function of weld time and have successfully validated the proposed three-stage welding theory.

Heat Transfer Analysis of Laminar Pulsating Flow in a Rectangular Channel Using Infrared Thermography

2021 ◽  
Author(s):  
Richard Blythman ◽  
Sajad Alimohammadi ◽  
Nicholas Jeffers ◽  
Darina B. Murray ◽  
Tim Persoons
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Analytical Solution ◽  
Local Time ◽  
Rectangular Channel ◽  
Pulsating Flow ◽  
Time Dependent ◽  
Heat Transfer Analysis ◽  
Flux Boundary Condition ◽  
Hydrodynamic Behaviour

Abstract While numerous applied studies have successfully demonstrated the feasibility of unsteady cooling solutions, a consensus has yet to be reached on the local instantaneous conditions that result in heat transfer enhancement. The current work aims to experimentally validate a recent analytical solution (on a local time-dependent basis) for the common flow condition of a fully-developed incompressible pulsating flow in a uniformly-heated vessel. The experimental setup is found to approximate the ideal constant heat flux boundary condition well, especially for the decoupled unsteady scenario where the amplitude of the most significant secondary contributions (capacitance and lateral conduction) amounts to 1.2% and 0.2% of the generated heat flux, respectively. Overall, the experimental measurements for temperature and heat flux oscillations are found to coincide well with a recent analytical solution to the energy equation by the authors. Furthermore, local time-dependent heat flux enhancements and degradations are observed to be qualitatively similar to those of wall shear stress from a previous study, suggesting that the thermal performance is indeed influenced by hydrodynamic behaviour.

Heat transfer at the step of a CANDU calandria during a severe accident

Kerntechnik ◽  
2021 ◽  
Vol 86 (5) ◽  
pp. 338-342
Author(s):  
R. David
Keyword(s):  
Heat Transfer ◽  
Finite Element Analysis ◽  
Heat Flux ◽  
Annular Plate ◽  
Welded Joint ◽  
Severe Accident ◽  
Local Concentration ◽  
Element Analysis ◽  
Surrounding Water ◽  
Decay Heat

Abstract During the in-vessel stage of a severe accident in a CANDU 6 reactor, decay heat from a collapsed core would be rejected through the calandria walls into the surrounding water. At the step in the calandria wall, the subshell and annular plate meet at a right angle pointing into the calandria. The geometry at this joint could concentrate the exiting heat flux, potentially leading to calandria failure. Finite element analysis is used to study the heat transfer near the welded joint. Different weld profiles, boundary conditions, and decay heat characteristics are considered, and the local concentration of exiting heat flux is calculated.

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