2019 ◽  
pp. 110-115
Author(s):  
L. M. Mironovich ◽  
A. Yu. Eliseev ◽  
A. Yu. Eliseeva

The paper studies complex effect of various factors on the process of cleaning brass brand L-68, used for the manufacture of heat exchange equipment. It has been established that acids of various strengths can be used as working solutions. The speed of the cleaning process depends on the nature of the acid and its initial concentration. For strong acids, a working solution with low concentration is recommended, followed by an increase in their concentration during the cleaning process. Additional input of oxygen into the system and an increase of the working solution temperature increase the cleaning rate of brass. The cleaning process proceeds without significant changes in the surface configuration, and, consequently, the expenditure of metal.


Author(s):  
Christian Frilund ◽  
Esa Kurkela ◽  
Ilkka Hiltunen

AbstractFor the realization of small-scale biomass-to-liquid (BTL) processes, low-cost syngas cleaning remains a major obstacle, and for this reason a simplified gas ultracleaning process is being developed. In this study, a low- to medium-temperature final gas cleaning process based on adsorption and organic solvent-free scrubbing methods was coupled to a pilot-scale staged fixed-bed gasification facility including hot filtration and catalytic reforming steps for extended duration gas cleaning tests for the generation of ultraclean syngas. The final gas cleaning process purified syngas from woody and agricultural biomass origin to a degree suitable for catalytic synthesis. The gas contained up to 3000 ppm of ammonia, 1300 ppm of benzene, 200 ppm of hydrogen sulfide, 10 ppm of carbonyl sulfide, and 5 ppm of hydrogen cyanide. Post-run characterization displayed that the accumulation of impurities on the Cu-based deoxygenation catalyst (TOS 105 h) did not occur, demonstrating that effective main impurity removal was achieved in the first two steps: acidic water scrubbing (AWC) and adsorption by activated carbons (AR). In the final test campaign, a comprehensive multipoint gas analysis confirmed that ammonia was fully removed by the scrubbing step, and benzene and H2S were fully removed by the subsequent activated carbon beds. The activated carbons achieved > 90% removal of up to 100 ppm of COS and 5 ppm of HCN in the syngas. These results provide insights into the adsorption affinity of activated carbons in a complex impurity matrix, which would be arduous to replicate in laboratory conditions.


2019 ◽  
Vol 63 (4) ◽  
pp. 255-267 ◽  
Author(s):  
Yamina Leila Rouabhi ◽  
Philippe Grosjean ◽  
Zitouni Boutiba ◽  
Omar Rouane Hacene ◽  
Jonathan Richir

2021 ◽  
Vol 539 ◽  
pp. 148057
Author(s):  
Shuowen Zhang ◽  
Qingyu Yan ◽  
Jian Lin ◽  
Qunli Zhang ◽  
Yongfeng Lu ◽  
...  

Chemosphere ◽  
2021 ◽  
pp. 130891
Author(s):  
S.A. Gokulakrishnan ◽  
G. Arthanareeswaran ◽  
Laszlo Zsuzsanna ◽  
Gábor Veréb ◽  
Szabolcs Kertész ◽  
...  

2019 ◽  
Vol 92 (2) ◽  
pp. 157-164 ◽  
Author(s):  
Nagendra Prasad Yerriboina ◽  
Samrina Sahir ◽  
So-Young Han ◽  
Kwang-Min Han ◽  
Jin-Goo Park

2006 ◽  
Vol 527-529 ◽  
pp. 875-878 ◽  
Author(s):  
Seung Yong Lee ◽  
Jang Sub Lee ◽  
Tae Hong Kim ◽  
Sung Yong Choi ◽  
Hak Jong Kim ◽  
...  

We report on the die bonding processes and how the surface roughness and metallization schemes affect the processes of die bonding in 4H-SiC device fabrication using a soldering test and die shear test (DST) with differently prepared 4H-SiC samples. The first set of samples (FZ#1 and FZ#2) was capped with sequentially evaporated Ti and Au on an annealed Ni layer. The second set of samples (FZ#3 and FZ#4) and the third set of samples (FZ#5 and FZ#6) were prepared by 4μm-thick Au electroplating on an annealed Ni layer and an un-annealed Ni layer, respectively. The quality of the soldering, such as the solder coverage, void, and adhesion, was characterized by optical microscope, X-ray microprobe, and DST. We found that the samples (FZ#4 and FZ#6) deposited by Au electroplating on C-face (bottom-side) 4H-SiC provided a satisfactory result for the tests of solder coverage, void, and DST and also realized the cleaning process prior to the electroplating and soldering was the most crucial in the die packaging processes of vertical structure devices. The void fraction measured by X-ray microprobe for the samples, FZ#4 and FZ#6 was 2.2% (average for 5 samples) and 0.8% (average for 3 samples), respectively.


Sign in / Sign up

Export Citation Format

Share Document